ITRS Factory Integration Presentation Mani Janakiram & Junji Iwasaki July 2005 Global Co-Chairs: Europe: Arieh Greenberg Japan: Shige Kobayashi, Michio Honma Korea: TBD Taiwan: Thomas Chen US: Mani Janakiram ITRS Factory Integration TWG

ITRS Factory Integration TWG Agenda Scope and Difficult Challenges FI Current Status Technology Requirements Manufacturing Strategy Evolution Top Factory Integration Focus Areas Summary ITRS Factory Integration TWG

ITRS Factory Integation TWG 2017/4/6 Factory Integration Scope and Drivers UI Factory Operations Production Equipment Factory Information & Control Systems AMHS Facilities Si Substrate Mfg Wafer Mfg Chip Mfg Product Mfg Distribution Reticle Mfg FEOL BEOL Probe/Test Singulation Packaging Test Increasing cost & Cycle time implications Factory is driven by Cost, Quality, Productivity, and Speed: Reduce factory capital and operating costs per function Faster delivery of new and volume products to the end customer Efficient/Effective high volume production, high reliability, & high equipment reuse Enable rapid process technology shrinks and wafer size changes DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 FITWG 2000

Key Technologies that will Impact Factory Design ITRS Factory Integation TWG 2017/4/6 Key Technologies that will Impact Factory Design 2005 and future years are targeted to meet productivity and capture technology requirements Key process and device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho (EUVL), New Device Structures, new materials and the next wafer size conversion Near Term Years Year 2005 2006 2007 2008 2009 Technology trend (nm) 80 70 65 55 50 Wafer Size (mm) 300 Start Planning for 450mm Started discussions Long Term Years Year 2010 2011 2012 2013 2014 2015 2016 2017 2018 Technology trend (nm) 45 40 35 32 28 25 22 20 18 Wafer Size (mm) 300 450 EUVL in Production? New Device Structures? Next Wafer Size in Production? ITRS Factory Integration TWG FITWG 2000

Difficult Challenges Summary ITRS Factory Integation TWG Difficult Challenges Summary 2017/4/6 E=Economic/Business P=Process Technology M=Manufacturing Near Term: 2005 to 2009 >45nm Responding to rapidly changing and complex business requirements [E] Meeting growth targets while margins are declining [E] Managing ever increasing factory complexity [M] Meeting factory and equipment reliability, capability or productivity requirements per the roadmap [M] Meeting the Flexibility, Extendibility, and Scalability needs of a cost effective, leading edge factory [M] Meeting process requirements at 65nm and 45nm nodes running production volumes [P] Increasing global restrictions on environmental issues [E] Long Term: 2012 to 2018 <45nm Post conventional CMOS manufacturing uncertainty [P] Next Wafer Size and Emerging factory paradigm changes [M] [E] Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth for both efficiency and effectiveness DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 FITWG 2000

Some Projected Attributes of a 300mm < 45nm Fab ITRS Factory Integation TWG Some Projected Attributes of a 300mm < 45nm Fab 2017/4/6 Wafer Data Standard For Packaging Data standards and Systems for Rapid Mask Set Creation Very Fast Cycle time Fabs for Hot & Normal lots Equipment & Systems designed for High Mix operation 100% Direct Tool Delivery AMHS Aggressive NPW Reduction & Efficient Spares Mgmt Full Wafer Level Tracking & Recipe/Parameter Changes Systems Scaled for > 50k wspm Ubiquitous APC; Rapid Process Matching & New Product Qualification Manufacturing Execution Systems Equipment Engineering Capabilities Equipment Control Systems Equipment & Process Data SECS Control Line APC FDC SPC Recipes Factory Scheduler And Material Control Yield PCS E-Diag EPT Equipment Data Acquisition (EDA) Standards to get Rich Equipment Data Offline tools to test schedule rules and rapidly put in Mfg Partner, Customer Or Supplier Pervasive E-Diagnostics Standard, Detailed Equipment Performance Tracking (EPT) Data FITWG 2000

