RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday November 6, 2009 9:00am to 11:00am Include new CAD Models/ take out the pictures.

Team Members Gregory Hintz (EE) Samuel Skalicky (CE) Project Manager Samuel Skalicky (CE) Lead Engineer, FPGA Board Jeremy Greene (EE) Connector Board Jared Burdick (EE) Power Michelle Bard (ME) Environmental Tony Perrone (ME) Physical Design

Advisors Scott Reardon (D3 Engineering) Kevin Kearney (D3 Engineering) Dr. Robert Kremens (RIT-Imaging Science) Philip Bryan (RIT – Industry Guide)

Project Status Risks BOM Analysis Feasibility Designs Test Plans

Schedule for the Design Review Overview Gregory Hintz Electrical Discussion Processor Board and FPGA Samuel Skalicky Connector Board, INS System Jeremy Greene Mechanical Discussion System Design Tony Perrone Environmental Concerns Michelle Bard Include breakdowns and make note of actual times from dry runs

What is the Customer Looking for? Integrate supplied components Ruggedized Unit Flight-capable package Can record and transmit Capable of processing The customer desired that we integrate supplied components into an environment-ready, flight-capable package that can record and transmit multi-spectral ground images and associated INS data. This solution should be capable of (if not initially configured for) processing that data in some way, including, but not limited to, compositing images from multiple spectrums and “stamping” image data with real time INS data.

Black Box System Model

Electronic System

Supplied Components Customer Needs Met Integrate supplied components 10MP Visual Band Camera 1.3MP IR Camera Spatial Sensors NovAtel OEM Board OEMV3 NovAtel OEM Board OEMV2 Camera Processing Board Capture data from two cameras Capture 10MP @ 1fps Capture 1.3MP @ 30fps Capture INS data @ 30/sec (simultaneously) External INS units Data processing (overlay) Real time viewing Store full-res. Data during flight Support NovAtel GNSS board

Electronic System

Camera Components Customer Needs Met Integrate supplied components 10MP Visual Band Camera 1.3MP IR Camera Spatial Sensors NovAtel OEM Board OEMV3 NovAtel OEM Board OEMV2 Camera Processing Board Capture data from two cameras Capture 10MP @ 1fps Capture 1.3MP @ 30fps Capture INS data @ 30/sec (simultaneously) External INS units Data processing (overlay) Real time viewing Store full-res. Data during flight Support NovAtel GNSS board

Final Output 10mp Camera

Electronic System

Camera Components Customer Needs Met Integrate supplied components 10MP Visual Band Camera 1.3MP IR Camera Spatial Sensors NovAtel OEM Board OEMV3 NovAtel OEM Board OEMV2 Camera Processing Board Capture data from two cameras Capture 10MP @ 1fps Capture 1.3MP @ 30fps Capture INS data @ 30/sec (simultaneously) External INS units Data processing (overlay) Real time viewing Store full-res. Data during flight Support NovAtel GNSS board

Final Output CameraLink® IR camera

Electronic System

Spatial Sensing Customer Needs Met Integrate supplied components 10MP Visual Band Camera 1.3MP IR Camera Spatial Sensors NovAtel OEM Board OEMV3 NovAtel OEM Board OEMV2 Camera Processing Board Capture data from two cameras Capture 10MP @ 1fps Capture 1.3MP @ 30fps Capture INS data @ 30/sec (simultaneously) External INS units Data processing (overlay) Real time viewing Store full-res. Data during flight Support NovAtel GNSS board

Output INS data format # of shot, (FLIGHT INFORMATION, Pitch, ect….) 675,495060.000000,39.377116,-82.774721,1442.237213,177.966706,-6.573488,87.156026 676,495063.000000,39.375698,-82.773364,1437.212509,178.655193,-2.978762,89.591399 677,495066.000000,39.374288,-82.771967,1432.054779,177.896426,-3.434334,92.544970 678,495069.000000,39.372892,-82.770509,1428.557648,177.391126,-12.302477,92.517868 679,495072.000000,39.371514,-82.768882,1425.166306,178.138512,-9.035039,88.154010 680,495075.000000,39.370128,-82.767133,1425.035141,176.875920,-1.502685,89.783104 681,495078.000000,39.368761,-82.765407,1424.326828,176.056416,-6.737449,90.066296 682,495081.000000,39.367471,-82.763622,1421.768311,175.569431,-7.973052,88.809422 683,495084.000000,39.366537,-82.761748,1427.402252,176.045872,-7.985133,86.404080

