Ideal Scaling of MOSFETs

Slides:



Advertisements
Similar presentations
by Alexander Glavtchev
Advertisements

Metal Oxide Semiconductor Field Effect Transistors
Lecture 15 OUTLINE MOSFET structure & operation (qualitative)
Spring 2007EE130 Lecture 39, Slide 1 Lecture #39 ANNOUNCEMENTS Late projects will be accepted –by 1:10PM Monday 4/30: 20 pt penalty –by 1:10PM Friday 5/4:
Introduction to CMOS VLSI Design Lecture 21: Scaling and Economics Credits: David Harris Harvey Mudd College (Material taken/adapted from Harris’ lecture.
Semiconductor Devices III Physics 355. Transistors in CPUs Moore’s Law (1965): the number of components in an integrated circuit will double every year;
ECE 342 Electronic Circuits 2. MOS Transistors
EE213 VLSI Design S Daniels Channel Current = Rate of Flow of Charge I ds = Q/τ sd Derive transit time τ sd τ sd = channel length (L) / carrier velocity.
© Digital Integrated Circuits 2nd Devices Digital Integrated Circuits A Design Perspective The Devices Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic.
Device Physics – Transistor Integrated Circuit
Norhayati Soin 06 KEEE 4426 WEEK 7/1 6/02/2006 CHAPTER 2 WEEK 7 CHAPTER 2 MOSFETS I-V CHARACTERISTICS CHAPTER 2.
Chapter 5: Field Effect Transistor
Introduction to FinFet
Limitations of Digital Computation William Trapanese Richard Wong.
The George Washington University School of Engineering and Applied Science Department of Electrical and Computer Engineering ECE122 – Lab 7 MOSFET Parameters.
Fabrication of CMOS Imagers
Structure and Operation of MOS Transistor
HO #3: ELEN Review MOS TransistorsPage 1S. Saha Long Channel MOS Transistors The theory developed for MOS capacitor (HO #2) can be directly extended.
Short-channel Effects in MOS transistors
MOSFET Current Voltage Characteristics Consider the cross-sectional view of an n-channel MOSFET operating in linear mode (picture below) We assume the.
Figure 11.1 (p. 260) Trends of power supply voltage V DD, threshold voltage V T, and gate oxide thickness d versus channel length for CMOS logic technologies.
EE 466/586 VLSI Design Partha Pande School of EECS Washington State University
MOSFET #5 OUTLINE The MOSFET: Sub-threshold leakage current
EE314 IBM/Motorola Power PC620 IBM Power PC 601 Motorola MC68020 Field Effect Transistors.
The Devices: MOS Transistor
Chapter 6 The Field Effect Transistor
The Interconnect Delay Bottleneck.
Chapter 2 MOS Transistors.
MOSFET The MOSFET (Metal Oxide Semiconductor Field Effect Transistor) transistor is a semiconductor device which is widely used for switching and amplifying.
MOS Field-Effect Transistors (MOSFETs)
FIELD EFFECT TRANSISTOR
Floating-Gate Devices / Circuits
Recall Last Lecture Common collector Voltage gain and Current gain
ChapTer FiVE FIELD EFFECT TRANSISTORS (FETs)
MOS TRANSISTOR (Remind the basics, emphasize the velocity saturation effects and parasitics) Structure of a NMOS transistor.
Radiation Tolerance of a 0.18 mm CMOS Process
VLSI design Short channel Effects in Deep Submicron CMOS
Lecture 20 OUTLINE The MOSFET (cont’d) Qualitative theory
by Alexander Glavtchev
Lecture 22 OUTLINE The MOSFET (cont’d) MOSFET scaling
VLSI Design MOSFET Scaling and CMOS Latch Up
Downsizing Semiconductor Device (MOSFET)
EE141 Chapter 3 VLSI Design The Devices March 28, 2003.
ENG2410 Digital Design “CMOS Technology”
IC TECHNOLOGY.
Gate Delay, Power, Scaling
Supplementary Slides for Lecture 22
Lecture 22 OUTLINE The MOSFET (cont’d) Velocity saturation
منبع: & کتابMICROELECTRONIC CIRCUITS 5/e Sedra/Smith
Device Physics – Transistor Integrated Circuit
Downsizing Semiconductor Device (MOSFET)
FIELD EFFECT TRANSISTOR
Chapter 9: Short channel effects and
EMT 182 Analog Electronics I
LECTURE # 8 FIELD EFFECT TRANSISTOR (FET)
Device Physics – Transistor Integrated Circuit
Lecture 20 OUTLINE The MOSFET (cont’d) Qualitative theory
CP-406 VLSI System Design CMOS Transistor Theory
Lecture 22 OUTLINE The MOSFET (cont’d) MOSFET scaling
Lecture 22 OUTLINE The MOSFET (cont’d) Velocity saturation
Thermal Modeling for Modern VLSI Circuits
Lecture #15 OUTLINE Diode analysis and applications continued
Smith chart Nonideal effects.
Reading (Rabaey et al.): Sections 3.5, 5.6
Lecture 20 OUTLINE The MOSFET (cont’d)
Small Geometry Effects of MOSFETs
Lecture 20 OUTLINE The MOSFET (cont’d)
Technology scaling Currently, technology scaling has a threefold objective: Reduce the gate delay by 30% (43% increase in frequency) Double the transistor.
Beyond Si MOSFETs Part 1.
Dr. Hari Kishore Kakarla ECE
Presentation transcript:

Ideal Scaling of MOSFETs A set of ideal scaling laws have been proposed by Dennard and Gaensleen. The basic concept is to minimize a MOSFET while keeping the E-fields in the device approximately constant. (This is a reasonable concept since, if E-fields are reduced, carrier velocity will decrease. Large E-fields can cause materials to reach their limits such as breakdown voltages, etc.) I/S VG/S V/S

These relationships are true to first order since

Note that in reality, fbi, fms, and fB do not scale. Since fbi » 0 Note that in reality, fbi, fms, and fB do not scale. Since fbi » 0.8Volts and 2fB » 0.7-1.5 volts, we clearly cannot neglect them, especially if applied biases are scaled to this range. However, in n+-polysilicon gate NMOS, the fms term approximately cancels that of the 2fB term. Are these scalings realistic? Since the publishing of the paper in 1974, we see the following trend: Parameter 1994 1999 2007 1. Layout Density (gates/mm2) 104 105 108 2. Speed Power Product (pj) 0.01 10-4 10-8 3. Gate Delay (ps) 100 12 0.1 4. Power supply (V) 3.3 1.8 1.0 5. Channel Length (nm) 350(250) 180( 120) 45(30) 6. Oxide Thickness (tox(Å) ) 23

Problem with Ideal Scaling A number of factors were neglected in the above analysis. Many of these become increasingly important in submicron-size devices.

Supply Voltage vs. Gate Length Scaling 0.85/generation 0.65/generation The E-field increases rapidly and leads to many performance and reliability problems

What is the Moore’s Law? Not a scientific formulation yet has been surprising accurate in predicting the “future” back in 1965

Why Scaling? MOSFETs need to be scaled to smaller dimensions results in higher performance leads to lower power consumption MOSFET delay times have decreased by more than 30% per generation resulting in doubling of mP performance every 2 years

Scaling for the Economics In 2003, $0.01 bought you 100,000 transistors Increased transistor counts and thus cheaper transistors More performance per dollar