Hella Lighting Finland Oy, Finland

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Presentation transcript:

Hella Lighting Finland Oy, Finland Multiphysics Simulation Story: Keeping LEDs Cool Gets More Manageable Through Simulation Univ. of Turku, Finland Philips, Netherlands Hella Lighting Finland Oy, Finland Helvar Oy Ab, Finland Aulis Tuominen1, Mika Maaspuro1, Toni Lopez2, Sami Yllikäinen3, and Raimo Laitinen4 1 Univ. of Turku 2 Philips 3 Hella Lighting Finland Oy 4 Helvar Oy Ab

The Challenge Light emitting diode (LED) light sources offer many benefits over incandescent lighting Longer life spans High luminous efficiency Environmentally friendly The biggest drawback is that LEDs require careful temperature regulation LEDs must operate at the lowest possible temperature New materials may offer solutions, but manufacturers must wait for samples to be able to test them LED light bulbs offer a long-lasting and environmentally friendly option in lighting.

The Solution The LED junction, the small active area where light generation takes place, is kept cool by a heat sink Efficient conducting materials such as aluminum are expensive Using less expensive materials, the geometrical dimension and shape of the heat sink become more important Modeling allows for parameters to be easily altered for optimization Newer materials, such as nanomaterials, can be analyzed before those materials are made available for testing Top, 3D geometry of the LED lighting device composed of an internal LED module, a heat sink, and a cap. Bottom, Simulation results of the air domain inside the cap show temperature variations.

The Simulation Using a 3D geometry of a LED lighting device, conduct an electrothermal analyses of high-power LEDs Predicts self-heating, current crowding, forward voltage and other LED performance indicators Experiments with physical prototypes validated the simulation results The next step will be modeling the driver of the LED Analyzing electromagnetic interference and electromagnetic compatibility LED driver module simulation results where power dissipation in each component has been resolved by SPICE circuit simulation.