XFP System and 10G Common Electrical Interface Dong Zheng BitBlitz Communications Milpitas, California Dzheng@bitblitz.com

Agenda XFP modules vs. others Host systems architectures Implementation examples

(Greater Line Card density) Box-to-Box: Optical Modules 300 pin MSA Large on Board Footprint Cost: 20x x16 Mux I/F Xenpak Plug-able Cost: 4-6x XAUI I/F Xpak/X2 Plug-able Cost: 2x XAUI I/F REQUIREMENTS! Lower Cost Smaller Form Factor (Greater Line Card density) Lower Power XFP/SFP Plug-able Cost: 1x 10G Ser I/F

XFP vs. other modules XENPAK XPAK X2 XFP XFP/XENPAK Power (W) 6 4 1.5, 2.5, 3.5, >3.5 ~50% (level 2,3) Width (mm) 36 18.35 Length (mm) 121 85.4 91 71 Depth 115.2 75.7 77.2 61.7 Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere. Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere.

XFP philosophy: Minimal electrical circuits in module 10GE Applications Host Module XGMII XAUI ASIC 3G SerDes 80 16 XENPAK, XPAK, X2 XFI ASIC XGMII 3G SerDes 10G SerDes XAUI 4 80 16 XFP Optical XFP philosophy: Minimal electrical circuits in module

10GE Electrical Interfaces Speed/wire No. of wires Distance XGMII 312.5Mbps 80 3” XAUI 3.125Gbps 16 >40” XFI 10.3125Gbps 4 <7” XFP host design guide line: XFI 10G interface keeps short XAUI extends reach distance

10G CEI SR (XFI) Rate from 9.95Gbps to 11.09Gbps for SONET, 10GE, 10GFC applications Max recommend host PCB length <200mm, depending on geometry and material Near-end eye mask Far-end eye mask

Design Example Devices used: 10G SerDes: BBTX100 3G SerDes: BBT3420 Standard FR-4

Test Results Note: Far-end eye Near-end mask Potential driving optics directly

Summaries XFP modules are lower power, smaller form factor, lower cost for higher line card density over competing solutions 10G electrical interface is more challenging compared to XENPAK based modules Reference system has demonstrated feasibility of the XFP host system, with significant margin on 10G electrical interface.