Thermal studies status LAPP ATLAS ID dream team ATLAS Pixel upgrade Thermal studies status Main actions Current results Conclusions LAPP ATLAS ID dream team Pierre-Yves David, Pierre Delebecque, Sabine Elles, Nicolas Geffroy, Stephane Jézequel, Remi Lafaye, Jessica Leveque, Nicolas Massol, Jean-Marc Nappa, Thibaut Rambure, Andre Rummler, Sébastien Vilalte

1 – Main actions Simulation Built and compute a « baseline mountain model » to be used as a « reasonable solution », Done Adapt the baseline model to fit with the one used by Zhan in September 2014 for the ITK general meeting (IBL like model), Done Built and compute an optimized mountain model to improve thermal performances to fit the thermal requirements. In work Built and compute a model that represents the sample used for thermal measurement performances on the CO2 cooling setup. To be done Copper(6mm) Foam (4mm) Copper (6mm) Silicon Heater To convenience the glue implementation, a mask of 0.1mm was used 2mm Vacuum Chamber Ttop Tbot

1 – Main actions Prototyping - measurements Built the baseline 3D CAD model to be used by LPSC to produce the first 3 prototypes, Almost done (has to be checked) Collect all the material needed for the prototypes to give to LPSC. Done Check the status with LPSC, January Tuesday 20th Measure the thermal performances of the mountain prototypes, To be done Measure the thermal performances of the material samples, To be done Material Collect the reliable information about the material characteristics and uncertainties, Almost done …(Data base ?) Find better materials to improve the performances : focus on glue and grease

2 – Current simulation results Baseline model – geometry and materials

2 – Current simulation results Baseline model – geometry and materials

2 – Current simulation results Baseline model Specifications : (based on 0,7 W/cm2 heat load) Innermost layers DT < 10,5 °C (TFM<15) Outermost layers DT < 7,7 °C (TFM<11)

2 – Current simulation results Baseline model Specifications : (based on 0,7 W/cm2 heat load) Innermost layers DT < 10,5 °C (TFM<15) Outermost layers DT < 7,7 °C (TFM<11)

2 – Current simulation results IBL like model Specifications : (based on 0,7 W/cm2 heat load) Innermost layers DT < 10,5 °C (TFM<15) Outermost layers DT < 7,7 °C (TFM<11)

3 – Conclusions We’re not so far from the goal TPG seems promising Improvements to be done on glues Material and interfaces qualification is a key challenge Simulation results have to be crosschecked with measurements on prototypes