Advanced Implantation Detector Array (AIDA): Update & Issues presented by Tom Davinson on behalf of the DESPEC-DSSD/AIDA collaboration Tom Davinson School of Physics The University of Edinburgh

DESPEC: Implantation DSSD Concept Super FRS Low Energy Branch (LEB) Exotic nuclei – energies ~50-150MeV/u Implanted into multi-plane, highly segmented DSSD array Implant - decay correlations Multi-GeV DSSD implantation events Observe subsequent p, 2p, , , ,  p,  n … decays Measure half lives, branching ratios, decay energies …

Implantation DSSD Configurations Two configurations proposed: a)8cm x 24cm “cocktail” mode many isotopes measured simultaneously b) 8cm x 8cm high efficiency mode concentrate on particular isotope(s)

DSSD Segmentation We need to implant at high rates and to observe implant – decay correlations for decays with long half lives. DSSD segmentation ensures average time between implants for given x,y quasi-pixel >> decay half life to be observed. Implantation profile  x ~  y ~ 2cm  z ~ 1mm Implantation rate (8cm x 24cm) ~ 10kHz, ~kHz per isotope (say) Longest half life to be observed ~ seconds Implies quasi-pixel dimensions ~ 0.5mm x 0.5mm Segmentation also has instrumentation performance benefits

DSSD Technology well established (e.g. GLAST LAT tracker) 6” wafer technology 10cm x 10cm area 1mm wafer thickness Integrated components a.c. coupling polysilicon bias resistors … important for ASICs Series strip bonding 8.95 cm square Hamamatsu-Photonics SSD before cutting from the 6-inch wafer. The thickness is 400 microns, and the strip pitch is 228 microns.

AIDA: DSSD Array Design 8cm x 8cm DSSDs common wafer design for 8cm x 24cm and 8cm x 8cm configurations 8cm x 24cm 3 adjacent wafers – horizontal strips series bonded 128 p+n junction strips, 128 n+n ohmic strips per wafer strip pitch 625  m wafer thickness 1mm  E, Veto and 6 intermediate planes 4096 channels (8cm x 24cm) overall package sizes (silicon, PCB, connectors, enclosure … ) ~ 10cm x 26cm x 4cm or ~ 10cm x 10cm x 4cm Implantation depth? Stopping power? Ge  detector? Calibration? Radiation damage? Cooling? courtesy B.Rubio

AIDA: Instrumentation Requirements Large number of channels required, limited available space and cost mandate use of Application Specific Integrated Circuit (ASIC) technology. Requirements Selectable gain:low 20GeV FSR (use reset) : intermediate 1GeV FSR : high 20MeV FSR Noise  ~ 5keV rms. Selectable threshold: minimum ~ high gain ( assume 5  ) Integral and differential non-linearity Autonomous overload recovery ~  s Signal processing time <10  s (decay-decay correlations) Receive timestamp data Timing trigger for coincidences with other detector systems DSSD segmentation reduces input loading of preamplifier and enables excellent noise performance.

AIDA: ASIC Concept courtesy I.Lazarus, CCLRC DL - Example design concept - 1 channel of 16 channel ASIC (shown with external FPGA and ADC) - FEE-integrated DAQ - Digital data via fibre-optic cable to PC-based data concentrator/event builder

AIDA: General Arrangement

DSSD/Kapton Package

ASICADC Virtex 4FX FPGA Power Supplies and other components Fibre Driver (Laser) for Ethernet 16 ch ASIC (with ADC?) Estimated size: 80x220mm, Estimated power 25W per 128ch (800W total) 128 detector signals in; 1 data fibre out Ethernet MAC ASICADCASICADCASICADCASICADCASICADCASICADCASICADC AIDA: 128 channel FEE Card Concept courtesy I.Lazarus, CCLRC DL

Front End Electronics Data output stage standard format and output medium e.g. 10G Ethernet fibre Correlate by timestamp Clock and Timestamp BUTIS Common Clocks 10/200MHz <100ps/km Slow Control Common database loaded into local controllers over Ethernet Detector HV etc. NUSTAR: Common DAQ Interfaces courtesy I.Lazarus, CCLRC DL

Slow Control BUTIS Timestamps Data Output Switch PC Farm AIDA: System Concept courtesy I.Lazarus, CCLRC DL

AIDA: Current Status Edinburgh – Liverpool – CCLRC DL – CCLRC RAL collaboration - 4 year grant period - DSSD design, prototype and production - ASIC design, prototype and production - Integrated Front End FEE PCB development and production - Systems integration - Software development Deliverable: fully operational DSSD array to DESPEC Proposal approved EPSRC Physics Prioritisation panel meeting April 2006 EPSRC award announcement letters received June 2006 Detailed specification development has commenced M0 – specification finalised and critical review

Resources Cost Total value of fEC proposal c. £2.3M (incl. PG c. £2.6M) Support Manpower CCLRC DLc. 4.2 SYFEE PCB Design DAQ h/w & s/w CCLRC RALc. 3.5 SYASIC Design & simulation ASIC Production Edinburgh/Liverpoolc. 4.5 SYDSSD Design & production FEE PCB production Mechanical housing/support Platform grant support CCLRC DL/Edinburgh/Liverpool

AIDA: Workplan

AIDA: Project Partners The University of Edinburgh (lead RO) Phil Woods et al. The University of Liverpool Rob Page et al. CCLRC DL & RAL John Simpson et al. Project Manager: Tom Davinson Further information:

Outstanding Issues Threshold How low is low enough? Package size 10cm x 26cm x 4cm (10cm x 10cm x 4cm) Range of implantation energies and species MeV/u … ? Corresponding ranges in Si U mm Sn mm Ni1.0 – 6.5mm Energy and time resolution (decay) < 10keV FWHM < 10ns FWHM Energy and time resolution (implant) 1% … ? ? External trigger (to gamma/neutron/whatever arrays) prompt? delayed? time resolution?

Acknowledgements Presentation includes material from other people. Thanks to: Ian Lazarus (CCLRC DL) Haik Simon (GSI) Berta Rubio (IFIC, CSIC University of Valencia)