Taiwan TC Chapter 3D Packaging & Integration Global Technical Committee Liaison Report December 18, 2018 v<1> Please save file name with version number as well (e.g., v1, v2,…) Make sure version number is the same as the file name and on the slide!

Outline Meeting Information Announcements Leadership Organization Chart Task Force Highlights Staff Contact *Optional* For slides that have no update – do not delete the slide. Place slides after the “Backup” slide or “Hide” the slide, and update list.

Meeting Information Last meeting Next meeting Tuesday, December 18, 2018 at the Taiwan Winter 2018 Meetings SEMI Taiwan office, Hsinchu Next meeting Tuesday, March 26, 2019 at the Taiwan Spring 2018 Meetings Example: Last meeting Tuesday, November 7, 2017 at the SEMI Standards NA Fall Meetings SEMI Headquarters, Milpitas, CA http://www.semi.org/en/standards-events

Announcements 3DI & Packaging Testing Task Force decided to stop the new SNARF for “Guideline for Chip ID registering and tracing”. Owing to overlap with the CAST standard. To be used for high-level announcements (e.g. merging of 3DS-IC and A&P )

Leadership Co-chairs Wendy Chen – KYEC Chien-Chung Lin – ITRI Roger Hwang - ASE *Optional* Keep text consistent as shown in Org Chart. Example “Name – Company” Note: confirm the information here is the same as Org Chart

Middle End Process Task Force Organization Chart Taiwan TC Chapter of 3D Packaging and Integration Global Technical Committee C: Chien-Chung Lin - ITRI C: Wendy Chen - KYEC C: Roger Hwang - ASE Please contact Laura (lnguyen@semi.org) if you need help creating Org Charts. Please keep “Name – Company” format. Do not use parenthesis around company name. Testing Task Force L: Ming-Chin Tsai - KYEC L: Roger Hwang - ASE L: Shang-Chun Chen - ITRI Middle End Process Task Force L: Arthur Chen - NTUST L: Mike Chang - ITRI

Task Force Highlights Middle End Process TF None Testing TF SNARF for “Guideline for Chip ID registering and tracing” has sent to 3D P&I TC global members and wait for two weeks reviews Note: After discuss with the Paul Trio (SEMI / Collaborative Alliance for Semiconductor Test), it appears that there is a considerable overlap with the CAST standard just developed, the leader decided to stop the SNARF. Use this slide for high-level topics and highlights *When listing SNARF Documents, list just the number (the Doc # implies that it is drafting) Example: 5267A: New Standard, Specification for Microfluidic Port and Pitch Dimensions Correct terms to use: -TC Chapter authorized -Authorized to ballot in Cycle X-20XX -Pending A&R -Approved by A&R -Forward to A&R for procedural review -Publication pending If space allows: *When listing Standards, remember to include the designation number and pubs date code along with Reapproval date, if applicable, and title e.g., SEMI S3-1211, Safety Guideline for Process Liquid Heating Systems SEMI E47-0301 (Reapproved 0512), Specification for 150 mm/200 mm Pod Handles

Thank you Dean Chang, E-mail: dchang@semi.org Tiffany Huang, E-mail: thuang@semi.org