Fig. 5 MicroLED array with 3D liquid metal interconnects.

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Fig. 5 MicroLED array with 3D liquid metal interconnects. MicroLED array with 3D liquid metal interconnects. (A) Schematic illustration of the microLED array with reconfigured 3D interconnects. (B) Colorized SEM image of the microLED array and EGaIn interconnects. Blue and yellow colors correspond to microLED and EGaIn, respectively. Scale bar, 300 μm. (C) Colorized SEM image of 3D interconnects. The blue and yellow colors correspond to the microLED and EGaIn, respectively. Scale bar, 300 μm. (D) Photographs of light emission of the microLED array. Scale bars, 1 cm. (E) Current-voltage characteristics of microLED with reconfigured interconnects under flat or bent condition. (Photo credit: Young-Geun Park, Yonsei University). Young-Geun Park et al. Sci Adv 2019;5:eaaw2844 Copyright © 2019 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).