Electronic System

Processing elements Customer Needs Met Integrate supplied components 10MP Visual Band Camera 1.3MP IR Camera Spatial Sensors NovAtel OEM Board OEMV3 NovAtel OEM Board OEMV2 Camera Processing Board Capture data from two cameras Capture 10MP @ 1fps Capture 1.3MP @ 30fps Capture INS data @ 30/sec (simultaneously) External INS units Data processing (overlay) Real time viewing Store full-res. Data during flight Support NovAtel GNSS board

OEM Digital Signal Processing Board Signal Processing already done on Customer Supplied Interface. Image overlay Compression Resolution of Images Outputs 10/100 Ethernet S-Video Software interface available

OEM Board

Electronic System

FPGA Board Diagram

FPGA Board to Scale

Processing elements Customer Needs Met Integrate supplied components 10MP Visual Band Camera 1.3MP IR Camera Spatial Sensors Camera Processing Board Capture data from two cameras Capture 10MP @ 1fps Capture 1.3MP @ 30fps Capture INS data @ 30/sec (simultaneously) External INS units Data processing (overlay) Real time viewing Store full-res. Data during flight Support NovAtel GNSS board

Processing Elements FPGA Inputs/Outputs Flexible Architecture Faster Speed Parallel Processing DSP Energy Efficient Single Pipeline Easy Implementation Math based ISA

DSP Customer programmable Role in this design Required skills Encoding/Decoding media Peripherals Role in this design Image compression Real time streaming of data INS interface Required skills Implementable Knowledge of C DSP/BIOS

FPGA FPGA Selection Quicker time to fabrication Supreme configurability/Field reprogrammable Has the I/O needed Parallel processing

FPGA Xilinx Selection Model XC6SLX75T Selection Resources available to the team Larger range of choices than other companies Customer preference Model XC6SLX75T Selection Package size (23mm x 23mm) High speed transceiver count I/O pin count Cost effectiveness

FPGA Board Diagram

Data Flow – Initial Design Pictures Camera  FPGA  OEM INS Data INS  OEM

Data Flow – Final Design Pictures Camera  FPGA  OEM Camera  FPGA  HD INS Data INS  OEM  FPGA  HD

Data Speeds Image INS IR: 30 images / second Visible :1 image / second VGA=640x480 9.2 MHz Visible :1 image / second 10.7MP=3664x2748 10.07 MHz INS 30 captures / second 1kB=8kb 8000 baud **Note: baud = bits per second (RS-232)

FPGA Pin Speeds Minimum values 13ns -> 76 MHz 5ns -> 200 MHz

System Software Design

FPGA Image Controller

Image Data Input

System Software Design

FPGA Central Dispatch

External Interfaces and the Connector Board Interfaces Specified Originally 2x Camera Link camera 2x Gigabit Ethernet camera Power Supply (9V to 36V) 10/100 Ethernet External Inertial Navigation System 2x GigE 2x Camera Link 10/100 Ethernet Power Supply External INS Connector Board D3 OEM Board

External Interfaces and the Connector Board Final Interfaces Specified 2x Camera Link camera 2x GigE camera Power Supply (9V to 36V) 10/100 Ethernet External Inertial Navigation System RCA output USB port Power Supply External INS 2x Camera Link 2x GigE RCA output 10/100 Ethernet USB port Connector Panel

External Interfaces and the Connector Board Goal: All interfaces routed through and mounted on the Connector Board Reality: Various different mountings and routings necessary Goal was to get everything on the Connector Board, if possible.

