CMS Calorimeter Trigger Phase 1 Upgrade

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Presentation transcript:

CMS Calorimeter Trigger Phase 1 Upgrade P. Klabbers1, T.Gorski1, W. H. Smith1, S. Dasu1, K. Compton1, M. Schulte2, M. Bachtis1, I. Ross1, A. Farmahini-Farahani1, R. Fobes1, D. Seemuth1, M. Grothe1, A. Gregerson1 1University of Wisconsin, Madison, WI, USA 2AMD Research TWEPP 2011 September 28, 2011 The pdf file of this talk is available at: http://indico.cern.ch/contributionDisplay.py?contribId=100&sessionId=16&confId=49682

Current CMS Regional Calorimeter Trigger (RCT*) Low latency system based on GaAs ASIC Technology Crates operate synchronously Input aligned Sharing aligned Good performance but limited flexibility, algos in ASICs No readout of trigger data Must rely on input and output systems’ data Design started in the late 1990’s and in 2016 parts the system will have operated at CMS for >9 years Validation of production boards some 2-3 years before installation System has been very reliable so far Aging of boards and parts, and obsolescence will make repair increasingly difficult Rear Front *For more info on the RCT see TWEPP 2009, 2008, and 2007 proceedings

Current CMS Regional Calorimeter Trigger Physically large 18 9U trigger crates and a 6U clock crate filling 9 LHC racks > 300 9U and 6U boards in operation 1026 4-pair copper cables for links, 108 SCSI type for data sharing PLCCs and ASICs (ECL) take up more physical space than modern FPGAs Almost 5 kW power consumption per rack Via two 380 VAC (3f) to 48V DC Power supplies DC-DC converters on board Custom 48V power chassis takes 9U of rack space per rack RCT in CMS Service Cavern RCT Receiver Card *For more info on the RCT see TWEPP 2009, 2008, and 2007 proceedings

CMS Calorimeter Geometry EB, EE, HB, HE map to 18 RCT crates Provide e/g and jet, t, ET triggers

Current Calorimeter Trigger Algorithms e/g Rank = Hit+Max Adjacent Tower Hit: H/E < Small Fraction Hit: 2 of 5-crystal strips >90% ET in 5x5 Tower (Fine Grain) Isolated e/g (3x3 Tower) Quiet neighbors: all 8 towers pass Fine Grain & H/E One of 4 corners 5 EM ET < Thr. Jet or t ET 12x12 trig. tower ET sliding in 4x4 steps w/central 4x4 ET > others t: isolated narrow energy deposits Energy spread outside t veto pattern sets veto t Jet if all 9 4x4 region t vetoes off

CMS Upgrade Trigger Strategy Constraints Total output rate of L1 Trigger is 100 kHz Input rate increases 2-10 times over LHC design (1034 cm-1s-2) Number of interactions in a crossing (pileup) increases 4-10 times Thresholds will need to remain about the same to fulfill physics needs Strategy for Phase 1 Calorimeter Trigger (operating 2016+): Present L1 algorithms inadequate above 1034 or 1034 w/ 50 ns bunch spacing Pileup degrades object isolation (electrons and taus) More sophisticated clustering & isolation needed for busier events Process with full granularity of calorimeter trigger information Current FPGAs allow more complexity and flexibility in algos and tuning of isolation and energy cuts Initial L1 Trigger simulations show a significant rate reduction with upgraded calorimeter trigger

CMS Upgrade Calorimeter Trigger Algorithm Development HCAL Δη x Δφ=0.087x0.087 e/γ τ jet η φ Particle Cluster Finder Applies tower thresholds to Calorimeter Creates overlapped 2x2 clusters Cluster Overlap Filter Removes overlap between clusters Identifies local maxima Prunes low energy clusters Cluster Isolation and Particle ID Applied to local maxima Calculates isolation deposits around 2x2,2x3 clusters Identifies particles Jet reconstruction Applied on filtered clusters Groups clusters to jets Particle Sorter Sorts particles & outputs the most energetic ones MET,HT,MHT Calculation Calculates Et Sums, Missing Et from clusters

Cal Trig. Efficiencies & Rates (CMS Upgrade) Isolated Electrons Taus Upgrade Existing Upgrade Existing 4x Reduction in rate at 25 pileup events per crossing & improved efficiency Isolated Electrons Isolated Electrons Taus Upgrade Existing Upgrade Existing

