Hall D Front End Electronics

Slides:



Advertisements
Similar presentations
20/Oct./2000 CF IEEE NSS 2000 at Lyon,France 1 An MWPC Readout Chip for High Rate Environment Introduction ASIC Structure & Fabrication ASIC Evaluation.
Advertisements

H1 SILICON DETECTORS PRESENT STATUS By Wolfgang Lange, DESY Zeuthen.
DCS meeting, CERN, 17 June 2002Børge Svane Nielsen, NBI1 Forward Detectors DCS Forward Detectors (FWD): T0- quartz Cherenkov V0 - plastic scintillator.
March, 11, 2006 LCWS06, Bangalore, India Very Forward Calorimeters readout and machine interface Wojciech Wierba Institute of Nuclear Physics Polish Academy.
CHL -2 Level 1 Trigger System Fully Pipelined Custom ElectronicsDigitization Drift Chamber Pre-amp The GlueX experiment will utilize fully pipelined front.
DAQ WS02 Feb 2006Jean-Sébastien GraulichSlide 1 DDAQ Hardware Architecture o General Architecture o Tracker Baseline o TOF Baseline & Options o EmCal Baseline.
July 10, 2008 PHENIX RPC review C.Y. Chi 1 RPC Front End Electronics On chamber discriminator  The strips  The CMS discriminator chips  The discriminator.
23 July, 2003Curtis A. Meyer1 Milestones and Manpower Curtis A. Meyer.
1 Hall D Drift Chamber ElectronicsFJ Barbosa Drift Chamber Review6-8 March 2007 Electronics for CDC and FDC Hall D 1.Motivation 2.ASIC Development 3.Preamp.
GLAST LAT ProjectDelta PDR/Baseline Review July 29-August 1, 2002 Section 7.3 AntiCoincidnce Detector Technical Status 1 GLAST Large Area Telescope: AntiCoincidence.
25/05/2010 RD51 Collaboration Meeting Cisbani-Musico-Minutoli / Status JLab Electronics 1 Status of the APV25 electronics for the GEM tracker at JLab Evaristo.
Pixel hybrid status & issues Outline Pixel hybrid overview ALICE1 readout chip Readout options at PHENIX Other issues Plans and activities K. Tanida (RIKEN)
Update on the HBD Craig Woody BNL DC Meeting June 8, 2005.
ASIC R&D at Fermilab R. Yarema October 30, Long Range Planning Committee2 ASICs are Critical to Most Detector Systems SVX4 – CDF & DO VLPC readout.
Hall D Electronics Review (July 23-24) Elton Smith Hall D Collaboration Meeting August 4-6.
GlueX electronics Collaboration Meeting December, 2003 Paul Smith.
L. Greiner 1IPHC meeting – May 7, 2012 STAR HFT Plans for the next year A short report on HFT/PXL plans for post May 2012 TPC – Time Projection Chamber.
Development of the Readout ASIC for Muon Chambers E. Atkin, I. Bulbalkov, A. Voronin, V. Ivanov, P. Ivanov, E. Malankin, D. Normanov, V. Samsonov, V. Shumikhin,
All Experimenters MeetingDmitri Denisov Week of July 7 to July 15 Summary  Delivered luminosity and operating efficiency u Delivered: 1.4pb -1 u Recorded:
Director’s Review of RunIIb Dzero Upgrade Installation Linda Bagby L0 Electronics Installation  System Electronics Overview u Low Voltage u High.
1 Integration and Milestones Elton Smith Hall D Detector Review October 20-22, 2004.
FPGAs in ATLAS Front-End Electronics Henrik Åkerstedt, Steffen Muschter and Christian Bohm Stockholm University.
09/10/2010 RD51 Collaboration Meeting Cisbani-Musico-Minutoli / Status JLab Electronics 1 Status of the APV25 electronics for the GEM tracker at JLab Evaristo.
PHENIX Safety Review Overview of the PHENIX Hadron Blind Detector Craig Woody BNL September 15, 2005.
D0 PMG February 15, 2001 PMG Agenda February 15, 2001  Overview (Weerts) u Detector status u Reportable milestones u Summary  Operations Organization.
MuTr Chamber properties K.Shoji Kyoto Univ.. Measurement of MuTr raw signal Use oscilloscope & LabView Read 1 strip HV 1850V Gas mixture Ar:CO 2 :CF 4.
CLAS12 Central Detector Meeting, Saclay, 3 Dec MVT Read-Out Architecture & MVT / SVT Integration Issues Irakli MANDJAVIDZE.
Juin 1st 2010 Christophe Beigbeder PID meeting1 PID meeting Electronics Integration.
Mai 31th 2011 Christophe Beigbeder PID meeting1 ETD meeting Test setup : Activities in Bari, Univ of Maryland and at Orsay Test setup : Activities in Bari,
B => J/     Gerd J. Kunde PHENIX Silicon Endcap  Mini-strips (50um*2mm – 50um*11mm)  Will not use ALICE chip  Instead custom design based on.
Organization for Micro-Electronics desiGn and Applications HGCAL Front-End Electronics Christophe de LA TAILLE, Marcello MANNELLI sept 2015.
The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 1 INFN Sezione di Pavia I Pavia, Italy.
“Medium Term”: VFAT2 + SRS readout system
Work on Muon System TDR - in progress Word -> Latex ?
"North American" Electronics
M. Manghisoni, L. Ratti Università degli Studi di Pavia INFN Pavia
ETD meeting Architecture and costing On behalf of PID group
D. Breton, S. Simion February 2012
Jinfan Chang Experimental Physics Center , IHEP Feb 18 , 2011
A General Purpose Charge Readout Chip for TPC Applications
Calorimeter Mu2e Development electronics Front-end Review
Christophe Beigbeder PID meeting
INFN Pavia and University of Bergamo
Analog FE circuitry simulation
The Ohio State University
Design of the 64-channel ASIC: status
AFE II Status First board under test!!.
A few ideas about detector grounding and shielding D. Breton
Jean-Francois Genat LPNHE Universite Pierre et Marie Curie CNRS/IN2P3
Silicon Pixel Detector for the PHENIX experiment at the BNL RHIC
FF-LYNX (*): Fast and Flexible Electrical Links for Data Acquisition and Distribution of timing, trigger and control signals in future High Energy Physics.
VMM Update Front End ASIC for the ATLAS Muon Upgrade
Upgrade of the ATLAS MDT Front-End Electronics
FIT Front End Electronics & Readout
EMC Electronics and Trigger Review and Trigger Plan
Front-end electronic system for large area photomultipliers readout
A Low Power Readout ASIC for Time Projection Chambers in 65nm CMOS
Status of n-XYTER read-out chain at GSI
RPC Front End Electronics
SVT detector electronics
BESIII EMC electronics
Status of the CARIOCA project
Silicon pixel detectors and electronics for hybrid photon detectors
RPC Front End Electronics
Electronics and DAQ Summary
RPC FEE The discriminator boards TDC boards Cost schedule.
PID meeting Mechanical implementation Electronics architecture
PHENIX forward trigger review
The LHCb Front-end Electronics System Status and Future Development
Calorimeter Upgrade The Tevatron and Dzero Upgrades
Presentation transcript:

Hall D Front End Electronics Fernando J. Barbosa 23 - 24 July 2003 barbosa@jlab.org 7/16/2019

Topics Sensors & Systems Generic Front End Implementation Summary 7/16/2019

Sensors & Systems Drift Chambers 12,000 9,120 2,880 # of Channels ADC TDC Drift Chambers 12,000 9,120 2,880 Central, Forward PMTs & HPMTs 3,405 3,405 1,205 Tagger, Start, Veto Counters Barrel , Forward Calorimeters TOF,Cĕrenkov Semiconductor Silicon -strip Polarimeter 2,048 2,048 VLPC 2,000 2,000 7/16/2019

Generic Front End Driver Rf Copper Fiber Cf CR-(RC)n Semi-Gaussian Shaper Pole-Zero ADC Pipeline To DAQ is Cd BLR Discriminator LE, CFD, ZC Digitization Preamp Preamp parameters chosen for improved S/N, signal rates, power dissipation, etc. On-detector digitization decreases cabling requirements but increases complexity and imposes more stringent requirements on reliability. Copper links should be used in high radiation areas. 7/16/2019

(Wirebonded or Packaged) Implementation Discrete Hybrid & MCM ASIC Semiconductors (SMT) Passives (SMT) FR-4 SMT Caps Semiconductor (SMT) Semiconductor (Wirebonded) Pasted Resistors Ceramic , FR-4, AlN ASIC (Wirebonded or Packaged) Ceramic , FR-4, AlN 7/16/2019

Discrete Component Availability Cheap Proven Technology Reliable Production Control Medium Density 7/16/2019

Hybrid & MCM Component Availability More Expensive Than Discrete Proven Technology Higher Reliability Production Control Medium To High Density 7/16/2019

CP01 – Hybrid ~36K channels installed in Hall B. Recently updated for harsh environments. < $4 per channel. 7/16/2019

ASIC A number of ASICs have been designed for experiments at LHC, FNAL, BNL, etc. … Some of these may fit our requirements … … But may not be available for prototyping or production! … Custom or modified design is a good alternative. Production will depend on technology availability, mask set redesign and cost. Cost justification will depend on the number of chips required. Robust Technology. Highest Reliability. Highest Density. Functional Chip Tests Required!! 7/16/2019

ASDQ ASIC Preamp, Shaper, Discriminator & Q-measurement. 8-channels for Timing and dE/dx - Q is encoded into Output Pulse Width. Designed for CDF ~ 500,000 at FNAL & CERN in several variations. 250 Chips (2000 Channels) per Wafer. Requires mask set Redesign, Production, Packaging & Testing < $15/Channel. Preamp, Shaper & BLR Discriminator & dE/dx + + Input Protect Output Driver - - 7/16/2019

Some ASIC Cost Estimates Prototyping costs depend on Technology** $1K, Qty. 5, 1.50 um AMIS $15K, Qty. 40, 0.25 um TSMC $45K, Qty. 40, 0.13 um IBM Engineering Runs Mask sets may cost ~ $45K Cost per channel ~ $1 *Preliminary results show that deep sub-micron processes at 1.8 um and 1.3 um are radiation tolerant. **Source: MOSIS 7/11/2003 7/16/2019

Support Systems Ancillary Detector PCBs Thermal Constraints Cabling – Routing & Performance Power Supplies & Distribution Grounding Slow Controls … 7/16/2019

Summary … The front end electronics requirements for Hall D are not much different from those in Hall B. Updating the Present Hall B architecture is a viable option but requires preamp, post-amp/discriminators, TDCs, ADCs (?) ... ADB Crates TDC Crates Preamp CP01H Twisted Diff. Pair Shielded & Round Detector To DAQ is Analog dECL Amp & Discriminator 7/16/2019

Summary (cont.) The ASDQ ASIC needs to be redesigned but is a cost effective option for system integration – only additional TDCs are required. … simple and reliable … Other ASICs will become available in the near future (i.e., CARIOCA) and may be cheaper if costs shared with other experiments or institutions. TDC Crates Preamp ASDQ-type Twisted Diff. Pair Shielded & Round To DAQ Detector is LVDS 7/16/2019