Interface Routing and Connector Mounting Through the Connector Board Routed Elsewhere Board Mount 2x Camera Link camera 2x GigE camera Panel Mount Power Supply (9V to 36V) 10/100 Ethernet External INS RCA output USB port 2x Camera Link External INS Power Supply 2x Camera Link = nearly full width of Connector Board Connector Panel

Interface Routing and Connector Mounting Through the Connector Board Routed Elsewhere Board Mount 2x Camera Link camera 2x GigE camera Panel Mount Power Supply (9V to 36V) 10/100 Ethernet External INS RCA output USB port GigE mounted on FPGA Board 2x GigE FPGA Board (bottom view) Connector Panel

Interface Routing and Connector Mounting Through the Connector Board Routed Elsewhere Board Mount 2x Camera Link camera 2x GigE camera Panel Mount Power Supply (9V to 36V) 10/100 Ethernet External INS RCA output USB port RCA 10/100 Ethernet RCA and 10/100 Ethernet routed directly to D3 OEM Board 10/100 Ethernet RCA output D3 OEM Board (top view) Connector Panel

Interface Routing and Connector Mounting Through the Connector Board Routed Elsewhere Board Mount 2x Camera Link camera 2x GigE camera Panel Mount Power Supply (9V to 36V) 10/100 Ethernet External INS RCA output USB port USB port USB routed directly to internal GNSS receiver Connector Panel

Customer Provided Block Diagram The Connector Board Having determined what it needs to do, design could commence Customer Provided Block Diagram

Connector Board Design: Functional Block Diagram

Connector Board Design: Scale Diagram

Inertial Navigation System (INS) Determines: Direction Roll, pitch & yaw Velocity Inertial Measurement Unit (IMU) Location Global Navigation Satellite System (GNSS) Global Positioning System (GPS) GLONASS

Global Navigation Satellite System Customer Specified NovAtel OEMV-2 or OEMV-3 RS-232 interface Different power requirements OEMV-2: 3.3 +5%/-3% VDC OEMV-3: 4.5 to 18 VDC

GNSS Software

Small Passenger Aircraft Chassis Interfaces Interface to Plane Small Passenger Aircraft RIT U.A.V. Airframe “C” Mountable to a flat plate Mountable to a flat wooden base Smaller than a person; Approx 2’ x 2’ x 5’6” tall Less than 16” x 6.5” x 5” tall Less than 150lbs (68kg) Less than 15lbs (6.8kg)

Chassis Interfaces Interface to Plane 10.25” Long 6” Wide 6.5” Tall 10.9lbs

Chassis Interfaces Interface to Plane Component Weight (lbs) Electronics 0.91 Electronics Enclosure 3.43 Optics 2.15 Optics Enclosure 4.32 Total 11 lbs (Approximate)

Solid State Hard Drive (Not Pictured) Chassis Interfaces Solid State Hard Drive (Not Pictured) Connector Board NovAtel OEMV-3 D3 OEM Board FPGA Board

Chassis Interfaces

Linos Mevis-C Lenses (16 mm) Chassis Interfaces MicroStrain IMU Camera Boards Linos Mevis-C Lenses (16 mm)

Chassis Interfaces

Vibration Damping Two sources of need: Insure structural integrity under vibration Minimize image distortion Item 1 must be tested for, but item 2 can be calculated and designed for.

Vibration Damping Characterized per RTCA DO-160 Frequency Range: 5 – 500 Hz Amplitude Range: 0.00001 – 0.1 inches 3 Primary Axes

Vibration Damping Image distortion depends on: Aircraft Speed Aircraft Altitude Lens Image Angle Shutter Speed

Vibration Damping Speed induced by vibration taken as derivative of vibration motion profile Profile: X = A·sin(F·t) Speed: X’ = A·F·cos(F·t)

Speed Distortion (Pixels) Vibration Distortion (Pixels) Vibration Damping Maximum Aircraft Speed: 36 m/s Maximum Vibration Speed: 1.27 m/s Altitude (ft) Speed Distortion (Pixels) Vibration Distortion (Pixels) 1000 0.66 0.0233 1500 0.44 0.0155 2000 0.33 0.0116 5000 0.13 0.0047

Environmental Needs Electronics (all temps in C) Optics: Maintain internal temp within operating temp of components Electronics (all temps in C) FPGA 0 < T < 85 Connector Board 0 < T < 70 D3 supplied OEM Board -40 < T < 85 Electronics Range 0C < T < 70C Optics: 10 Mp cameras -40 < 0 < 70 More specs

Environmental Needs Allow for standard Environmental conditions as defined by MIL-STD-810G and DO-160 Temperature Range: -32C to 45 C (on ground) Humidity: 90% “2.2 Basic climatic design type.” “The area this type applies to includes the most densely populated and heavily industrialized parts of the world as well as the humid tropics…Areas where the basic type applies are more widespread than the hot and cold design types combined. They also include most of the densely populated, highly industrialized sectors of the world. “

