Physics models & machine learning for microelectronics reliability

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Presentation transcript:

Physics models & machine learning for microelectronics reliability Alejandro Strachan Date: July 15, 2019 Microelectronics Integrity Meeting (MIM) , August 6-7, 2019 Indianapolis

Device & materials modeling … from first principles ASSURE Device reliability Radiation damage Molecular dynamics Million Atoms=> Devices=>TCAD Demonstrated coupling MD ↔ Tight Binding Recent breakthrough MD → TB Density functional theory Materials Science Device engineering www.in3indiana.com

From atoms to devices Resistive switching devices MD: amorphous structures DFT defect energy levels Mesoscale charging model Current transients Resistive switching devices Electric double layers Phase change materials www.in3indiana.com

Machine learning & device models Learn from data, by example, without (or with little) underlying physics/chemistry information ML models of Mat/Dev Props Dimensionality reduction in multiscale modeling Design of experiments / optimization Interatomic potentials via machine learning www.in3indiana.com

Machine learning & device models Materials & devices specific challenges We do not have lots of data & data acquisition can be costly …but we have physics Uncertainties in input data with disparate origins High consequence decisions (?) and regulated sectors We like to understand to have confidence in predictions Develop and sustain open cyberinfrastructure for data & models www.in3indiana.com

Phase change materials Flash heating (200 ps) Can non-equilibrium loading of the PCM Reduce timescales required for melting/amorphization? Achieve states not available via equilibrium thermodynamics?

Non-equilibrium states 200 ps Flash heating Non-eq. flash 6,000 MD simulations (to explore 4 dimensions)

Sequential design of experiments Can ML help reduce the number of experiments? Dataset State of knowledge DONE? Update dataset Information acquisition function Query information source Pandita P, Bilionis I, Panchal J. Journal of Mechanical Design. 2016 138, 111412.

Comparing information acquisition functions Collaboration with Prof. Bilionis, Purdue

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