EC Jet On board electrolytic capacitor polarity and missing parts inspection. ECPD Technology ( E lectrolytic C apacitor P olarity D iscriminating T echnology.)

Slides:



Advertisements
Similar presentations
Powerful administrative functions. Real time alert systems (option): Statistical systems: ICT console (option): Remote access test results data and their.
Advertisements

TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.
QUALITY & TECHNOLOGY HARMONIC PROBLEMS IN CAPACITOR BANKS.
ICT360AT,K518W,WJ PROFILE V9.X WINDOWS Version.
Supercapacitor Energy Storage System for PV Power Generation
GIGABYTE UNITED INC. 技嘉 945 系列全固態電容主機板 GIGABYTE 945 Series All-Solid Capacitor Motherboards GIGABYTE 945 Series All-Solid Capacitor Motherboards.
Protection and Relay Schemes. Agenda  Introduction of Protective Relays  Electrical System Protection with Protective Relays  Conclusion.
PIXEL WEEK September 1999 S. Kersten University of Wuppertal 1 Status of Interlock Box New Interlock Box: NTC -I Box q relative changes in resistor values.
5.00 Understand Promotion Research  Distinguish between basic and applied research (i.e., generation of knowledge vs. solving a specific.
2. Capacitor ConstructionTheory Support Electronics - AC Circuits 1 of 13 Capacitor Construction Topics covered in this presentation: Capacitor Construction.
Semiconductor Devices I Filters Benchmark Companies Inc PO Box Aurora CO
Super-capacitors Vs. Capacitors  No conventional dielectric  Two layers of the same substrate, result in the effective separation of charge  Lack of.
Series-Parallel Combinations of Inductance and Capacitance
Noise near peak field is increased Peak width narrow Peak is symmetric Purpose: Resonate nuclei to prevent polarization. Matching the resonant frequencies.
Key Capacitor Specifications
Generator Protection. Amount of Protection Rated power of the generator Ratio of its capacity to the total capacity of the system Configuration of the.
ECE 4006 Senior Design Project Talal Mohamed Jafaar Ibrahima Bela Sow Mohammad Faisal Zaman Bringing Gigabit Ethernet to the Masses Supervisor: Dr. Martin.
Problem Solving Part 2 Resonance.
Digital I/O Connecting to the Outside World
Capacitors.
Experiment 1 Breadboard Basics
HIGH DENSITY DESIGN COMPONENT SOLUTIONS. Technology Challenges Market Drivers:  Make it smaller  Make it operate faster  Make it more efficient  Make.
Electrical Measurements: Meters
Diodes Analog Electronics UNIT III. Diodes UNIT I Objective The student will use diodes, capacitors, regulators and LEDs through a rectifying system in.
Automatic Test Equipment HIOKI E.E. CORPORATION / PCB PACKAGE BOARD ASSEMBLY X-Y HiTESTER.
UNL Series Product Release Applications & Opportunities.
Ivan Pogrebnyak Supervisors: Paramonov, Drake, Proudfoot ATLAS, MSU, Argonne Tile week upgrade session June 10, 2015 TileCal requirements for ELMB upgrade.
CSE 291 High Performance Interconnect Fall 2012 University of California, San Diego Course Information Instructor CK Cheng,
ENGR 6806 – Motor Control Prepared By: Rob Collett September 15, Office: EN2074.
PCB Layout Introduction
Performance Improvement of APS Booster Ring Dipole Magnet Power Supplies Ju Wang The 3 rd Workshop on Power Converters for Particle.
PCB Layout Introduction
18/10/20151 Calibration of Input-Matching and its Center Frequency for an Inductively Degenerated Low Noise Amplifier Laboratory of Electronics and Information.
DC Circuits. EMF and Terminal Voltage Electric circuit needs a battery or generator to produce current – these are called sources of emf. Battery is a.
The University of Tennessee Knoxville GROUP 7 MSP430 Presentation Saturday, April 22, Jason Bault -Darren Giles -Nathan Rowe -Trevor Williams.
Transmission Lines No. 1  Seattle Pacific University Transmission Lines Kevin Bolding Electrical Engineering Seattle Pacific University.
39th Meeting of the Co-ordinating Committee on Fast Wave Heating and Current Drive Arc Detection Meeting - JET - 4th August 2005 Presented by M. Graham.
Early capacitors or “condensers” were known as Leyden Jars.
 What type of Inspection procedures are in use  Where in the process should inspection take place  How are variations in the process detected before.
1 Decoupling Capacitors Requirements Intel - Microprocessor power levels in the past have increased exponentially, which has led to increased complexity.
O. MÄKINEN FI Session 3 Block 3 Barcelona May What is an intermittent earth fault (IE/F)? Insulation Conductor Screen Insulation break-down.
RC Circuits MS&T Physics 2135, Lab O4. Objectives  Measure the time constant of a series RC circuit.  Determine C Note: You will be using a 1F, 5V electrolytic.
FAILURE ANALYSIS ELECTRICAL CHARACTERISATION SCHOOL OF MICROELECTRONICS KUKUM.
Capacitors AC Circuits I. Capacitors and Capacitance: An Overview Capacitance – the ability of a component to store energy in the form of an electrostatic.
Signal conditioning Noisy. Key Functions of Signal Conditioning: Amplification Filter  Attenuation  Isolation  Linearization.
Basics of Bypass Capacitor, Its Functions and Applications.
Final Year Project: Wireless Power Transfer For Mobile Phone Kong Chin Hung D Supervisor: Dr. Wei-Nong FU.
Power Distribution Copyright F. Canavero, R. Fantino Licensed to HDT - High Design Technology.
Continuity tester a handy tool for testing circuits
Audio Power Amplifier Detailed Design
KranKing Ultracapacitors
Static Management Program (SMP)
Capacitance Capacitance occurs whenever electrical conductors are separated by a dielectric, or insulating material. Applying a voltage to the conductors.
Single Pixel Mixer Tests July 2008 (version 2, posted 11 Aug 2008)
Potential and Current Control
Hybrid Construction = Solid Polymer & Liquid Electrolyte
SMALL SIGNAL ANALYSIS OF CB AMPLIFIER
SMALL SIGNAL ANALYSIS OF CE AMPLIFIER
ESL - Equivalent Series Inductance ‘L’
I made an impedance matching circuit but forgot which impedance was originally matched. Find the unknown load impedance. What is the impedance that the.
Troubleshooting Scott Honaker, N7SS.
ESL - Equivalent Series Inductance ‘L’
Adding Programmable Delay
IMPEDANCE MATCHING & SMITH CHART
ECE131 BASIC ELECTRICAL & ELECTRONICS ENGG
COMPONENTS.
Static Management Program (SMP)
Capacitance Capacitance occurs whenever electrical conductors are separated by a dielectric, or insulating material. Applying a voltage to the conductors.
Capacitance Capacitance occurs whenever electrical conductors are separated by a dielectric, or insulating material. Applying a voltage to the conductors.
CHAPTER 59 TRANSISTOR EQUIVALENT CIRCUITS AND MODELS
Presentation transcript:

