Semiconductor

- Kyoritsu can provide RCA to technical issue Hermetic Sealant Benefits - Kyoritsu can provide RCA to technical issue - Kyoritsu has 70% ww share in hermetic sealant Future - Low moisture permeability - Reflowable 260℃ - Low outgas - High Tg/modulus Hermetic sealant TDS 　Product Name 8723K9B package lid 5920 WLP, pkg Measurement method Viscosity mPa･s 30,000 31,000 CONE/PLATE TYPE Viscometer, 10rpm at 25C Recommended cure condition 6,000mJ/cm2 + 120C x 30 min Metal Halide Lamp Water vapor transmittance % 6.5 5.3 1.3mmt, 85C/85%RH Outgas 0.93 0.85 270C, 10 min Tg C 171 150 TMA method Α1 1/C 8.9×10－5 5.1×10－4 Α2 2.4×10－4 1.8×10－4 Elastic Modulus MPa 5,040 6,000 No.3 DUMBBELL SPEED:10mm/min

- UV Curable (+Heat Anneal) Sealant⇒High Reliability WL-CSP by Liquid sealant process Benefits After lamination of Si / Glass wafer - UV Curable (+Heat Anneal) Sealant⇒High Reliability - Vacuum Screen Printing⇒Low cost Patterning process - Vacuum Lamination⇒Void less Lamination UV Curable Sealant We can provide sealant material and information of total process solution. Process Hermetically Cavity Step 1. Seal patterning Validation result After back grinding and dicing > Screen printing on glass wafer Step 2. Wafer bonding > Vacuum bonding with Si wafer and Glass wafer In house test result Step 3. Curing Test Condition Test Result HTHH (85C/85%×1000h) No abnormal appearance TC (-40C⇔85C×1000cyc, -45C⇔100C×100cyc) JEDEC MSL1.+260C reflow Chip Bending after Dicing Very Low Chip Bending after Reflow > UV cure 6,000mJ/cm2 (200mW/cm2 × 30sec) > Heat annealing 120 C × 30min

- Realizing high resistance product Clear Molding Benefits Case1：with Glass Case2：without Glass - High productivity - Realizing high resistance product Future - Keeping good optical performance after reliability test - Wide range viscosity - Reflowable（265C） TDS Product Name 801SE-L 8776LS2 5500 5580 Prototype (w/o glass) Base Material Acrylate Epoxy Viscosity mPa・s 3000 900 170 2,400 7,100 Curing Condition mJ / cm2 1,500~3,000 3,000 + 120 C x 30 min 3,000 3,000 + 120 C x 60 min or 150 C x 30 min 1,500 + 120 C x 30 min Hardness Shore A75 D 86 D 70 D 88 D83 Volume Shrinkage % 4.4 1.8 4.2 5.8 Tg C 3 146.4 39.4 112.6 α1 1/C 6.7 x 10-5 6.9 x 10-5 2.7 x 10-4 6.8 x 10-5 α2 1.7 x 10-4 1.8 x 10-4 6.0 x 10-4 1.9 x 10-4

Achieve low load mounting for thin chip (NAND) Non Conductive Die Bonding Benefits Achieve low load mounting for thin chip (NAND) TDS 　Product Name XS-DBC-040 XS-DBC-041 Condition Color Liquid Black Visual Contact Main Component Epoxy One Component Viscosity ~ mPa･s ~ 24,500 23,280 Cone / Plate　 Thixotropic ~T.I. ~ 2 1rpm / 10rpm @ Cone / Plate Bleeding OK Ceramics Heat Cure Condition C×min 120 C×30min or 150 C×5min tan δ C 23 85 DMA method 0.2mmt E’ @ 25℃ MPa 42 3,500 E’ @ 200℃ 10 52 Shear strength 4.3 Glass / Glass, 150 C　 Outgas (TGA) % 0.8 0.2 200 C Pot Life Time 5 days At Room Temperature Guaranteed Condition 0 ~ 15 At Dark Place

Our Ag material does not have experience to semiconductor market. Ag Paste for Conductive Our Ag material does not have experience to semiconductor market. Therefore, if you have any requirement of specification or environmental spec , please let me know. Code No. PELTRON® Remarks S-3028 XJS-3051 Feature No Sulfide Low resistance No Sulfide High adhesive strength Good dispensability (150μmφ dot) Characteristics of paste Appearance Silver Base resin Epoxy Filler Ag Viscosity 16 Pa・s 160 Pa・s 25℃, E type viscometer 5rpm Shelf life 6 month (Temporary) Pot life 24h Storage Condition -18 C Characteristics after cured Cure condition 150C × 60min 170C×90sec (Snap) 140C × 30min 170C×90sec (Snap Volume resistance 1.8 × 10-4 － Ω･cm Resistance of vertical conduction 16.8 31.6 mΩ / 10μm Die share strength 21 N/mm2 CF 38 N/mm2 AF (Cu) Cu/Si, 25℃ 26 N/mm2 CF 38 N/mm2 AF (Au) Au/Si, 25℃ 14 N/mm2 CF 29 N/mm2 AF (Au) Alumina/Au, 25℃

- Doesn’t decompose wire Wire Protection Future Si 500um “Adhesive” - Doesn’t decompose wire - Doesn’t crack and delaminate under Temperature Shock test - Viscosity doesn’t expand to active sensor area TDS Product Name 8840H 5210 Base Material Acrylate Epoxy Viscosity mPa・s 41,000 39,000 (T.I. 1.5) Curing Condition mJ / cm2 4,500 ~ 6,000 6,000 + 80 C x 30 min Hardness Shore D 70 D 86 Volume Shrinkage % 3.4 4.2 Tg C 50 132 α1 1 / C 9.7 x 10-5 1.1 x 10-4 α2 2.4 x 10-4 Elastic Modulus MPa 1,132 3,100 8840H is used for automotive devices. 8840H passed automotive TS spec. (-45 ⇔105 C X 1000h) 5210 isn’t cationic-reaction type of epoxy adhesive. 5210 has less impurity ions.

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