Taiwan TC Chapter 3D Packaging & Integration (3DP&I) Global Technical Committee Liaison Report March 2019 v1

Outline Meeting Information Announcement Leadership / Leadership Changes Organization Chart Ballot Results Abolished SNARFs Task Force Highlights Staff Contact *Optional* For slides that have no update – do not delete the slide. Place slides after the “Backup” slide or “Hide” the slide, and update list.

Meeting Information Last meeting Next meeting March 26, 2019 at the SEMI Standards Taiwan Spring 2019 Meetings SEMI Taiwan Office, Zhubei City, Hsinchu County, Taiwan Next meeting June 11, 2019 at the SEMI Standards Taiwan Summer 2019 Meetings Example: Last meeting Tuesday, November 7, 2017 at the SEMI Standards NA Fall Meetings SEMI Headquarters, Milpitas, CA http://www.semi.org/en/standards-events

Announcements None To be used for high-level announcements (e.g. merging of 3DS-IC and A&P )

Leadership Co-chairs Chien-Chung Lin - ITRI Wendy Chen - King Yuan Electronics Company Roger Hwang - ASE *Optional* Keep text consistent as shown in Org Chart. Example “Name – Company” Note: confirm the information here is the same as Org Chart

Organization Chart Taiwan TC Chapter of 3D Packaging & Integration Global Technical Committee C: Chien-Chung Lin – ITRI C: Wendy Chen - KYEC C: Roger Hwang - ASE Testing Task Force L: Ming-Chin Tsai - KYEC L: Roger Hwang - ASE L: Shang-Chun Chen - ITRI Middle End Process Task Force L: Arthur Chen - NTUST L: Mike Chang - ITRI

Ballot Results Doc # Document Title TC Chapter Action 5800A New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process Passed, ISC A&R SC on 2018/07/06 6405 Reapproval of SEMI 3D7-0913, GUIDE FOR ALIGNMENT MARK FOR 3DS-IC PROCESS Passed, ISC A&R SC on 2018/10/19 6411 Line Item Revision of SEMI 3D6-0913 Guide for CMP and Micro- bump Processes for Frontside Through Silicon Via (TSV) Integration *Delete rows that are empty* Correct terms to be used in “TC Chapter Action” column (shall match the CER) Note: Use green font color for “Passed” and red for “Failed” Passed, as balloted Passed, with editorial changes Passed, Ratification Ballot to be issued Failed Failed, SNARF abolished Also include when applicable: Ratification Ballots – In the “TC Chapter Action” column, state either passed and what cycle or failed: Example: “Passed, A&R Cycle 9-2017” Other activities outside the Letter Ballot process – In the “Doc #” column, put the SEMI Standard Designation # – In the “Doc Title” column, put the full SEMI Standard title >> Underneath, write a short explanation in bold and italicized what type of change >> Under that in parenthesis, briefly state what was done – In the “TC Chapter Action” column, state either “Passed, submitted to ISC A&R SC” or “Fail” Example: SEMI E137-0705 (Reapproved 1111), Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment - Editorial Change made independently outside the Letter Ballot process (Delete “NOTE 2:…” after Section 3.1) Note 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review. Note 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.

Abolished SNARF(s) Doc # TF Title/Details Testing Task Force New Standards: Guideline for Chip ID registering and tracing – The scope of this SNARF is similar with SEMI T23-0119 “New Standard: Specification for Single Device Traceability for the Supply Chain” which was submitted by Traceability TC/ Single Device Traceability Task Force *Delete rows that are empty* Include short description to explain why the SNARF was abolished. Correct terms to use: – Reapproval ballot failed Committee review, new SNARF to be issued to reflect change in scope – Standard to receive Inactive Status; SNARF retired [PM 2.2.7.6] – Activity discontinued

Task Force Highlights (1/2) 3DP&I Middle-End Process Task Force #5800A: New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process Approved by A&R on 2018/07/06 Publication pending #6405: Reapproval of SEMI 3D7-0913, GUIDE FOR ALIGNMENT MARK FOR 3DS-IC PROCESS Approved by A&R on 2018/10/19 #6411: Line Item Revision of SEMI 3D6-0913 Guide for CMP and Micro- bump Processes for Frontside Through Silicon Via (TSV) Integration Use this slide for high-level topics and highlights *When listing SNARF Documents, list just the number (the Doc # implies that it is drafting) Example: 5267A: New Standard, Specification for Microfluidic Port and Pitch Dimensions Correct terms to use: -TC Chapter authorized -Authorized to ballot in Cycle X-20XX -Pending A&R -Approved by A&R -Forward to A&R for procedural review -Publication pending If space allows: *When listing Standards, remember to include the designation number and pubs date code along with Reapproval date, if applicable, and title e.g., SEMI S3-1211, Safety Guideline for Process Liquid Heating Systems SEMI E47-0301 (Reapproved 0512), Specification for 150 mm/200 mm Pod Handles

Task Force Highlights (2/2) Testing Task Force Studying the feedback of SNARF “New Standards: Guideline for Chip ID registering and tracing” from global TC members’ two weeks review The scope of this SNARF is similar with SEMI T23-0119 “New Standard: Specification for Single Device Traceability for the Supply Chain” which was submitted by Traceability TC/ Single Device Traceability Task Force Abolished this SNARF “SNARF “New Standards: Guideline for Chip ID registering and tracing” Use this slide for high-level topics and highlights *When listing SNARF Documents, list just the number (the Doc # implies that it is drafting) Example: 5267A: New Standard, Specification for Microfluidic Port and Pitch Dimensions Correct terms to use: -TC Chapter authorized -Authorized to ballot in Cycle X-20XX -Pending A&R -Approved by A&R -Forward to A&R for procedural review -Publication pending If space allows: *When listing Standards, remember to include the designation number and pubs date code along with Reapproval date, if applicable, and title e.g., SEMI S3-1211, Safety Guideline for Process Liquid Heating Systems SEMI E47-0301 (Reapproved 0512), Specification for 150 mm/200 mm Pod Handles

Thank you Staff Contact Name Dean Chang / Tiffany Huang E-mail dchang@semi.org / thuang@semi.org Phone 886-3-560-1777 #510