EC Jet On board electrolytic capacitor polarity and missing parts inspection. ECPD Technology ( E lectrolytic C apacitor P olarity D iscriminating T echnology.)

The challenges on production line. Traditional ICT test systems. 1.Very low Electrolytic Capacitor polarity discriminating rate(30%-50%). 2.Unable to find out the capacitor miss part during the test. Missing Parts. Wrong Orientation.

Challenge on production line. Inspecting by human eyes not only waste of time and money but also un- reliable as well.

Traditional ICT Electrolytic Capacitor discriminate method. 2 Terminals Leakage Current detect Method. 3Terminals impedance detect method. HP TestJet Induce method. HP TestJet Induce method. + M ~ Z-Z- Z+Z+ + I+I+ + I-I- +

1.Too long testing time to test. 2.DUT tested under rating (damage) voltage. 3.High false rate. Limitation of 2 terminals leakage current detect method. I+I+ + I-I- +

1.Unable to verify the connectivity of the 3rd PIN. 2.Too much variations of the characteristics of the capacitor. 3.Coverage rate about 30~50% level. Limitation of 3 terminals impedance test method. Z-Z- Z+Z+ +

2.Good for on board circuit capacitor small than 10uF. Limitation of HP TestJet method. + M ~ 1.Open 1 of the EC terminal reach the same induced voltage in HP pad. So, it is very difficulty to discriminate the polarity of EC. 3.Unable to work for P4 mother board test. Because all the capacitor (including the capacitor which parallel in circuit design)much higher than 10uF level.

Characteristics of EC Test Jet.  For EC Polarity Discriminating Rate = 100%.  Explosion free EC Polarity Discriminating rate = 100%.  Ultra High Speed, on board 50 Capacitors Test time < 2 sec.  Parallel EC missing part detective ability.

EC Jet know how. ~ Signal sourceResponse Signal BLACK BOX Un-know network analysis model. ~ M T(time) V source T(time) V Response

FFTDFT Principle of EC Jet technology. DSP Pattern Match ~ M F(freq.) V V DUT STD Digital Signal Processing. T(time) V Source T(time) V Response

Principle of EC Jet capacitor miss detection. DSP Pattern Match ~ M F(freq.) V STD DUT F(freq.) V

Why parallel capacitors missing parts can not be found? Tolerance of electrolytic capacitance = -20% ~ +50% Vcc C1C1 C2C2 C3C3 C4C4 CnCn ?? ?

Test limitations of EC Jet. Temperature. Parallel Capacitor Explosion free capacitor DUT with normal temperature between 0° ~ 55°C, failure rate = 0, 100% able to test. DUT with temp > 80°C, failure rate : about 20% DUT with temp >60°C, failure rate : less than 5% Huge value of capacitor affect the testing time (15-20ms /PCS), due to sampling time is a little longer. Explosion free capacitor needs long testing time. Due to the polarity characteristics of explosion free capacitor is not so clear as normal capacitor. Testing time as long as 200 ms/ pcs.

Concerned the contribution rate of the reverse polarity and missing part of electrolytic capacitor. Motherboard acceptable quality level (AQL) : Failure rates : less than 2000 ~ 4000 PPM( super high quality level ) or Less than 4000 ~ 10,000 PPM ( so-so quality level ). Actual value of EC failure rate experiment on the production line of leader mother board maker of Ax company. Actual EC polarity failure rate : About 1,000 ~3,000PPM / board level. Actual EC missing part rate : About 1,000PPM / board. Total failure rate : 2,000~4,000 PPM.

Human eyes inspection is overdo ! Actual EC polarity reverse rate : 1,000 ~ 3,000ppm / board. Actual EC missing parts rate : 1,000ppm / board. Failure rate : 2,000 ~ 4,000 PPM/board. In this case : 40 EC capacitors are on board. Failure rate = 50 ~100PPM/component. Actual value experiments on Ax company’s production line.

Benefits of EC Jet. Use old ICT: JET300 TR518. Use EC Test Jet. Instead of human Eyes Inspection. Getting higher quality. Use EC Jet Save 2 ~ 3 Operators. Less Effort. Higher Quality.

Less efforts Higher quality Profits Competitiveness Conclusion of EC Jet. EC JET