Power Requirements of Devices Voltage Line (Volts) DSP (Amps) FPGA (Amps) SATA (Amps) DDR2 (Amps) INS (Amps) Cameras (Amps) SPI (Amps) Total Current/Voltage (Amps) 12 4.5 5 0.5 0.42 5.42 3.3 0.104 5.104 2.5 TBD 1.8 1 0.276 0.71 1.986 1.2 Total Current/Device (Amps) 13.5  18.01 MAX POWER= 102.78W

Environmental Management: Heat Major sources of heat generation inside chassis Hard drive about the half the heat produced comes from this Voltage Regulator FPGA DSP Net Heat generated by system can be estimated using the net power input to the system Net heat gen: have an add up by component

Environmental Management: Heat Transfer analysis Heat Transfer model: assuming a steady state Radiation Least efficient mode Model as black body From electronics to chassis From chassis to external environment Model dependant primarily on surface area of components q rad T Chassis TAmbient Get rid of all but radiation, put in some charts showing power v. internal temp on ground and at altitude make sure to address assumptions and why made

Environmental Management Heat Transfer: radiation model Board stack Chassis wall q chassis q board T chassis T boards T ambient Treat enclosure as a black box radiating heat to the outside air Neglect Convection Protected from moving air Neglect Conduction Temperature at surface of chassis = temperature inside of chassis Heat radiating from chassis is 50% of heat radiating from boards (qc = .5qb) **Assume an efficiency rate of transfer from boards to box Sources: Heat Transfer: a practical approach by Yunis A. Cengel for lapse rate in the troposphere: www.uwsp.edu and http://en.wikipedia.org/wiki/Tropopause Emissivity coefficients: http://www.engineeringtoolbox.com/emissivity-coefficients-d_447.html

Environmental Management Heat Transfer: radiation model Used a ‘double’ radiation model Radiation from electronics to chassis wall Radiation from chassis wall to outside environment Combined the two models into one by assuming an efficiency between the heat transfer rate of the electronics and the chassis wall External environment Internal environment t¥ ground (°C) Pgen (w) Tboards Final (°C) -32 -51.93 5 -23.10 10 -1.78 20 30.04 25 42.79 50 90.74 70 118.75 100 152.00 45 25.06 38.41 50.23 70.61 79.57 116.48 139.88 168.90

Environmental Management Heat Transfer: radiation model ‘Safe zone’ between ~ 10 and ~ 30 W

Environmental Management : Humidity dew point: should we be concerned with condensation? Temperature at which water will condense on a surface Function of ambient temperature and relative humidity Used to determine whether additional steps should be taken to control temperature/ humidity inside the chassis. Conclusion: Condensation will not be a big problem May run into trouble at very high humidities (above 80%) Dew point is very close to air temperatures environmental data dew point solution relative humidity (%) t¥ air (°c) dew point ( C) 1 -51.7815 -83.236 40 -58.846 50 -57.167 80 -53.544 90 -52.617 25.21848 -34.858 10.652 14.052 21.519 23.459 Dew point, the temperature at which water will condense on a surface, is a function of ambient temperature and relative humidity. Knowing the dew point will tell whether additional steps should be taken to control temperature and/or humidity inside the chassis.

condensation control selection matrix Environmental Management dew point: should we be concerned with condensation? Some environmental management techniques may be valuable to prevent condensation at high humidities Main options: include a heating system to keep temperature inside the chassis above dew point reduce humidity inside the chassis to lower the dew point inside the chassis a common method : silica gel packs condensation control selection matrix   Heater system silica gel pack weight rank with weight effective at reducing/preventing condensation 5 2 10 simplicity in manufacturing/implimentation 3 -1 -3 1 reusability allows for flexability as heat requirements change 4 8 allows for air/water tight enclosure total: 17 27 From this comparison: a compact, reusable silica gel pack appears to be the appropriate choice. Source for dew point info: www.sensirion.com/ sensor company explaining how to use info from sensors to calculate dew point

RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday November 6, 2009 9:00am to 11:00am Include new CAD Models/ take out the pictures.

RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday November 6, 2009 9:00am to 11:00am Include new CAD Models/ take out the pictures.

RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday November 6, 2009 9:00am to 11:00am Include new CAD Models/ take out the pictures.