I. Rashevskaya on behalf of the Slim5 Collaboration, Trieste Group

Slides:



Advertisements
Similar presentations
Silicon Technical Specifications Review General Properties Geometrical Specifications Technology Specifications –Mask –Test Structures –Mechanical –Electrical.
Advertisements

Simplified Example of a LOCOS Fabrication Process
Silicon Preshower for the CMS: BARC Participation
Alternative technologies for Low Resistance Strip Sensors (LowR) at CNM CNM (Barcelona), SCIPP (Santa Cruz), IFIC (Valencia) M. Ullán, V. Benítez, J. Montserrat,
Design and Implementation of VLSI Systems (EN1600) lecture04 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Sedra/Prentice.
Origin of Coulomb Blockade Oscillations in Single-Electron Transistors
Silicon Strip Detectors. Background Semiconductors Doping N-type, P-type.
Design and Implementation of VLSI Systems (EN0160) Sherief Reda Division of Engineering, Brown University Spring 2007 [sources: Sedra/Prentice Hall, Saint/McGrawHill,
Digital Integrated Circuits © Prentice Hall 1995 Manufacturing Process CMOS Manufacturing Process.
20th RD50 Workshop (Bari)1 G. PellegriniInstituto de Microelectrónica de Barcelona G. Pellegrini, C. Fleta, M. Lozano, D. Quirion, Ivan Vila, F. Muñoz.
Embedded Pitch Adapters a high-yield interconnection solution for strip sensors M. Ullán, C. Fleta, X. Fernández-Tejero, V. Benítez CNM (Barcelona)
ES 176/276 – Section # 2 – 09/19/2011 Brief Overview from Section #1 MEMS = MicroElectroMechanical Systems Micron-scale devices which transduce an environmental.
Semiconductor detectors
Haga clic para modificar el estilo de texto del patrón Progress on p-type isolation technology M. Lozano, F. Campabadal, C. Fleta, S. Martí *, M. Miñano.
Silicon pad detectors for LCCAL: characterisation and first results Antonio Bulgheroni University of Milan – Italy on behalf of LCCAL: Official INFN R&D.
Outline Introduction CMOS devices CMOS technology
Dahee Kim (Ewha womans university) for MPC-EX collaboration TEST OF MINI-PAD SILICON SENSOR FOR PHENIX MPC-EX.
1. A clean single crystal silicon (Si) wafer which is doped n-type (ColumnV elements of the periodic table). MOS devices are typically fabricated on a,
1 Plans of Vienna SLHC Proposal Workshop 20. February 2008.
Status of the Low-Resistance (LowR) Strip Sensors Project CNM (Barcelona), SCIPP (Santa Cruz), IFIC (Valencia) Contact person: Miguel Ullán.
SILICON DETECTORS PART I Characteristics on semiconductors.
EE141 © Digital Integrated Circuits 2nd Manufacturing 1 Manufacturing Process Dr. Shiyan Hu Office: EERC 731 Adapted and modified from Digital Integrated.
Introduction to CMOS VLSI Design CMOS Fabrication and Layout Harris, 2004 Updated by Li Chen, 2010.
Evaluation of the Low Resistance Strip Sensors (Low-R) Fabricated at CNM CNM (Barcelona), SCIPP (Santa Cruz), IFIC (Valencia) Contact person: Miguel Ullán.
UNIVERSITY OF NOTRE DAME Origin of Coulomb Blockade Oscillations in Single-Electron Transistors Fabricated with Granulated Cr/Cr 2 O 3 Resistive Microstrips.
Silicon detector processing and technology: Part II
MIT Lincoln Laboratory NU Status-1 JAB 11/20/2015 Advanced Photodiode Development 7 April, 2000 James A. Burns ll.mit.edu.
NanoFab Trainer Nick Reeder June 28, 2012.
News on microstrip detector R&D —Quality assurance tests— Anton Lymanets, Johann Heuser 12 th CBM collaboration meeting Dubna, October
Low Resistance Strip Sensors – RD50 Common Project – RD50/ CNM (Barcelona), SCIPP (Santa Cruz), IFIC (Valencia) Contact person: Miguel Ullán.
CERN, November 2005 Claudio Piemonte RD50 workshop Claudio Piemonte a, Maurizio Boscardin a, Alberto Pozza a, Sabina Ronchin a, Nicola Zorzi a, Gian-Franco.
Simulations of 3D detectors
CMOS VLSI Fabrication.
Metal-oxide-semiconductor field-effect transistors (MOSFETs) allow high density and low power dissipation. To reduce system cost and increase portability,
ICT 1 SINTEF Edge-On Sensor with Active Edge Fabricated by 3D-Technology T. E. Hansen 1), N. Ahmed 1), A. Ferber 2) 1) SINTEF MiNaLab 2) SINTEF Optical.
Simulation of new P-Type strip detectors 17th RD50 Workshop, CERN, Geneva 1/15 Centro Nacional de MicroelectrónicaInstituto de Microelectrónica de Barcelona.
Claudio Piemonte Firenze, oct RESMDD 04 Simulation, design, and manufacturing tests of single-type column 3D silicon detectors Claudio Piemonte.
EE141 © Digital Integrated Circuits 2nd Manufacturing 1 Manufacturing Process Dr. Shiyan Hu Office: EERC 731 Adapted and modified from Digital Integrated.
Experience with the Test and Qualification of ALICE Double-Sided Microstrip Sensors Workshop on Quality Issues in Present and Future Silicon Detectors.
1 Interstrip resistance in silicon position-sensitive detectors E. Verbitskaya, V. Eremin, N. Safonova* Ioffe Physical-Technical Institute of Russian Academy.
Development of N-in-P Silicon Strip and Pixel sensors for very high radiation environments Y. Unno For the Collaboration of KEK, Univ. Tsukuba and Hamamatsu.
Pilot run – matrix measurements after first metal
Axel König, HEPHY Vienna
Characterization and modelling of signal dynamics in 3D-DDTC detectors
CMOS Fabrication CMOS transistors are fabricated on silicon wafer
I. Rashevskaya on behalf of the Slim5 Collaboration, Trieste Group
First production of Ultra-Fast Silicon Detectors at FBK
MODUL 11 Investigation of Annealing Effect on the Forward bias and Leakage current Changes of P-Type 6H-SiC Schottky Diodes with SiO2 Ramp Profile after.
Bonding interface characterization devices
Study of radiation damage induced by 24/c GeV and 26MeV protons on heavily irradiated MCz and FZ silicon detectors N. Manna Dipartimento Interateneo di.
SuperB SVT Silicon Sensor Requirements
Chapter 1 & Chapter 3.
Results from the first diode irradiation and status of bonding tests
SuperB SVT Silicon Sensor Geometry Optimization
Production of 3D silicon pixel sensors at FBK for the ATLAS IBL
SCUBA-2 Detector Technology Development
Design and fabrication of Endcap prototype sensors (petalet)
Planar Edgeless Silicon Detectors for the TOTEM Experiment
VLSI System Design LEC3.1 CMOS FABRICATION REVIEW
Etch-Stop Techniques : (1) Doping Selective Etching (DSE)
Optional Reading: Pierret 4; Hu 3
Add nitride Silicon Substrate.
Semiconductor sensors
Metal overhang: an important ingredient against “micro-discharge”
Vladimir Cindro, RD50 Workshop, Prague, June 26-28, 2006
Thermal oxidation Growth Rate
BONDING The construction of any complicated mechanical device requires not only the machining of individual components but also the assembly of components.
Manufacturing Process I
Status of Hamamatsu Silicon Sensors
Fabrication of 3D detectors with columnar electrodes of the same doping type Sabina Ronchina, Maurizio Boscardina, Claudio Piemontea, Alberto Pozzaa, Nicola.
Presentation transcript:

I. Rashevskaya on behalf of the Slim5 Collaboration, Trieste Group Investigation of an abnormal pattern of leakage currents in silicon microstrip detectors Some batches of microstrip detectors fabricated by FBK-irst showed an odd and peculiar pattern of the strip leakage currents :the current of the first and the last few strips is low, whereas all the strips in between have very high current (3-5 orders of magnitude higher). This peculiar phenomenon, common to ALL six different detectors in EACH wafer of the batch, has been called “Panettone effect”. I. Rashevskaya on behalf of the Slim5 Collaboration, Trieste Group 23/01/2008 Torino I.Rashevskaya

Role of surface generation current Surface generation played a major role. The high current measured on strip detectors is quantitatively compatible with this surface-generated current in the interstrip gaps. It must be concluded that in the gaps between the strips of the detectors the interface has much worse characteristics than in the gated diodes. Silver paint Proposed explanation for the origin of the effect By comparing the technologies of different detector lots fabricated by FBK-irst, we observe that the peculiar 'Panettone Effect' is correlated with the combined presence of two LPCVD-deposited dielectric layers: silicon nitride and TEOS oxide. This combination produces a high level of stress, which induces defects at the silicon/oxide interface, leading to a high rate of surface generation. These dielectric layers are interrupted in the contact areas between metal and (implanted) silicon. This locally releases the stress in a region around the contact. Since the Bias Rings of the detectors have a continuous contact opening along their length, the local release of the stress can explain the fact that the strips within a certain distance from the Rings have low leakage current. Making use of a modified technology excluding the TEOS oxide, a batch of striplet detectors has been fabricated. They showed no “panettone effect”, and have been successfully employed in the SLIM5 beam test at CERN in September 2008 I. Rashevskaya on behalf of the Slim5 Collaboration, Trieste Group 23/01/2008 Torino I.Rashevskaya