FI Sub team – July 2005 Status ITRS Factory Integation TWG FI Sub team – July 2005 Status 2017/4/6 Subteam July 2005 1 Factory Operations (FO) Focus: 1) Reduce mfg cycle time, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix Completed Technology Requirements table and potential solutions tables. No major changes to the technology table anticipated. Working on the summary. 2 Production Equipment (PE) Focus: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement Completed Technology Requirements table and potential solutions tables. Few changes to the technology table is made. Completed rev0 write-up and impact of focus area on PE 3 Automated Matl Handling Systems (AMHS) Focus: 1) Increase throughput, 2) Reduce Average Delivery times, 3) Improve Reliability Completed Technology Requirements table and potential solutions tables. Updating the values for peak MPH specific to high thr’put bay. Working on the summary. 4 Factory Information & Control Systems (FICS) Focus: 1) Increase Reliability, 2) Increase Factory Throughput, 3) Handle data explosion, 4) Reduce or Maintain Mask Shop Cycle Time Completed Technology Requirements table and potential solutions tables. Small changes to the technology table are made. Working on the summary. 5 Facilities Focus: 1) Reduce Costs 2) Utility 3) Footprint 4) Reduce equipment installation time Completed Technology Requirements table and potential solutions tables. Few changes to the technology requirements table are made. Working on the summary. 6 Other – Focus area & Cross-cut items 2005 FI chapter will include sections on 1) Focus areas 2) Text on AMC, EMI, ESD and cross-TWG issues. Completed technology requirements, potential solutions, focus area and cross-cut challenges DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 FITWG 2000

Factory Operations Technical Requirements ITRS Factory Integation TWG 2017/4/6 Factory Operations Technical Requirements Speed and Flexibility Goal is to reduce cycle time at all levels of manufacturing Hot lots and super fast hot lots are important due to the need to qualify processes and introduce new products to the market place Normal lot cycle time is important to meet customer delivery time requirements. Long production cycle times for leading edge products also increases the risk that the part may be scrapped since it may no longer be needed when it exits production or it may have been redesigned while being manufactured Key Objectives: 1) Reduce mfg cycle times, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix Solution exists Solution being developed Solution required FITWG 2000

Production Equipment Technical Requirements ITRS Factory Integation TWG 2017/4/6 Production Equipment Technical Requirements Productivity Non-Product Wafers or NPW usage must be reduced over time. Each NPW purchased or reclaimed has a direct cost on manufacturing When NPW’s are run in the manufacturing line, they reduce the number of production wafers that can be run since they require equipment time Key Objectives: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement Solution exists Solution being developed Solution required FITWG 2000

Material Handling Technical Requirements Key Objectives: 1) Increase throughput for Traditional and Unified Transport, 2) Reduce Average Delivery times, 3) Improve Reliability Solution exists Solution being developed Solution required

FICS Technical Requirements Key Objectives: 1) Increase Reliability, 2) Increase Factory Throughput, 3) Reduce or Maintain Mask Shop Cycle Time, 4) Reduce Costs Solution exists Solution being developed Solution required

Facilities Technical Requirements Key Objectives: 1) Factory Extendibility, 2) AMC, 3) Rapid Install/Qualification, 4) Reduce Costs Solution exists Solution being developed Solution required

ITRS Factory Integation TWG 2005 FI Focus Area 2017/4/6 Focus Areas July 2005 Status 1 Airborne Molecular Contamination (AMC) Implications at < 45nm process technologies (Now -> 2006) AMC tables will be in YE and the reference text will be in PE and Facilities. 2 Rapid Equipment Install and Qualification (Now ->) Rapid equipment install and adaptor plate ideas being formed by Facilities. Adaptor plate per tool type. Need a standard among the suppliers. 3 “Proactive Visual” manufacturing (Now ->) Need more clarity; Minifab versus Megafab; STRJ needs help to promote visualization; This can be treated as a solution. 4 Next Wafer Size (NWS) Transition (2005 -> 2012) FI will work with International Sematech and will continue to define technology requirements for NWS FI Factory Integration focus areas: AMC, NWS, and Proactive Visualization FITWG 2000

AMC Requirements - Current status AMC limits are currently addressed in the Yield Enhancement YE TWG, and the Wafer Environmental Contamination Control WECC subTWG Fab environment requirements have not been defined yet in the FI TWG Factory Integration Roadmap Yield Enhancement Roadmap Fab environment Technology Requirements Wafer/Tool environment Wafer

Rapid Tool Install - Adapter Plate Concept Exhaust From Tool Supplier Utilities Into Process Tool Facility Utilities Into Adapter Plate (water, gasses, etc.) Facility Power Into Adapter Plate Exhaust To Facility