Upgrade Compact Calorimeter Trigger Architecture* 2 - 5 Summary Cards 21 Region Processors x10η, x26φ 21 Input Processors x8η, x24φ Regions Sort e/g & t Build & Sort Jets ECAL Tower Energy (8bit) Info (1bit) HCAL Tower Energy (8bit) Info (1bit) Process Process Process Tower Energy (9bit) Veto (1bit) X8 e/g and t’s x8 Jets Regional results: top e/g’s and t’s, 4x4 tower sums w/ ½ tower res, ECAL ET To Global Trigger Possibility to run different summary cards in parallel to optimise e/g, t, jet or energy sum path. *Alternative to this pipelined architechture: See talk by G. Iles

Technology Upgrades for the Compact Calorimeter Trigger A new system begets new hardware mTCA (AMC standard) Compact, hot swappable boards System shrinks, now need only six 7U crates in one rack Operate new systems in parallel Optical links instead of copper Compact, optical ribbon cables for data transmission Need to align links (data sharing, etc.) Advanced Monitoring and Configuration mTCA Controller Hub (MCH) uses TCP/IP protocols 100Base-X Ethernet over backplane IPMI for initialization and monitoring Initialization and Configuration over LAN FW upgrade and maintenance Algorithm Flexibility with newer FPGAs Currently designing for XILINX Virtex-6 Integrated GTX links for data transmission (up to 6.5 Gbps)

1000Base-X Ethernet Demonstrator Running lightweight IP (lwIP) TCP/IP stack under Xilkernel Connected to departmental network Test #1: iPerf Xmt/Rcv between ML506 and PC: Rcv: 14 Mbps Xmt: 12-19 Mbps Test #2: Echo server between two ML506 bds Both boards running server and client app Test Board to Connect to µTCA Fabric A GbE Running on SATA Cable Benchmark program Get ML506 board going on the ethernet uTCA style ethernet TCP/IP stack rather than UDP protocol Shows bandwidth is sufficient for type of work, flashing, etc. Xilinx ML-506 Virtex-5 Evaluation Board

MMC Project MMC: Module Management Controller IPMI endpoint for managing cards in µTCA Crates UW Project: A “ground-up” implementation of an MMC based on an Atmel AVR32-bit Microcontroller Supports the standard IPMI commands dictated by the specifications, plus additional commands for operations outside the scope of the MMC specification A full list of commands in backup slides Communicate with module prior & after FPGA initialization via LAN connection to MCH card in µTCA Crate Used for: Power control & monitoring (incl. over-voltage/temp. protection) FPGA Boot Image Selection & Load Control Post-boot FPGA Configuration (e.g., geographical card IP address) Used on multiple CMS electronics upgrade designs

UW MMC Reference Design Hardware Block Diagram (AMC Board) Module Backend Power Temp. Sensor (TMP36) Temp. Sensor (TMP36) FPGA Config Flash ADC Inputs Backend Pwr Enable Config Load Path Primary FPGA Atmel UC3A1512 Microcontroller (512KB Flash, 64KB SRAM) Boot Image IPMB (I2C) Select FPGA Flash Load GA0-GA2 FPGA CPU Reset On the BU AMC13 card IPMI used to talk to controller Alive using maintenance +3.3V SPI memory Which hardware image to load into the FPGA and configuration information (IP Address) Augmented SPI (Post boot config path) Console SIO Interface Blue (Non-volatile config settings) 8KB SPI EEPROM LED1 Handle µSwitch LED2 IPMI LEDs

MMC Project: Hardware & Remote Access Prototype Development Platform IPMI tool through a linux shell JAVA tool from NAT (MCH manufacturer) Sensor display via NATView (Java LAN application for MCHs mfg’d by NAT GmbH) Remote Linux Shell Access via ipmitool

Flash-over-LAN (FoL) Objective: Support remote update of FPGA Flash over the MicroTCA GbE connection FPGA-based server (Microblaze processor) Uses TCP/IP stack (lwIP) running under Xilkernel Common driver API for supporting different Flash implementations (e.g., BPI, SPI) with device-specific drivers PC-based client Connects to server on AMC card to deliver new image (supports MCS and binary file formats for Flash image) Development Platforms: Xilinx ML605 eval board for BPI flash, BU AMC13 for SPI flash Programs ML605 parallel flash about 3x faster than Xilinx iMPACT program Using the cable is iMPACT, over LAN can program remotely. Maitenance has flash over LAN mode but not trigger mode. FoL server running only during maint. mode.

