AP 5301 / 8301 Instrumental Methods of Analysis Course Coordinator: Prof. Paul K. Chu Electronic mail: paul.chu@cityu.edu.hk Tel: 34427724

Reference Books Encyclopedia of Materials Characterization, C. Richard Brundle, Charles A. Evans, Jr., and Shaun Wilson (Editors), Butterworth-Heinemann (1992) X-Ray Microanalysis in the Electron Microscopy (4th Edition), J. A. Chandler, North Holland (1987) Methods of Surface Analysis: Techniques and Applications, J. M. E. Walls (Editor), Cambridge University Press (1990) Secondary Ion Mass Spectrometry, Benninghoven, Rudenauer, and Werner, John Wiley & Sons (1987) Surface Analytical Techniques, J. C. Riviere, Oxford University Press (1990) Modern Techniques of Surface Science, D. P. Woodruff and T. A. Delchar, Cambridge University Press (1994) Analysis of Microelectronic Material Devices, M. Grasserbauer and H. W. Werner (Editors), John Wiley & Sons (1991) Scanning Electron Microscopy and X-Ray Analysis (3rd Edition), J. Goldstein, D. Newbury, D. Joy, C. Lyman, P. Echlin, E. Lifshin, L. Sawyer, and J. Michael, Kluwer (2003)

Course Objectives COURSE OBJECTIVES Basic understanding of materials characterization techniques Emphasis on applications

Classification of Characterization Techniques Microscopic techniques Surface techniques Depth profiling techniques Spectroscopic techniques Electrical techniques

Microscopy and Related Techniques Optical Microscopy Scanning Electron Microscopy (SEM) / Energy-Dispersive X-Ray Spectroscopy (EDS) / Wavelength-Dispersive X-Ray Spectroscopy (WDS) / X-ray Diffraction (XRD) Transmission Electron Microscopy (TEM) / Scanning Transmission Electron Microscopy (STEM) / Electron Diffraction (ED)

Surface Characterization Techniques Auger Electron Spectroscopy (AES) X-ray Photoelectron Spectroscopy (XPS) Scanning Probe Microscopy (SPM) – Scanning Tunneling Microscopy (STM), Atomic Force Microscopy (AFM), …

Depth Profiling Techniques Auger Electron Spectroscopy (AES) X-Ray Photoelectron Spectroscopy XPS) Secondary Ion Mass Spectrometry (SIMS) Rutherford Backscattering Spectrometry (RBS) Capacitance-Voltage (CV) Measurement

Optical Spectroscopic Techniques Spectrophotometry Photoluminescence (PL) Spectroscopic ellipsometry Modulation spectroscopy

Electrical Techniques Four-Point Probe Hall Measurement Capacitance-Voltage (CV) Measurement Thermal Probe Minority Carrier Lifetime Measurement

Ion Beam Techniques Rutherford Backscattering Spectroscopy (RBS) Proton-Induced X-Ray Emission (PIXE) Channeling

Product Yield Enhancement Understand via modeling and simulation which parameters can improve product yields Systematically identify these parameters within the process Control and eliminate these parameters by identifying their root causes Monitor these parameters to assess the effectiveness of the contamination control efforts

Surface Contaminant Identification Particles – Optical Microscopy, SEM/EDS, AES, XPS, SPM Residues – SEM/EDS, AES, XPS, SIMS Stain, discoloration, haze – SPM, SEM, XPS, AES, SEM/EDS General surface and near-surface contamination – XPS, AES, SEM/EDS, SIMS, RBS, PIXE

TiN Grains (SPM)

Residues on Integrated Circuit (SEM)

Integrated Circuit (SEM)

Hard Disk Defects (AES)

Depth Profiling

Gate Oxide Breakdown (SIMS)