Carrier Transport Phenomena And Measurement Chapters 5 and 6 22 and 25 February 2019.

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Carrier Transport Phenomena And Measurement Chapters 5 and 6 22 and 25 February 2019

Carrier Drift Observe that the text uses “e” instead of “q” as a symbol for a unit of charge Drift current density Current density due to the holes Charge density: Drift velocity of holes Current density due to the holes Current density due to the electrons Charge density: Drift velocity of electrons Total drift current density 3 3 3

Definition of Carrier Mobility Drift velocity of holes Drift velocity of electrons : mobility of holes : mobility of electrons Mobility: relates the average drift velocity of a carrier to the electric field 4 4 4

Conductivity Conductivity: (Ω-cm)-1 (Ω-cm)-1 Resistivity: Intrinsic semiconductor: N-type semiconductor: P-type semiconductor: 10 10 10

Resistance 12 12 12

Non-equilibrium Excess Carriers in Semiconductors (Chapter 6) When external field (electric, thermal, optical) is applied on the semiconductor, the semiconductor is operating under non-equilibrium conditions Excess electrons in the conduction band and excess holes in the valence band may exist in addition to the thermal equilibrium condition Excess carriers’ movements: generation, recombination, drift, and diffusion 16 16 16

Total Diffusion Current Hole diffusion current Dp: hole diffusion coefficient (m2/s) Electron diffusion current Dn: electron diffusion coefficient (m2/s) Total diffusion current 18 18 18

Low-Level Injection and High-Level Injection Low-level injection: excess carrier concentration is much less than thermal equilibrium majority carrier concentrations n-type material: no>>po, δn(t) << no p-type material: po>>no, δn(t)<<po High-level injection: excess carrier concentration is comparable to or greater than the thermal equilibrium majority carrier concentrations n-type material: no >> po, δn(t) >= no p-type material: po >>no, δn(t)>= po 19 19 19

Low-Level Injection and High-Level Injection Low-level injection: excess carrier concentration is much less than thermal equilibrium majority carrier concentrations n-type material: no>>po, δn(t) << no p-type material: po>>no, δn(t)<<po High-level injection: excess carrier concentration is comparable to or greater than the thermal equilibrium majority carrier concentrations n-type material: no >> po, δn(t) >= no p-type material: po >>no, δn(t)>= po 21 21 21

Carrier Generation and Recombination Mechanisms of generation and recombination: band-to-band, traps (recombination centers) 22 22 22

Excess Carrier Generation and Recombination When external force (electric, optical, thermal) is applied, excess electrons and holes are create in pairs With generation of excess carriers, concentration of electrons and holes are increased Electrons and holes are recombined at the same time of generation are equal 23 23

Carrier Generation and Recombination in Equilibrium (Band-to-Band) For direct band-to-band generation, the electrons and holes are created in pairs For direct band-to-band recombination, the electrons and holes are combined in pairs In thermal equilibrium, the generation and recombination rates are equal 24 24 24