Flash-over-LAN (FoL) Block Diagram MCS File Xilinx FPGA (AMC Card) TCP/IP Connection (GbE) FoL Common Server Device- Specific Driver Flash I/O Core FoL Client (PC) FPGA Flash (can be serial or parallel Flash memory) Advantages of the FoL Architecture: Primarily C/C++ implementation, as opposed to HDL (more productive development environment) Client model can support additional file types as necessary (e.g., SREC or binary) Common Server can support different device types as necessary via Device-Specific Driver interface Can manage multiple boot images and FPGAs on a single AMC card

Data Alignment Study Absolutely necessary for tower-level data sharing across calo regional boundaries Problem: Several sources of misalignment Length of connection, phase and latency variation in SerDes links, and phase variation of clocks between clocks and cards 4 Test Cards in a custom 2x2 test fabric Virtex-5 Rocket I/O GTP links LHC style clock-based timing Local Trigger Timing and Control (TTC) system for clock generation Link synchronization test bed Simulates 2 separate crates of 2 cards each Goal: demonstrate alignment of 56 separate channels all operating on the same time base Would like for data coming in, but more for sharing SerDes links lose some of the lock-step – timing wise we need them to look like they are in lock step. Little boundary level for alignment, look for special character, add necessary amount if ahead of schedule. Links will have predicted latency. In budget for latency allow for phase differences between TTC. Alignment physical length of connections, phase variation in links, and phase variation between clocks This method catches all sources of alignment uncertainty in one method. Latency on Rocket I/O links varies by a minor clock cycle +/- AUX Cards Virtex 5 GTP max 3.25 Gbps test run around 1 Gbps Links to TTC run synch. Very short elastic buffer at receiving end (fifo) min length - just enough to take care of short term clock jitter (all versions of TTC)

Data Alignment Study: 2x2 Firmware Test Bed Fabric Ch15: Config Channel (Ring) 12 Inter-Card + 2 Intra-Card Loopback X/R channels per board (master) 1 (slave) 40 MHz Clk 4X (Passive) 56 total active channels Ch14: Align Cmd Brdcast 40 MHz “Crate 1” 4X TTCvi “Crate 2” 4X 40 MHz 4X 2 (slave) 40 MHz Clk 3 (slave) 4X

Data Alignment Method 4 test cards 56 links at 1.6 Gbps synchronized: Identify a target latency for each SerDes pair Set scheduled launch and arrival times for data at all SerDes endpoints per a common global reference, such as the Bunch Crossing 0 signal Launch/arrival times derived from design Measure actual latencies by launching special test characters (8b/10b K char) from Tx links at scheduled times Measure actual arrival times of K chars at Rx links in comparison to expected arrival times from design Automatically compensate by adding delay at Rx end Can add delay in fractions of LHC clock, depending on link rate 4 test cards 56 links at 1.6 Gbps synchronized: proper alignment was verified using test pipelines to compare expected data (from links) with actual data (generated in the local pipeline).

Cal Trigger Processor Prototype Card Block Diagram Backplane Side Front Panel Side 12-Channel Optical Receiver ECAL Eta Sharing Links Link Clock Conditioning Circuitry SDRAM ECAL 12-Channel Optical Receiver Front End FPGA XC6VHX250T (GTX links) 12x8 Region Processing FPGA XC6VHX250T (GTX links) Phi/Corner Sharing HCAL 12-Channel Optical Receiver HCAL 12-Channel Optical Receiver FPGA Image Flash (Parallel) TTC/DAQ to AMC13 Regional Outputs MMC 12-Channel Optical Transmitter Fabric A GbE (MCH1) Secondary Power Supplies IPMI

SLHC Regional Calorimeter Trigger Backplane Signal Allocation Sharing I/O Slots 2-3 & 10-11 Processor Card Slots 4-9 Fat Pipe (via MCH1 or MCH2) Custom Passive Fabric (CPF) Φ-Sharing Ring

