I N V E N T I V EI N V E N T I V E Model Connection Protocol extensions for Mixed Signal SiP Version 0.1 T. Kukal 22 nd Sep, 2010.

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Presentation transcript:

I N V E N T I V EI N V E N T I V E Model Connection Protocol extensions for Mixed Signal SiP Version 0.1 T. Kukal 22 nd Sep, 2010

Agenda Mixed Signal SiP IR-drop flow Extensions required for Mixed Signal SiP

April 11, Current MCP scope Package DIE-Digital Board

April 11, MCP extended to Mixed Signal Package DIE-Digital Board Module (Example RFmodule, SMDs) DIE-Analog

Mixed Signal IR-drop Task Flow Analog IC Layout Power-Net Extract Pre- & Post-Layout Simulation SiP Layout Power-RAIL extract SiP & Circuit Design Schematic Capture Schematic driven Analog SiPIC Digital IC layout HDL Digital IR-drop Analog IR-drop (schematic simulation driven Power-Net Extract MCP Physical MCP Logical Passive Structures

Extensions over existing MCP (PTMF) Support for I/F group (netname with-in DIE or grp with-in DIE) –For cases where port-grp1_pkg connects to say port-grp2&3_DIE Support for I/F part like IO-cellname, R1:1 (pin 1 of R1), CONN:1 (pin1 of PCB connector) –Needed to connect by names as against x-y locations that work well for DIE but not as well for others – also important for Analog Support for Module in connect-type –Needed for RFmodules, Passives, SMD components… Support for Extended-nets –Needed for Signal nets (Example series terminations in signals) April 11,

I/F group mapping to Connecting Structure Package:.Subckt bp1 dp1 Board DIE.Subckt D1A D1B D2 VDD dp1 bp1 Pin1dp1VDD5 4D1A Pin2dp1VDD6 4D1A Pin3dp1VDD7 4D1A Pin4dp1VDD8 4D1B Pin5dp1VDD9 4D1B

Extensions over existing MCP (PTMF) Support for I/F group (netname with-in DIE or grp with-in DIE) –For cases where port-grp1_pkg connects to say port-grp2&3_DIE Support for I/F part like IO-cellname, R1:1 (pin 1 of R1), CONN:1 (pin1 of PCB connector) –Needed to connect by names as against x-y locations that work well for DIE but not as well for others – also important for Analog Support for Module in connect-type –Needed for RFmodules, Passives, SMD components… Support for Extended-nets –Needed for Signal nets (Example series terminations in signals) April 11,

IR-drop of analog DIE in context of passive structures Simulating Analog DIE in package schematics with loading from passive structures connected to DIE The simulation data is post- processed to obtain IR-drop at power-rails [connection type MODULE] Pin1dp1VDD5 4varistor1:2 //Reference_design:pin// Pin2dp1VDD6 4varistor2:2 Pin3dp1VDD7 4

Extensions over existing MCP Support for I/F group (netname with-in DIE or grp with-in DIE) –For cases where port-grp1_pkg connects to say port-grp2&3_DIE Support for I/F part like IO-cellname, R1:1 (pin 1 of R1), CONN:1 (pin1 of PCB connector) –Needed to connect by names as against x-y locations that work well for DIE but not as well for others – also important for Analog Support for Module in connect-type –Needed for RFmodules, Passives, SMD components… Support for Extended-nets –Needed for Signal nets (Example series terminations in signals) April 11,

Support for Passives, RFModules, PoPs, SMDs MCP [connection type] MODULE MCP [connection type] PKG RF-Module geometry / s-parameter

Extensions over existing MCP Support for I/F group (netname with-in DIE or grp with-in DIE) –For cases where port-grp1_pkg connects to say port-grp2&3_DIE Support for I/F part like IO-cellname, R1:1 (pin 1 of R1), CONN:1 (pin1 of PCB connector) –Needed to connect by names as against x-y locations that work well for DIE but not as well for others – also important for Analog Support for Module in connect-type –Needed for RFmodules, Passives, SMD components… Support for Extended-nets –Needed for Signal nets (Example series terminations in signals) April 11,

Extended Nets Series terminations –Extended net needs to have all associated nets mentioned “”data1a, data1b, data1c”

April 11, Summary: MCP format updated in context of Mixed Signal contents Module I/F grp I/F part-ref (if-module) Extended-Net