Interleaver Performance Comparison of Winbond and TGn Sync September 2004 doc.: IEEE 802.11-04/934r0 October 2004 Interleaver Performance Comparison of Winbond and TGn Sync (Other documents: 11-04-934/r2, 1026/r0, 1105/r0 ) Jeng-Hong Chen (jhchen2@winbond.com) Pansop Kim (pkim@winbond.com) Winbond Wireless Design Center Torrance, CA, USA September 2004 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

Differences between 1163/r1 and 1163/r0 October 2004 Differences between 1163/r1 and 1163/r0 The simulation results in 20MHz and 40MHz are exactly the same for 1163/r1 and 1164/r0. The simulation results for 40 MHz with 108 tones have typos on the Legends. For example, the data rate is 2x54Mbps for a 2x2 MIMO system in 20MHz with 48 data tones. The data rate becomes 2x121.5=243Mbps for a 2x2 MIMO system in 40MHz with 108 data tones. Sorry for the typos. Jeng-Hong Chen, Pansop Kim, Winbond Electronics

Simulation Parameters (based on 11a) September 2004 doc.: IEEE 802.11-04/934r0 October 2004 Simulation Parameters (based on 11a) 2X2, 3X3, 4X4 antennas IEEE 11n Channel Models B and E (20MHz) 64-pt FFT (48 data tones) and (40MHz) 128-pt FFT (108 data tones) 10% PER over 1000 simulated packets 1000 un-coded bytes per packet Perfect CSI, Perfect AFC, AGC, ACQ No pulse shaping filter, no ADC/DAC CC rates=1/3,1/2, 2/3,3/4,7/8 from ½ CC code (K=7) 16QAM, 64QAM 24, 36, 48, 54,63 Mbps per transmit antenna for 20MHz MIMO 54, 81,108, 121.5,141.75 Mbps per transmit antenna for 40MHz MIMO MMSE Receiver TX and RX antenna spacing: 0.5 wavelength Jeng-Hong Chen, Pansop Kim, Winbond Electronics

3D-A vs. TGn Sync in 20MHz BW 20 MHz (48 data subcarriers) October 2004 3D-A vs. TGn Sync in 20MHz BW 20 MHz (48 data subcarriers) 3D-A: Ncolumn=16, Nrow=3 subcarriers TGn Sync Jeng-Hong Chen, Pansop Kim, Winbond Electronics

TGn Sync Interleaver (IEEE 802.11-04/889r0) October 2004 TGn Sync Interleaver (IEEE 802.11-04/889r0) Ex. 20 MHz, NBPSC=1, NI=4, NCBPS=48, Ncolumn=16 Note: NSS=4 in the definition of above document. j  1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 … 47 k, OFDM 0 64 128 68 132 72 136 76 140 16 80 144 20 188 k, OFDM 1 61 125 189 65 129 69 133 73 137 77 141 17 185 k, OFDM 2 58 122 186 62 126 190 66 130 70 134 74 138 182 k, OFDM 3 55 119 183 59 123 187 63 127 191 67 131 71 135 179 Adjacent bits (ex. A(0), A(1), …, A(11)) are not evenly distributed over all subcarriers Adjacent bits (ex. A(3),A(6),A(9),A(12)) are assigned to the same subcarrier. Winbond proposed 3D Joint Interleaver, NBPSC=1, NI=4, NCBPS=48, Ncolumn=16 j  1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 … k, OFDM 0 64 128 17 81 145 34 98 162 51 115 179 68 132 21 k, OFDM 1 16 80 144 33 97 161 50 114 178 67 131 20 84 148 37 k, OFDM 2 32 96 160 49 113 117 66 130 19 83 147 36 100 164 53 k, OFDM 3 48 112 176 65 129 18 82 146 35 99 163 52 116 180 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

3D-A Interleaver v.s. TGn Sync, Channel B, 2x2 October 2004 3D-A Interleaver v.s. TGn Sync, Channel B, 2x2 Larger improvement over TGn Sync interleaver especially for more than two Tx. Jeng-Hong Chen, Pansop Kim, Winbond Electronics

3D-A Interleaver v.s. TGn Sync, Channel B, 3x3 October 2004 3D-A Interleaver v.s. TGn Sync, Channel B, 3x3 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

3D-A Interleaver v.s. TGn Sync, Channel B, 4x4 October 2004 3D-A Interleaver v.s. TGn Sync, Channel B, 4x4 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

3D-A Interleaver v.s. TGn Sync, Channel E, 2x2 September 2004 doc.: IEEE 802.11-04/934r0 October 2004 3D-A Interleaver v.s. TGn Sync, Channel E, 2x2 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

3D-A Interleaver v.s. TGn Sync, Channel E, 3x3 October 2004 3D-A Interleaver v.s. TGn Sync, Channel E, 3x3 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

3D-A Interleaver v.s. TGn Sync, Channel E, 4x4 October 2004 3D-A Interleaver v.s. TGn Sync, Channel E, 4x4 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

3D-A vs. TGn Sync in 40MHz BW 40 MHz (108 data subcarriers) October 2004 3D-A vs. TGn Sync in 40MHz BW 40 MHz (108 data subcarriers) 3D-A: Ncolumn=12, Nrow=9 subcarriers TGn Sync More performance improvements than those of 20MHz comparisons. Jeng-Hong Chen, Pansop Kim, Winbond Electronics

October 2004 2X2, Channel B Jeng-Hong Chen, Pansop Kim, Winbond Electronics

October 2004 3X3, Channel B Jeng-Hong Chen, Pansop Kim, Winbond Electronics

October 2004 4X4, Channel B Jeng-Hong Chen, Pansop Kim, Winbond Electronics

October 2004 2X2, Channel E Jeng-Hong Chen, Pansop Kim, Winbond Electronics

October 2004 3X3, Channel E Jeng-Hong Chen, Pansop Kim, Winbond Electronics

October 2004 4X4, Channel E Jeng-Hong Chen, Pansop Kim, Winbond Electronics

October 2004 The explosive 11n world requires an innovative, systematic structure to explore all available diversities in space, frequency and time—A 3D interleaver fits this purpose in all dimensions!! Jeng-Hong Chen, Pansop Kim, Winbond Electronics