Electrosort Automation Die Sorting vs. Wafer Probe Die Sorting  Screens out electrical failures before assembly, thus improving assembly & final test yield, which reduces overall manufacturing cost.  Screens out die that were damaged during dicing & demounting process before packaging, thus reducing overall manufacturing cost. Wafer Probe  Screens out electrical failures before assembly, thus improving assembly & final test yield, which reduces overall manufacturing cost.  Does not screen out die that were damaged during dicing & demounting process, resulting in lower assembly yields and higher costs.

Electrosort Automation Die Sorting vs. Wafer Probe Die Sorting  Sorts die into bins, allowing only those die needed for current orders to be packaged, without scrapping other bins that may be usable for future orders. This improves die utilization, yield, and cost. Ideal for Zener & TVS.  Adds flexibility by making it possible to assemble different bins into different package types, if desired. This improves die utilization, improves final yield and reduces overall cost. Wafer Probe  Only pass/fail testing & inking. Either all passing die must be assembled resulting in un-needed packaged devices or the wafers are probed to tighter spec resulting in poor die yield. Either way, costs are higher.  Since wafer probing is unable to sort different die for different packages, unwanted die get assembled in the wrong package or the wafers are probed to tighter spec resulting in poor die yield. Either way, costs are higher.

Electrosort Automation Die Sorting vs. Wafer Probe Die Sorting  Since EA equipment has Kelvin probes on both the bottom & top of the die, it is possible to measure voltage at higher currents with more accuracy.  Soft-touch TM probing minimizes scratches to die.  Die sorting can be a continuous operation, with no need to stop between wafers. Wafer Probe  Since wafer probing only allows Kelvin probes on the top of the wafer, it is unable to measure voltage accurately at higher currents.  Probes often scratch die. This is especially bad for Schottky diodes.  Testing must be halted to place the wafer on the chuck & for alignment. Probing must also be stopped to replace ink from time to time.

Electrosort Automation Die Sorting vs. Wafer Probe Die Sorting  With die sorting there is no messy ink to deal with and no time wasted curing the wet ink.  If die were tested with wrong program, they can easily be retested. Wafer Probe  With wafer probing/inking, user must deal with messy ink and waste time curing inked wafers.  If die were tested with wrong program, the ink must be washed off. If error was discovered after ink is cured, it is very difficult to remove the ink.