SLHC Upgrade RCT Crate HCAL/ECAL TPGs from LIP oSLB & Minn. µHTR Cards Clock/Control from TTC Crate Output to DAQ Outputs to GCT PM2 Spare Slot Sharing I/O Card Sharing I/O Card Cal Trig Processor Cal Trig Processor Cal Trig Processor BU AMC13* Cal Trig Processor Cal Trig Processor Cal Trig Processor Sharing I/O Card Sharing I/O Card Spare Slot (uTCA form factor, Vadatech VT892 style layout) PM1 MCH Right Sharing Data to neighbor crate (X, R MTP Ribbon) Left Sharing Data to neighbor crate (X, R MTP Ribbon) HCAL/ECAL TPGs from LIP oSLB & Minn. µHTR Cards Ethernet Uplink(s) *See talk in XTCA working group by E. Hazen

Calorimeter Trigger Evolution Present HCAL HTR Cards To DAQ Existing Copper Cables Regional Calorimeter Trigger Via HCAL DCC2 To DAQ Via GCT Existing Copper Cables New Optical Receiver ECAL TCCs To DAQ ECAL Indiv. Fibers (LC) Via ECAL DCC Final HCAL uHTR Cards Trigger Primitive Optical Patch Panel Optical Ribbons To DAQ Via BU “AMC13” ECAL Opti. Ribbons SLHC Cal Trigger Processor Cards HCAL Opti. Ribbons To DAQ ECAL TCCs Optical Ribbons Via BU “AMC13” To DAQ New Optical Transmitter Via ECAL DCC Interim

Conclusions and Future Plans A new CMS Compact Calorimeter Trigger will meet and exceed the needs of the experiment as the luminosity and pileup increase Flexible, low latency design using modern FPGAs Ease of maintenance and operation with mTCA standard Small size allows installation in parallel to validate system with current version The new tools and techniques to operate the system are falling into place Flash over LAN, MMC with IPMI, Data Synchronization Technique Goal is to have demonstrator at the end of 2011 Expect to remove some of existing calorimeter cables and replace with optics in 2013 Full system installed by 2016

Backup Slides

UW MMC IPMI Command List Get Device ID Cold Reset Broadcast “Get Device ID” Set Event Receiver Get Event Receiver Platform Event (a.k.a. “Event Message”) Get Device SDR Info Get Device SDR Reserve Device SDR Repository Get Sensor Hysteresis Set Sensor Threshold Get Sensor Threshold Set Sensor Event Enable Get Sensor Event Enable Get Sensor Reading Get FRU Inventory Area Info Read FRU Data Write FRU Data Get PICMG Properties FRU Control Get FRU LED Properties Get LED Color Capabilities Set FRU LED State Get FRU LED State Get Device Locator Record ID FRU Control Capabilities Set Backend Power Get Backend Power Set Payload Manager Settings Get Payload Manager Settings Get Fault Status Set Boot Mode Get Boot Mode Set Sensor Alarm Mask Get Sensor Alarm Mask Set Handle Override Set Current Requirement Set Analog Scale Factor Get Analog Scale Factor Get Time Statistics Set System Time Get System Time Get Nonvolatile Area Info Raw Nonvolatile Write Raw Nonvolatile Read Check EEPROM Busy EEPROM Erase Poll FPGA Config Port FPGA Config Read Status Register FPGA Config Write Control Register FPGA Config Write Data FPGA Config Read Data FPGA Config Nonvolatile Header Write FPGA Config Nonvolatile Header Read NetFn Class Color Code Application (06h/07h) Sensor/Event (04h/05h) Storage (0Ah/0Bh) PICMG (2Ch/2Dh) Custom (32h/33h)

Tx Side Alignment Block Diagram Scheduled Delay Launch Delay Counter Data Processing Logic in FPGA Fabric SERDES Tx Port (Dedicated Logic) Ena TC Link Ena Control Global Align Cmd Tx Data Tx Parallel Data MUX Comma Align Char (Locally-Generated Control Characters

Rx Side Alignment Block Diagram Delay Regs SERDES Tx Port (Dedicated Logic) Trigger Rx Data Data Processing Logic in FPGA Fabric Delay Select MUX Rx ParallelData Yes/No (Dly Src Sel Mux) =Align Char? Global Align Cmd Control Fixed Rx Delay Reg Ena TC ACC Arrival Counter Scheduled Arrival Fixed Rx Delay