RIT Senior Design Project D3 Engineering Camera Platform Friday October 9, :30 to 1:00pm

Team Members Gregory Hintz (EE) Samuel Skalicky (CE) Jeremy Greene (EE) Jared Burdick (EE) Michelle Bard (ME) Anthony Perrone (ME)

Power Distribution FPGADDR2 OEM Board Flash MEMSSDINSD3 Cameras Connector Board 1.2V1.8V5V3.3V 3.3V, 5V, 12V 15V3.3V9-36V

Power Distribution(cont.) -Schematic Using LT1933 taken from Linear Technology

Camera: MT9J003 CMOS Digital Image Sensor Why This Camera? Imaging Array 3664(H) x 2748(V) Speed/Output Frame Rate: 15 fps (HiSPi serial I/F) 7.5 fps (parallel I/F) Data Rate: 2.8 Gb/s (HiSPi serial I/F) 80 Mp/s (parallel I/F) Data Format: 12-bit RAW Temperature Range –30°C to +70°C Power Supply: 1.8V – 2.8V full resolution

Interfaces D3 Camera Interface -16-bit parallel output -6 Miscellaneous positions -Two wire I²C bus interface -Several clock and control positions CameraLink -LVDS to achieve theoretical transmission rate of 1.923Gbps -Not dependent on a particular supply voltage because of low signal voltage swing GigE -High bandwidth for high-speed, and high resolution cameras -Downward compatible with 10/100 Mhz Ethernet -Operates at a fast frame rate

The Connector Board Speculation of finished product: Ports for data I/O.

Where We Started

Initial Concept Specifications call for external ports: – (2) CameraLink (LVDS) – (2) Gigabit Ethernet – Power in (9V to 36V) – Sync – Serial (RS-232) Courtesy D3 Engineering

Things to Consider Q: What does this do beyond wire connectors? – Will include some IC's that might otherwise be on the main, FPGA board. Q: Do all of these connectors need to be on a circuit board? – Probably not Q: Is there anything else that needs an I/O port? – The Inertial Navigation System (INS) will be housed separately – An external Serial ATA (SATA) will be included Q: How will data be transferred from the connector board to the FPGA board and vice-versa? – A ribbon cable to carry data signals – CameraLink & GigE interfaces adapted to D3

After Initial Brainstorming

The Inertial Navigation System Provides location and directional data. Location determined by a Global Positioning System (GPS) device. Direction determined by an Inertial Measurement Unit (IMU). Important information to have for this kind of camera system.

Considering the Options MicroStrain 3DM Both can be used with RS232 port. NovAtel SPAN

Enclosure Consideration Some models contain the GPS and IMU in a single unit, others separate them. May have noteworthy impact on size and design of the system enclosure.

Digital Operations

FPGA Board

Camera/INS Speeds 10 MP Visual Band Image Sensor – 1 image/sec – 1 image approx 32MB VGA IR Band Image Sensor – 30 images/sec – 1 image approx 1MB INS Sensor – 1 capture/image (30/sec) – 1 capture approx 2MB

FPGA Hardware Requirements Flash Based (SPI) Configuration Memory – 64MB covers all Spartan 6 LXT packages DDR2 Ram – Image Data: RGB 24 bits, upto 30 bits per pixel Dual Modules -> 32bits wide – Density 2Gb total Approx 62MB image data/sec Approx 60MB INS data/sec

FPGA I/O Pin Requirements

Spartan 6 FPGA Family

End of Electrical Discussion

Needs Considerations Approach Maintain optimal temperature range required by components Prevent the heat produced by the electronics from interfering with the operation of cameras Maintain an air/water tight environment Heat Mitigation

External environment Temperature on ground : assume °F Temperature at 30,000 ft (5.7 miles): -66.8°F to -36.8°F Image ID: wea00041, NOAA's National Weather Service (NWS) Collection Photographer: Ralph F. Kresge #1059 Internal environment External temperature plus temperature of heat generated by electronic components Needs Considerations Approach Heat Mitigation

2 Thermally isolated enclosures Conductive heat transfer methods inside the chassis Passive convective heat transfer methods outside Needs Considerations Approach Heat Mitigation

Ensure imaging system is securely attached to airframe Reduce vibration of system Image from: Needs Considerations Approach Airframe Mounting

Pre-existing bolt patterns in aircraft Pre-existing opening in aircraft for imaging systems Does not interfere with other components of imaging system Needs Considerations Approach Airframe Mounting

Utilize airplane’s pre-existing bolt pattern in vibration damping mount to attach vibration damping mount directly to airframe Initial sketch for vibration damping airframe-mount Needs Considerations Approach Airframe Mounting

Needs Stabilize Image Prevent Hardware Damage/Malfunctioning Considerations Frequencies of Aircraft Allowable Vibration in Image Component Resonant Frequencies

Approach Mechanical isolation of chassis

Stock Hardware Interchangeable as needs change Large body of established data

Chassis Design Phase 1: Individual Compartments Separate Enclosures Thermally Isolated Modular Minimal Leak Paths

Chassis Design Phase 2: Scale

Chassis Design Phase 3: Detail

RIT Senior Design Project D3 Engineering Camera Platform Friday October 9, 2009