Flex studies status. Module flexes: 4 types; M4, M2, M1plane, M1mountain. constraint: components and bondings on the same side. Constraining for the wing.

Slides:

Advertisements

Similar presentations

Technical Board, 12 July 2005Børge Svane Nielsen, NBI1 Status of the FMD Børge Svane Nielsen Niels Bohr Institute.

Advertisements

L. Greiner 1HFT PXL LBNL F2F – March 14, 2012 STAR HFT The STAR-PXL sensor and electronics Progress report for F2F.

1 IBL Stave & loading tools University of Geneva: G.Barbier, F.Cadoux, A.Clark, D.Ferrère, C.Husi, P. Iacobucci, M. Weber The main goal for today…  Review.

LAPP electronics developments Jean Jacquemier, Yannis Karyotakis, Jean-Marc Nappa,, Jean Tassan, Sébastien Vilalte. CLIC WS 12-16/10/2009.

Type 0 flex assembly to the stave 2011/06/08 François-Xavier NUIRY CERN PH/DT/PO 1.

Status of the Tracker DB System Tk week april 03 D. Contardo Developments Applications.

STATUS OF THE CRESCENT FLEX- TAPES FOR THE ATLAS PIXEL DISKS G. Sidiropoulos 1.

Panda PCB for prototype status report by D Malkevich on behalf of the ITEP group ITEP.

WP7&8 Progress Report ITS Plenary meeting, 23 April 2014 LG, PK, VM, JR Objectives 2014 and current status.

ATLAS Tracker Upgrade Stave Collaboration Workshop Oxford 6-9 February 2012 ABC 130 Hybrid.

Proposal of new electronics integrated on the flanges for LAr TPC S. Cento, G. Meng CERN June 2014.

ISR Work Progress Report Muon Week April 10 th 2003 A. Benvenuti INFN Bologna.

17/06/2010UK Valencia RAL Petals and Staves Meeting 1 DC-DC for Stave Bus Tapes Roy Wastie Oxford University.

1 Module and stave interconnect Rev. sept. 29/08.

M. Lo Vetere 1,2, S. Minutoli 1, E. Robutti 1 1 I.N.F.N Genova, via Dodecaneso, GENOVA (Italy); 2 University of GENOVA (Italy) The TOTEM T1.

Detector Cabling and Patching Rainer Schwemmer

Module Flex status. 4 types: M4, M2, M1plane, M1mountain. constraint: components and bonding on the same side → folded wing geometry of the flex module.

1 IBL Integration & Testing activities University of Geneva: G.Barbier, F.Cadoux, A.Clark, D.Ferrère, C.Husi, M. Weber  Preliminary definition of Integration.

1 US Pixel Mechanics Role Global support structureIntermediate support structureLocal support structure Stave SectorDisk Barrel x (9-11) x5 x (22,40,56)

Chapter 7 Parallel Circuits. Parallel Circuit Has two or more paths for electron flow. The electrons have choices to make as to where they go. Voltage.

Phase 2 Tracker R&D Background: Initial work was in the context of the long barrel on local tracklet- based designs. designs of support structures and.

Global Trigger H. Bergauer, Ch. Deldicque, J. Erö, K. Kastner, S. Kostner, A. Nentchev, B. Neuherz, N. Neumeister, M. Padrta, P. Porth, H. Rohringer, H.

2 Silicon pixel part Done and to be written Written! Under way To be done Introduction 1.Hybrid Pixel Assembly Concept 2.Silicon sensor 1.First thinned.

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA1 Cooling Mechatronics Schedule.

ATLAS Pixel Detector September 2003 Services E. Anderssen LBNL Service Connectivity from Module to PP1b Eric Anderssen LBNL Pixel Services Meeting, CERN.

Introduction Straw Working group meeting CERN group 1 NA62 Collaboration meeting, Brussels 7-10/9/2010.

System implementation of a power distribution scheme based on DC-DC converters F.Faccio, G.Blanchot, S.Michelis, C.Fuentes, B.Allongue, S.Orlandi CERN.

Specifications Asic description Constraints Interface with PDM board Schedule Summary.

Pixel power R&D in Spain F. Arteche Phase II days Phase 2 pixel electronics meeting CERN - May 2015.

BPM stripline acquisition in CLEX Sébastien Vilalte.

LAPP BI Read-out electronics Jean Jacquemier, Yannis Karyotakis, Jean-Marc Nappa,, Jean Tassan, Sébastien Vilalte. CLIC BI WS 02-03/06/2009.