Proactive Visualization ITRS Factory Integation TWG 2017/4/6 Proactive Visualization Comprehensive structured P/V matrix be developed for SoC manufacturing Strategic issues be broken down and mapped into P/V matrix Solutions and needs bilaterally be traceable through P/V matrix New IDM New Foundry Business Short product cycle Small order size Combinations of Solutions Varying product volume LMHV HMLV New Production Methods Design & Manufacturing Integration Strategic Issues solutions Cost Delivery Quality Energy Products Factory Operation Factory Resource Metrics Development and Proper Targeting Needed Visualization Proactive Visualization of fab activity and goal of operation are to be shown in response to the target production model such as HMLV or LMHV, and so on. The fab operation targets are needed to be expressed against the cross points in this 7 by 3 matrix. Each cross points are to be optimized in accordance with the over all optimization over the matrix. In the 2005 ITRS Road Map Quality*Factory Resource, Delivery*(Factory Resource, Products, and Factory Operation) are discussed. DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 FITWG 2000

Cycle Time as a function of Lot Size ITRS Factory Integation TWG 2017/4/6 Cycle Time as a function of Lot Size Objective Lot Size 25 12 6 2 Current R/M (Non Hot Lot) Current R/M (Super Hot Lot) Next R/M Nominal Lot Size The cycle times have been defined such that with a lot having 25 wafers is considered to be of the major lot size (non hot lot as well) and with 6 wafers to be of the super hot lot size at least by 2004, and the technical requirements are discussed and put into ITRD Road Map. Because of diversification in the devices especially in SoC category High Mix/ Low Volume production was discussed and considered to be included in the Road Map in order to facilitate highlighting emerging High Mix / Low Volume production needs. Because of the tendency in the order size becoming smaller and the requirement of shorter cycle time, the manufacturing lot size is expected to decrease as transition to the larger diameter proceeds. The lot size is expected from the current 12 wafers to 6 and 3 or 2 wafers. Road Map is expected to include the SoC’s flexible criteria such as the lot size diversification. 2005 2018 Cycle time per mask layer (days) Short cycle time will be driven by smaller lot size and more single wafer processing Setup time reduction ITRS Factory Integration TWG FITWG 2000

We started discussions for next wafer size transition ITRS Factory Integation TWG 2017/4/6 We started discussions for next wafer size transition When does this happen? We are here 200mm/1990 (125/150mm - 1981) 300mm/2001 450mm/2012? 675mm/2021? 9 yrs + 2 yrs delay* 9 yrs? + 2 yrs delay? 9 yrs + ?yrs delay ITRS Factory Integration TWG FITWG 2000

Examples of next wafer size (NWS) technology decisions that are needed ITRS Factory Integation TWG 2017/4/6 Examples of next wafer size (NWS) technology decisions that are needed Attribute Key Technology Decisions Wafer Material, Size, Thickness, ID, Registration, Edge Exclusion Carrier Number of Wafers, Size, Door Type, AMHS Strategy, ID Production Equipment Single wafer vs. mini-batch, cleanliness, interface standards, productivity targets relative to 300mm (NPW usage, etc.) Factory Factory Size, Egress, Cleanliness, Sub-Fab attributes, Clean-room height Automated Material Handling Systems Direct transport concepts, carrier/wafer delivery time, overall throughput, efficient storage concepts Manufacturing Process Control & Yield Data Standards, Carrier delivery time, Decision Making Time, Data Flow ITRS Factory Integration TWG FITWG 2000

Proposed next wafer size (NWS) transition timeline ITRS Factory Integation TWG Proposed next wafer size (NWS) transition timeline 2017/4/6 Not final. Need Further discussions 2004 2005 2006 2007 2008 2009 2010 2011 2012 Carrier & lot-size determination Direct Transport Standards Production Equipment Factory Control System Standards Interoperability Testing & Reliability Verification 450mm wafer Many technology issues in NWS need to be addressed! FI has started to work on NWS technology challenges ITRS Factory Integration TWG FITWG 2000

ITRS Factory Integation TWG 2017/4/6 Key Messages Business strategies, market demands, and process technology changes continue to make factories difficult to integrate Factory’s speed and flexibility are vital to accommodate various production technologies High Mix, Cycle time improvement, equipment utilization, direct transport AMHS, etc. Gaps in Production Equipment performance, Setup time, AMHS, Facilities and Factory operations must be improved Metrics needed to cover versatility, productivity, agility, quality, environment compatibility Key cross-TWG issues need to be addressed Abatement, Energy requirement, New technology demands tighter AMC control Proactive visualization/usage of factory data is required Delivery time, Quality, and Reliability Next wafer size technical requirements need to addressed ITRS Factory Integration TWG FITWG 2000