micro-chevron tip dark area is bonded interface crack unpatterned wafer patterned wafer mouth Force Figure 1

ls = 0.010 m ws = 0.001 m ch = 0.005 m dh = 0.001 m Figure 2a

Force micro-chevron tip dark area is bonded interface hole for mounting to materials testing machine Force Figure 2b

crack bonded β B region aj W load line bond plane A0 a H wLL w unpatterned wafer bond plane b) patterned wafer A0 a H wLL w Figure 3

(a) Successful Test (b) Unsuccessful Test Figure 4 Change caption to read: Typical (a) successful and (b) unsuccessful microchevron tests. The vertical drop-off of the unsuccessful test typically represents the measurement of another failure mechanism, for example if one of the two chips breaks. (b) Unsuccessful Test Figure 4