Cleaning For Electronics Wash away the worries of contaminants

Why Clean? Possible Applications and Contaminants

Customer – military – telecoms – safety critical Coated board Coating/ Potting protection Customer (“no clean” process) Finished (dirty board) REFLOW Surface mount (IR, Vapour etc) SOLDER WAVE Conventional (through hole) Flux Bare board (dirty after 16 processes) PRINTED CIRCUIT BOARD PRODUCTION Circuit diagram photo plotted onto bare copper board/etched CLEANING of stencils/glue applications CLEANING OF OVENS OR TRANSPORT CHAINS Cleaned board CLEANING Populated board Components Solder paste/adhesive (Stencilling) For “failed board” REWORK – cleaning of flux/adhesive/coatings

WHAT CLEANING MAY BE REQUIRED? FLUX RESIDUES - Assembled PCB’s - Ceramics - Carrier Frames / Jigs + Reflow or Wave equipment SOLDER PASTE - Stencils / Dispenser Needles - PCB’S (Misprints / Rework) UNCURED SMT ADHESIVE - Stencils / Dispenser Needles - PCB’S (Misprints / Rework) OTHER PROCESS CONTAMINANTS - PCB board Preparation (HASL etc) - Handling / storage

CLEANING OF FLUX RESIDUES –OBJECTIVE - No visual residues - Ionic contamination <1.5 µg/ cm 2 NaCl equivalent - High insulation resistivity ( SIR testing IPC TM 650) Ideally achieved with minimum cost!

A LITTLE CHEMISTRY! METAL OXIDE + FLUX = CLEAN METAL + WATER + SALTS Flux wets the metal surfaces and a simple acid/base reaction cleans the surface Clean metal surfaces can then bond i.e. soldering can take place Some residues such as salts, un-reacted fluxes/activators are corrosive and conductive and so must be removed

“NO CLEAN” PROCESSES LOW / ZERO RESIDUE IONIC PASTES / FLUXES WORK EXTREMELY WELL, INCLUDING WHEN CONFORMALLY COATED, SO LONG AS… - Process is optimized - No residues from earlier stage of board preparation, often >12 processes + handling -  Fingerprints etc  Oils / Greases (HASL)  Particulates (Solder balls, fibre glass, metal oxides, other contaminants) CLEANING IS STILL REQUIRED FOR OTHER ASSEMBLY PROCESSES - Solder Pastes / Adhesives - Stencils / Dispenser Needles - PCB’S (Misprints / Rework)

“LEAD-FREE” PROCESSES TRADITIONAL LEAD/TIN/SILVER ALLOYS HAVE BEEN REPLACED WITH “NO LEAD” SYSTEMS - TIN/COPPER/SILVER ALLOYS CHANGE WAS REQUIRED DUE TO RoHS WHICH WAS IMPLEMENTED IN JUNE 2006 CLEANING OF “LEAD FREE” FLUX RESIDUES IS ESSENTIAL BUT DIFFICULT - Increased temperature means that the residues are “baked on” and are much harder to remove than traditional leaded flux residues

Aqueous-Based Cleaning The Safewash Product Range

SAFEWASH SWA, SWAJ, SWAS Non-flammable All supplied at ready to use concentration SWAJ suitable for use on sensitive metals such as copper and aluminium SWAS good for no-clean fluxes, is easier to rinse and has very low odour All foam – unsuitable for high pressure spray All will absorb 5-15% of their weight in fluxes and maintain cleaning power PRODUCT ACTIVE CONTENT SWA23% SWAJ23% SWAS26%

SAFEWASH SWAF, SWAP, SWAC Non flammable Low foaming SWAF and SWAC supplied as concentrate – dilute to 5-25% in deionised water SWAP ready to use SWAP suitable for use on sensitive metals Can be used in ultrasonic, dishwasher, spray in-line cleaning or pressure washing. PRODUCT ACTIVE CONTENT SWAF100% SWAP26% SWAC100%

Excellent cleaning performance Removal of all types of flux residues from PCBs and general degreasing applications Supplied as a concentrate: reduced transportation and packaging. Very low toxicity Effective over long periods of time by filtering. Low foam cleaner, suitable for use in: dishwasher in-line pressure systems Ultrasonic spray under immersion SAFEWASH TOTAL SWAT

Non flammable. Removes pastes and adhesives. Ready to use (44% active). Low foam – suitable for use in ultrasonic or spray machines for stencil cleaning. Solder paste uptake of up to 50% without affecting cleaning performance. pH drops from 10.3 to 6 at this loading BUT is no indication of adhesive content. Shake before use – clouds at 23-24°C. SAFEWASH SWAX

SAFEWASH + CORROSION INHIBITOR SUPER + CORROSION INHIBITOR ULTRASONIC LOW FOAM SWAP SWAS SWAJ SWA SWAF or SWAC SWAX SWMN or SWMP MECHANICAL PARTS ( DEGREASING ) STENCIL ADHESIVES FLUX RESIDUES AND SOLDER PASTES SWAT NEUTRAL P H SWNS or SWNP

Water based Non-flammable Designed for cleaning reflow ovens and wave solder machines Excellent cleaning performance Removes of all types of flux residues and general dirt/grease Supplied ready to use in 500ml spray bottle Very low toxicity REFLOW OVEN CLEANER ROC

A customer trial of ROC………… ROC

Before cleaning……….

Applying ROC……….

Cleaning…………

Left: Before cleaning Right: After cleaning with ROC

Solvent-Based Cleaning The Electrolube Product Range

Flammable: Not suitable for use on live equipment Fast dry-time Best choice to remove ionic residue; also suitable for removing grease and flux residue Compatible with most plastics; not suitable on polycarbonate ULTRASOLVE ULS

Flammable: Cannot be used on live equipment Fast-drying Best for cleaning flux residue, but can be used for ionic residue and heavy grease Safe on most plastics; not suitable on polycarbonate or polystyrene Also available – HFFR: Hexane-Free Flux Remover FLUXCLENE FLU

Non-flammable One of the slowest evaporation rates of all the solvent based cleaners Best for cleaning solder pastes and adhesives Also suitable for flux residue, ionic residue and heavy grease Not suitable for use on ABS, polycarbonate or polystyrene Also available as SSW: 100 wipe tub dispenser ULC is also suitable for this application SCREEN AND STENCIL SOLVENT SSW, SSS

Substrate PCB Cleaning Glass Magnetic Tape Heads Printers General Residue Type Electronic Contacts Flammable PRS Printasolve GLC Glass cleaner VID Magnetic Head Cleaner Non-flammable ULC Ultraclens ECSP Electronic cleaning solvent Plus IPA Isopropyl alcohol Ionic Residue Flux Residue Solder Paste LFFR Lead Free Flux Remover FLU Fluxclene FRC Flux Remover Non-flammable Flammable CCC Contact Cleaner ULS Ultrasolve SSS & SSW Screen and Stencil Solvent MDS Metal Degreasing Solvent DGC Degreaser Heavy Grease START

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