Fred Nobrega September 4, 2019

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Presentation transcript:

Fred Nobrega September 4, 2019 QXFA115 CMM Bump Resolved Fred Nobrega September 4, 2019 Coil Working Group Meeting

Introduction QXFA115 CMM measurements indicate a bump on the coil about 0.09 mm above the coil outer surface that runs longitudinally about 2 m long and is about 5 turns wide on the transition side of the coil. A similar but smaller bump is on the coil about 0.05 mm above the coil outer surface that runs longitudinally about 3 m long and is about 5 turns wide on the non-transition side of the coil. The FNAL CMM plots are 2D cross sections looking from the return end of the coil to the lead end and are a best fit to the OD and midplane. The coil transition (T) side (layer jump) is on the right side of the plot and the non transition (NT) side is on the left side of the plots. The OD tolerance is ± 0.127 mm. Red arrows on the FNAL CMM plots are used when the measurement is greater than 0.127 mm on the CMM plot Pressure film (Fuji) used to obtain imprint of potted coil within the impregnation tooling. The results were negative, no bumps Coil WG Mtg, Sep 4, 2019 — QXFA115 CMM Bump Resolved

Location of CMM Measurements From LE bump size and longitudinal location Bump source is S2 glass delamination CMM probe pressure is very light No signal from Fuji pressure film Measured from Lead End: T, mm Dial Indicator, mm Station 1 – 70 0 0 Station 2 – 270 0.062 0 Station 3 – 327 0.048 0 Station 4 – 740 0.091 0.09 Station 5 – 1140 0.013 0.15 Station 6 – 1540 0.069 0.13 Station 7 – 1940 0.033 0.13 Station 8 – 2340 0.053 0.10 Station 9 – 2740 0.042 0.13 Station 10 – 3140 0.051 0.14 Station 11 – 3540 0 0.13 Station 12 – 3940 0.074 0.08 Station 13 – 4316 0 0 Station 14 – 4426 0 0 Coil WG Mtg, Sep 4, 2019 — QXFA115 CMM Bump Resolved

QXFA115 Video of Delamination Coil WG Mtg, Sep 4, 2019 — QXFA115 CMM Bump Resolved

QXFA115 Fuji Film in Impregnation Tooling Station 10, 3540 mm Transition side Coil WG Mtg, Sep 4, 2019 — QXFA115 CMM Bump Resolved

Results Fuji film of coil within impregnation fixture after potting showed no bumps/ridge. Applying minimal pressure on the dial indicator over turn #7 has about 0.13 mm deflection on the coil OD. CMM measurements indicating bumps on coil OD is delamination between the trace and the coil OD. Coil WG Mtg, Sep 4, 2019 — QXFA115 CMM Bump Resolved