ECE 875: Electronic Devices

Slides:



Advertisements
Similar presentations
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
Advertisements

ECE 875: Electronic Devices
Lecture 15 OUTLINE MOSFET structure & operation (qualitative)
Lecture 10: PN Junction & MOS Capacitors
EE105 Fall 2007Lecture 16, Slide 1Prof. Liu, UC Berkeley Lecture 16 OUTLINE MOS capacitor (cont’d) – Effect of channel-to-body bias – Small-signal capacitance.
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
ECE 4339 L. Trombetta ECE 4339: Physical Principles of Solid State Devices Len Trombetta Summer 2007 Chapters 16-17: MOS Introduction and MOSFET Basics.
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
PROCESS AND DEVICE SIMULATION OF A POWER MOSFET USING SILVACO TCAD.
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
ECE 875: Electronic Devices
Norhayati Soin 06 KEEE 4426 WEEK 3/2 20/01/2006 KEEE 4426 VLSI WEEK 4 CHAPTER 1 MOS Capacitors (PART 3) CHAPTER MOS Capacitance.
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
Introduction to semiconductor technology. Outline –6 Junctions Metal-semiconductor junctions –6 Field effect transistors JFET and MOS transistors Ideal.
ECE 875: Electronic Devices
ECE 874: Physical Electronics Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
ECE : Nanoelectronics Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
MOS capacitor before joining The metallic gate may be replaced with a heavily doped p+ polysilicon gate. The Fermi energy levels are approximately at.
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
CHAPTER 6: MOSFET & RELATED DEVICES CHAPTER 6: MOSFET & RELATED DEVICES Part 1.
ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University
MOS Capacitor Lecture #5. Transistor Voltage controlled switch or amplifier : control the output by the input to achieve switch or amplifier Two types.
ECE 875: Electronic Devices
ECE 875: Electronic Devices
ECE 875: Electronic Devices
Lecture 18 OUTLINE The MOS Capacitor (cont’d) Effect of oxide charges
Revision CHAPTER 6.
P-n Junctions ECE 2204.
Lecture 17 OUTLINE The MOS Capacitor (cont’d) Small-signal capacitance
Dr John Fletcher Rm 131 Power Electronics Dr John Fletcher Rm 131.
EMT362: Microelectronic Fabrication CMOS ISOLATION TECHNOLOGY Part 1
MOS Capacitor Low Frequency Characteristics
ECE 874: Physical Electronics
ECE 874: Physical Electronics
Lecture 17 OUTLINE The MOS Capacitor (cont’d) Small-signal capacitance
ECE 874: Physical Electronics
ECE 875: Electronic Devices
ECE 874: Physical Electronics
ECE 874: Physical Electronics
ECE 874: Physical Electronics
Lecture 18 OUTLINE The MOS Capacitor (cont’d) Effect of oxide charges
Lecture 17 OUTLINE The MOS Capacitor (cont’d) Small-signal capacitance
ECE 874: Physical Electronics
ECE 874: Physical Electronics
ECE 874: Physical Electronics
Sung June Kim Chapter 16. MOS FUNDAMENTALS Sung June Kim
ECE 875: Electronic Devices
ECE 875: Electronic Devices
Lecture 17 OUTLINE The MOS Capacitor (cont’d) Small-signal capacitance
ECE 874: Physical Electronics
ECE 875: Electronic Devices
ECE 875: Electronic Devices
ECE 875: Electronic Devices
EE 5340 Semiconductor Device Theory Lecture 23 - Fall 2003
ECE 875: Electronic Devices
ECE 874: Physical Electronics
Professor Ronald L. Carter
ECE 875: Electronic Devices
ECE 875: Electronic Devices
ECE 874: Physical Electronics
Modern Semiconductor Devices for Integrated Circuits (C. Hu)
ECE 875: Electronic Devices
MOS Capacitors Dr. David W. Graham West Virginia University
ECE 875: Electronic Devices
Professor Ronald L. Carter
Presentation transcript:

ECE 875: Electronic Devices Prof. Virginia Ayres Electrical & Computer Engineering Michigan State University ayresv@msu.edu

Lecture 31, 28 Mar 14 Chp 04: metal-insulator-semiconductor junction: GATES Capacitances: Low frequency voltage sweep: 1 Hz to 1KHz High frequency voltage sweep: > 1Mz - slow ramp: Pr. 4.06 - fast ramp VM Ayres, ECE875, S14

C-V curves and Frequencies: Use Gate voltage: Sweeping Vgate for example ± 4 Volts over and over to turn the channel OFF and ON: binary logic Low: 1- 1 kHz Intermediate: 1 kHz - 1 MHz High: > 1 MHz Vgate: Slow ramp Vgate: Fast ramp ON/OFF cycles per sec “counting” charge per sec applied to gate VM Ayres, ECE875, S14

OFF ON C / Ci C-V curves for n-channel in p-substrate: Low Intermediate C / Ci High + slow ramp High + fast ramp VM Ayres, ECE875, S14

OFF ON C / Ci C’min V’min = VT What looks different in the readout: flat line in Vfor and Cmin shift OFF ON Low C / Ci Cmin High + slow ramp C’min V’min = VT Vmin VM Ayres, ECE875, S14

Cmin = Ci CDmin CDmin = CminCi Ci + Cmin Ci + CDmin Low frequency C-V: You know the experimental values in the circles. Therefore it’s easy to get a number for Cdmin Cmin = Ci CDmin CDmin = CminCi Ci + Cmin Ci + CDmin VM Ayres, ECE875, S14

Low frequency C-V: Low: 1- 1 kHz: develop (ON) and later remove (=> OFF) a full inversion layer and a full depletion region VM Ayres, ECE875, S14

High frequency + slow ramp: > 1 MHz: develop and later remove a full depletion region charge qNAWD. But e-’s don’t have time to form a full inversion layer at the surface Fig. 8, (b) VM Ayres, ECE875, S14

High frequency + slow ramp: simpler: C’Dmin = es /WDmax  So total capacitance C’min is: C’min = Ci C’Dmin Ci + C’Dmin VM Ayres, ECE875, S14

Low frequency High frequency, Slow ramp WDmax is bigger Qn smaller VM Ayres, ECE875, S14

High frequency + slow ramp: WDmax From strong inversion up to thermal energy Have been finding WD = WDm at the start of inversion with ys = 2 kT/q ln (NA/ni). But (Qs, ys) can be bigger VM Ayres, ECE875, S14

High frequency + slow ramp: WDmax: VM Ayres, ECE875, S14

Assume that Pr. 4.06  the high frequency- slow ramp condition VM Ayres, ECE875, S14

Qn layer; no time to form at all Low frequency High frequency, Slow ramp High frequency, Fast ramp WDmax is bigger WDmax is biggest Qn layer; no time to form at all Qn smaller Qn biggest VM Ayres, ECE875, S14

High frequency + fast ramp: during ON: No Qn and big WDmax: “driven into deep depletion” VM Ayres, ECE875, S14

across insulator region CD  Qs region ys (@x = 0) Ci  across insulator region VM Ayres, ECE875, S14

VM Ayres, ECE875, S14

ys VGate

Iterate Pr. 3. 9 until donor concentration ND-nth – ND-(nth+1) = 0 Iterate Pr. 3.9 until donor concentration ND-nth – ND-(nth+1) = 0.01 x 1016 cm-3