EOS and type I Prototype Service Modules Mike Dawson (Oxford), Rob Gabrielczyk (RAL), John Noviss (RAL) 19 th January 2015 ATLAS Upgrade Activities, Oxford.

1. Take HV harnesses with label (IHV2) and transfer on the Stacking table. 1.1 Inspect HV harnesses visually. 2.1 Insulate HV Flex with 3M™ VHB™ Tape.

Upgrade PO M. Tyndel, MIWG Review plans p1 Nov 1 st, CERN Module integration Review – Decision process  Information will be gathered for each concept.

Standard electronics for CLIC module. Sébastien Vilalte CTC

Specifications Asic description Constraints Interface with PDM board Planning Summary.

Marc Anduze – EUDET Meeting – PARIS 08/10/07 Mechanical R&D for EUDET module.

Stave Emulator for sLHC Prototyping L. Gonella, A. Eyring, F. Hügging, H. Krüger Physikalisches Institut, Uni Bonn.

De Remigis The test has been accomplished with an SLVS signal, since that was chosen for the serial communication between the readout and the optical converter.

ATLAS Internal ID Service Integration

News and Introduction from CERN June 15th, 2005

Mauro Citterio, Fabrizio Sabatini

Micro Vertex Detector of PANDA Status of Strip BARREL and DISC

Novosibirsk, September, 2017

Micromegas Vertex Tracker Status Report

Upgrade activities at Clermont-Ferrand

P. Morettini Towards Pixel TDR PM - ITk Italia - Introduction 8/2/2017.

Institute of Nuclear Physics Polish Academy of Sciences

LAPP BPM Read-out Electronics

INSIDE – Update meeting

- STT LAYOUT - SECTOR F SECTOR A SECTOR B SECTOR E SECTOR D SECTOR C

ob-fpc: Flexible printed circuits for the alice tracker

Tile Upgrade Workshop (CERN- February and 9)

TileCal upgrade EVO meeting Demonstrator tesks

T1 Electronic status Conclusions Electronics Cards:

CMS November Upgrade Week

LV Safe Powering from UPS to Clients

HB RM prototypes Ianos Schmidt Aug 17, 2017.

Test Slab Status CALICE ECAL test slab: what is it all about?

The DHCAL DIF Board For the M2 Prototype

Design and fabrication of Endcap prototype sensors (petalet)

Pierluigi Paolucci - I.N.F.N. Naples

Commercial helicon sources need heavy magnets

TEC Services Status 30/12/2018 Nick Lumb.

Outer Endcap External Bus tape

CAN branch PSU – Update meeting

First thoughts on DIF functionality

Command and Data Handling

SALTRO16 activities in Lund

M. Modena, CLIC Stabilization Day # 10, 14 September 2010

Presentation transcript:

Flex studies status. Module flexes: 4 types; M4, M2, M1plane, M1mountain. constraint: components and bondings on the same side. Constraining for the wing geometry of the flex module. Choice of the serial powering current (0,6 or 1,2A) to be done. 0,6A preferred but depends on the possible implementation on the VIP, available voltage on services… limitations from ATLAS? Technical discussion soon: final prototype for CAD design. JMN identified to design the stave & module flexes. Flat solutions with no mechanical bending: simpler process (cabling, loading). Allows degree of freedom for thermal shrinkage. To be tested with prototypes. Missing: scheme, outline, DCS, … Outline determines the wings positions. bonding protection: potting, arch… calculations and tests. Test bench: USB pix? Module-USB pix conversion board… Sebastien Vilalte, 01/12/2014

Stave flexes: 3 independent flexes on L2; 1 for 7M4, 1 for 7M2, 1 for 7 M2. Stack up well defined: double sided 9/75/9 µm. Tracks always on top, referenced on bottom. Tracks distribution ok for a not serialized data transmission. LOI estimated FE rate to 160Mb/s. 640Mb/s with a factor 4: still in the LVDS domain. Tests will give a verdict. CTF3 boards and network analyzer available. Discussions foreseen with CERN and with cabling company for prototype prod. Depends mainly on the availability of the material. Details to discuss: VIP connectors, stave flex binding. Radiation lengths will be estimated soon. Stave flex-USB pix conversion board… Steps and Priorities?: Tests of the modules on table, tests of stave flex in parallel. Tests of modules connected on stave flex, on table. Module loading. Tests of the full stave. Sebastien Vilalte, 01/12/2014