North America Physical Interfaces & Carriers Committee PI&C Liaison Report Japan Spring 2009 Standards Meetings

Leadership Committee Co-chairs Technical Architect Mutaz Haddadin / Intel Stephen Sumner / Entegris The NA PIC is currently looking for a co-chair to succeed Stephen Sumner. The committee requests that the candidate be from the supplier community to maintain balance in leadership. Technical Architect Open April 2009 NA PIC Report to JA PIC

Current Committee Structure Physical Interfaces & Carriers Committee C: Mutaz Haddadin / Intel C: Stephen Sumner / Entegris Integrated Measurement Module - PIC TF L: Len Kamlet / MKS Instruments EUV Reticle Handling TF L: Long He – Sematech / Intel L: David Halbmaier – Entegris L: Yoshio Gomei – Canon L: John Zimmerman – ASML Global PIC Maintenance TF L: John Davies / TD Systems 450 mm IPIC TF L: Mutaz Haddadin / Intel L: Shoji Komatsu / Acteon RFID Tag Implementation TF L: Win Baylies / BayTech Group Int’l 300 mm Wafer Shipping Box TF L: Louise Courtois / IBM L: Harry Lawrence / Entegris Int’l E84 Revision TF L: Jan Rothe / AMD L: Mikio Otani / Asyst Japan 450mm Wafer Shipping Box TF (New) L: Ram Patel / Intel L: Eric Olson / Entegris 450mm ATDP TF (New) L: John Rudolph / Intel April 2009 NA PIC Report to JA PIC

Meeting Information Last meeting Next meeting 2009/04/01 at NA 2009 Spring Meetings Milpitas, CA Next meeting 2009/07/16 at SEMICON West 2009 San Francisco, CA April 2009 NA PIC Report to JA PIC

Ballot Results Summary Cycle 1-09 New Standard: Mechanical Specification of EUV Pod for 150 mm EUVL Reticles Passed with editorial changes 4570 New Standard: Preliminary Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 Foup) and Kinematic Coupling Failed and returned to tf 4598 Revision to SEMI E84, Specification for Enhanced Carrier Handoff Parallel I/O Interface 4599 New Standard: Mechanical Interface Specification for 450 mm Load Port 4705 Reapproval of SEMI E110, Guide for Indicator Placement Zone and Switch Placement Volume of Load Port Operation Interface for 300 mm Load Ports Passed as balloted 4706 Reapproval of SEMI E19.4, 200 mm Standard Mechanical Interface (SMIF) 4707 Reapproval of SEM E92, Specification for 300 mm Light Weight and Compact Box Opener/Loader to Tool-Interoperability Standard (BOLTS/LIGHT) April 2009 NA PIC Report to JA PIC

Upcoming Ballots Cycle 4-09 4570 New Standard: Preliminary Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 Foup) and Kinematic Coupling 450mm IPIC TF 4598 Revision to SEMI E84, Specification for Enhanced Carrier Handoff Parallel I/O Interface Intl E84 Revision TF 4599 New Standard: Mechanical Interface Specification for 450 mm Load Port 4688 New Standard: Mechanical Specification for 450mm AMHS Stocker to Transport Interface April 2009 NA PIC Report to JA PIC

Task Force Reports E84 Revision TF EUV Reticle Handling TF EUV Pod ballot (#4466B) passed committee review with editorial changes E84 Revision TF E84 Revision ballot (#4598) failed committee review, returned to task force Follow-up ballot expected for Cycle 4 April 2009 NA PIC Report to JA PIC

Task Force Reports [continued] Global PIC Maintenance Task Force TF ballot actions for additional PIC standards due for 5-Year Review were approved: 4705: E110 (300mm LP - Indicator Placement Zone & Switch Placement Volume) 4706: E19.4 (200mm SMIF) 4707: E92 (300mm BOLTS Light) TF will now focus on consolidation of E1 standards SEMI E1.9 will not be included in consolidation April 2009 NA PIC Report to JA PIC

Task Force Reports [continued] International 450mm PIC TF Ballots for 450mm Carrier (4570) and 450mm Loadport (4599) failed and returned to task force; follow-ups expected for cycle 4-09 Info Ballot for 450mm Stocker Interface (4688 blue) issued; tech ballot expected for cycle 4-09 TF asked committee for formal decision on 12mm wafer pitch for 450mm FOUP. The committee approved this value. Letter sent to ISMI on behalf of the task force April 2009 NA PIC Report to JA PIC

Task Force Reports [continued] 450mm Shipping Box TF TFOF & SNARF approved by GCS; first face-to-face meeting held at Spring Meetings 450mm Assembly Test Die Prep (ATDP) Task Force TFOF approved at Spring Meetings April 2009 NA PIC Report to JA PIC

SEMICON West 2009 Meeting Schedule (tentative) Monday July 13 0800-1700: Intl 450mm Physical Interfaces & Carriers Task Force Tuesday July 14 Wednesday July 15 0800-1700: NA 450mm Shipping Box Task Force 0800-0900: Global PIC Maintenance Task Force 1000-1200: Intl E84 Revision Task Force 1300-1700: NA 450mm Assembly Test Die Prep Task Force Thursday July 16 0800-1200: NA PIC Committee Meeting April 2009 NA PIC Report to JA PIC

Thank you! For more information, please contact: Ian McLeod, SEMI Standards North America 1.408.943.6996 imcleod@semi.org April 2009 NA PIC Report to JA PIC