FPGAs For High-Reliability Applications PRODUCTS FPGAs For High-Reliability Applications Defense Avionics Space

Hi-Rel Market Environment Total Defense budget decline continues Defense electronics spending to increase Fewer new programs being developed - older systems being rejuvenated with technology updates Fewer suppliers left to serve the market Hi-Rel FPGA market is growing, traditional Military business still strong HI-Rel FPGAs expanding into new applications - commercial aerospace, automotive

Aerospace and Defense Market Dynamics Large,Growing Electronics Equipment Market - $ 61B in 2001 - “Technology Insertion” Specialized IC and Supply Requirements - Extended Temperature, Hermeticity - Supply Longevity Aerospace Shift to “Best Commercial Practice” - Leading Technology, Off-the-shelf - “Performance-based”

Military/Civil Aerospace Market WW Electronic Equipment Production

Hi-Rel Leadership Xilinx is the Hi-Rel PLD leader - first to offer military FPGAs (shipping MIL-STD-883 product since 1988) - active Standard Microcircuit Drawing (SMD) program (XC2000/3000/4000/4000E/4000XL/PROMs) - first to offer advanced surface mount packages (ceramic quad flat pack with tie bar) - highest density FPGA - received QML Certification Nov. 20, 1997 Hundreds of Hi-Rel/Military/Aerospace applications using Xilinx - electronic warfare, missile guidance and targeting - radar and sonar - communications, signal processing and intelligence - aerospace, avionics and space

The FPGA Advantage Xilinx FPGAs have become the technology of choice for Hi-Rel applications No longer the need to use ASICs - density - time to market - design flexibility - reprogrammability/upgradability - system feature integration - no NRE - standard, off the shelf - full product line support - committed supplier

Xilinx High Reliability Products QML /Best Commercial Practice Performance-based - Electrical and Environmental requirements - Plastic and Hermetic Devices - Pricing Reliability of Supply - Process/Mask Control - Xilinx Commitment Off - the - Shelf ASIC solution QML /Best Commercial Practice - Leading-edge FPGA Products - MIL-PRF-38535 Compliant

Mil/Aero Product/Process Roadmap 25K Gates 85K Gates +1M Gates XC4000E 0.60 XC4005E XC4010E XC4013E XC4025E XQ4000EX 0.50 XQ4028EX XQV 100 XQV 300 XQV 600 XQV 1000 XQ4000XL 0.35 XQ4013XL XQ4036XL XQ4062XL XQ4085XL Virtex XQV 0.25 Virtex II Virtex 0.18 1997 1998 1999 2000 1

Leadership in Mil/Aero Plastic Cost-effective alternative where hermiticity is not required Processed to QML Flow - Test at 125°C (Tj) - Ruggedized to met HAST Testing - SMDs available Product “Pedigree” - Designated mask set(s) - Stringent change control - Extensive characterization Mil temperature range Mil/Aero Market support infrastructure

Plastic Package Qualification Unbiased Pressure Pot - 96 hours, 121°C, 2 atmospheres Temperature Cycling (liquid to liquid) - 500 Cycles per method 1011, Cond C of Mil-STD-883 Temperature Cycling (air to air) - 500 cycles per method 1010, Cond C of MIL-STD-883

Plastic Package Qualification Resistance to Solvents - Method 2015 of MIL-STD-883 Solderability - Method 2004 of MIL-STD-883 Lead Fatigue - Method 2004 of MIL-STD-883

Plastic Reliability Monitor High Temperature Operating Life(HTOL) Extended Static Life Test Temperature Humidity (85/85) Moisture Test Thermal Shock Temperature Cycling Highly Accelerated Stress Test (HAST) Solderability Mark Permanency/Lead Fatigue/Physical Dimension

SPROM PRODUCTS

PACKAGE OFFERINGS * Do not use for new designs.

PRODUCT OFFERING * Do not use for new designs.

Summary Strong commitment to market Broadest line of Hi-Rel products Integral part of Corporate product strategy Continued new product development Superior product life cycle management