Japan Regional Standards Committee (JRSC) Liaison Report to NARSC/ISC

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Presentation transcript:

Japan Regional Standards Committee (JRSC) Liaison Report to NARSC/ISC In conjunction with NA Standards Spring 2019 JRSC Co-chairs: Kenji Yamagata (Daifuku) Hidetoshi Sakura (Nuflare Technology) JRSC Vice chair: Supika Mashiro (Tokyo Electron) Staff Junko Collins

Contents JRSC General Information JRSC Organization Chart Membership Update Standards Related Programs TC Chapter Highlights SEMICON Japan 2018 SEMI Japan Staff Contact Information

JRSC General Information Meetings Past Meeting: Tuesday, December 11, 2018 @SEMI Japan Next Meeting: Friday, April 19, 2019 @SEMI Japan JRSC Leadership Chair-Persons Kenji Yamagata (Daifuku) Hidetoshi Sakura (NuFlare Technology) Vice Chair-Person Supika Mashiro (Tokyo Electron)

JRSC Organization Chart Co-Chair: Kenji Yamagata (Daifuku) Co-Chair: Hidetoshi Sakura (NuFlare Technology) Vice Chair: Supika Mashiro (TEL) Standardization Process Improvement (SPI) Supika Mashiro (TEL) I&C Takayuki Nishimura (SCREEN) Mitsuhiro Matsuda (KOKUSAI ELECTRIC) Silicon Wafer Naoyuki Kawai (Meiji Univ.) Tetsuya Nakai (SUMCO) EHS Hidetoshi Sakura (NuFlare Technology) Supika Mashiro (TEL) Moray Crawford (Hatsuta Seisakusho) Automation Technology Fumiyasu Ohbuchi (SIEMENS) Teruaki Ito (Mitsubishi Electric) Terry Asakawa (Vistaideal Consulting) FPD Meteorology Ryoichi Watanabe (Japan Display) Akira Kawaguchi (Otsuka Electronics) PI&C Tsuyoshi Nagashima (Miraial) Kenji Yamagata (Daifuku) Noriyoshi Toyoda (Hirata Corporation) Compound Semiconductor Materials Masayoshi Obara (SEH) TBD Gases Hiromichi Enami (Consultant) Isao Suzuki (Consutant) Masafumi Kitano (Fujikin) FPD Materials & Components Tadahiro Furukawa (Yamagata Univ.) Yoshihiko Shibahara (FUJIFILM) PV Materials Takashi Ishihara (Mitsubishi Elec.) Tetsuo Fukuda (Nihon Univ.) Kazuhiko Kashima (Consultant) Facilities Hiromichi Enami (Consultant) Isao Suzuki (Consutant) Masafumi Kitano (Fujikin) Metrics Mitch Sakamoto (Zama Consulting) TBD 3D Packaging & Integration Kazunori Kato (AiT) Masahiro Tsuriya (iNEMI) Haruo Shimamoto (AIST) PV Kazuhiko Kashima (Consultant) Masaaki Yamamichi (RTS Corporation) Liquid Chemicals Hiroshi Tomita (Toshiba Memory) Hiroyuki Araki (SCREEN) Traceability Yoichi Iga (Toshiba) Hirokazu Tsunobuchi (Keyence) As of March 26, 2019

RSC Membership Update & Approvals Masafumi Kitano (Fujikin) New co-chair of Gases Japan TC Chapter / Facilities Japan TC Chapter JRSC looks for a candidate of JRSC co-chair, since the second term of Kenji Yamagata (Daifuku) will expire at the end of 2019

Standards Related Programs Plan Tutorial SECS/GEM June 20, 2019 at SEMI Japan Tutorial GEM300 June 21, 2019 at SEMI Japan STEP S2 TBD at SEMI Japan

TC Chapter Highlights Automation Technology PI&C SEMI A2-0419 Specification for Surface Mount Assembly Smart Hookup (SMASH) Publication: very soon! (Proof is circulated) PI&C Fan-Out Panel Level Packaging (FO-PLP) Panel FOUP Task Force Panel Level Packaging (PLP) Panel FOUP Task Force FOUP: Doc.6485 (New Standard), Specification for Panel FOUP for Panel Level Packaging Loadport: Doc.6486 (New Standard), Specification for Panel FOUP Loadport for Panel Level Packaging 300 mm Tape Frame PI&C Task Force FOUP: TBD Loadport: TBD

SEMICON Japan 2018

SEMI Japan Honor Award Hiromichi Enami, Isao Suzuki, MKS Japan, Inc. Hitachi High-Technologies Corporation. Isao Suzuki, MKS Japan, Inc.

Traceability Workshop Standards Meetings and Workshops in Conference Tower during SEMICON Japan 2018 Traceability Workshop Standards meetings 23 meetings 242 participants Standards Workshops Information and Control Committee EDA Workshop - 26 Traceability Committee Traceability for IoT and Microelectronics Manufacturing Supply Chain - 15 EDA Workshop

Introduction of SEMI Standards Activities TechSPOT at Show Floor Introduction of SEMI Standards Activities 3D Packaging & Integration Committee Automation Technology Committee Information and Control Committee 3D Packaging & Integration Automation Technology Information and Control Information and Control Committee - 15 3D Packaging & Integration Committee - 37 Automation Technology Committee - 24

Deploy SEMI Standards Activities SEMI Standards Booth Standards Video Clip (with Japanese subtitle) Actual Products Display two size of PLP Panel Panels Standards Infographics 3D P&I AT I&C PI&C Traceability

Synergy, Inter-Industry Collaboration SEMI FMF Forum SMT (Surface Mount Technology) Equipment PLCs (Programmable logic controller) Service Application M2M SEMI Standards SEMI A1 “Specification for Horizontal Communication (HC) Between Equipment for Factory Automation System” SEMI A1.1-0918 “Specification for Media Interface for a Horizontal Communication (HC) Between Equipment” SMT EQ and PLC implementing SEMI Standards Standards Introduction Standards Presentation Surface mount technology: Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). https://www.electronics-notes.com/articles/electronic_components/surface-mount-technology-smd-smt/what-is-smt-primer-tutorial.php Also, we have a seminar on TechSpot and SEMI Standards Booth, and that increased synergistic effect. + +

SEMI Japan Staff Contact Committee Staff PV/PV Materials Gases/Facilities Liquid Chemical I&C Automation Technology Mizue Iwamura Coordinator, Standards & EHS miwamura@semi.org FPD M&C/FPD Meteorology PI&C Metrics Traceability EHS 3D Packaging & Integration Chie Yanagisawa Manager, Standards & EHS cyanagisawa@semi.org JRSC (including SPI TF) Compound Silicon Wafer Junko Collins Director, Standards & EHS jcollins@semi.org

Thank you!