E-mail, April 9, 2006Václav Vrba, Institute of Physics, Prague 1. Phenix NCC Silicon Pad Sensors produced in ON Semiconductor Lukas Tomasek, Michal Tomasek,

Slides:

Advertisements

Similar presentations

IV Characteristics Electricity Lesson 4.

Advertisements

A “BTeV” Hybrid Pixel Telescope for MTest David Christian May 4, 2007.

CALICE meeting, Montreal, 10 th May 2006Václav Vrba, Institute of Physics, AS CR ECAL Si sensors status and plans May 2006 V.Vrba.

Vanel Jean-Charles LLR – IN2P3 08 / 12 / 2004 : Calice Meeting Desy ECAL prototype status Calice ECAL Prototype Status Silicon sensors : Production Reception.

Portland, October 20, 2003Vaclav Vrba, Institute of Physics, AS CR 1 Vaclav Vrba* Institute of Physics, AS CR, Prague *for CALICE collaboration Silicon.

ECFA-DESY meeting, Krakow, 16 th September 2001Václav Vrba, Institute of Physics, AS CR 1 Václav Vrba Institute of Physics AS CR, Prague Silicon pad sensors.

128 September, 2005 Silicon Sensor for the CMS Tracker The Silicon Sensors for the Inner Tracker of CMS CMS Tracker and it‘s Silicon Strip Sensors Radiation.

Progress of the Forward Calorimeter R&D Presented by: Igor Emeliantchik DESY Zeuthen:R. Dollan D. Drachenberg, E. Kouznetsova, W. Lange, W. Lohmann NC.

Module Production for The ATLAS Silicon Tracker (SCT) The SCT requirements: Hermetic lightweight tracker. 4 space-points detection up to pseudo rapidity.

Silicon Strip Detectors. Background Semiconductors Doping N-type, P-type.

Презентація за розділом “Гумористичні твори”

Галактики і квазари.

Характеристика ІНДІЇ.

Процюк Н.В. вчитель початкових класів Боярської ЗОШ І – ІІІ ст №4

Fig 10: I-V characteristics of Au/PDNC/Al/Au junction. This shows that the molecule has rectification towards the positive bias. Current (A) M I A M I.

ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING

To draw the I-V curve of Si diode in forward biased By: Engr.Irshad Raheem Memon.

St Malo, 13 th April 2002Václav Vrba, Institute of Physics, AS CR 1 Václav Vrba Institute of Physics, AS CR, Prague Silicon pad sensors for W-Si ECal.

Silicon sensor module production for PHENIX FOCAL S.H. Lim Yonsei University.

Dahee Kim (Ewha womans university) for MPC-EX collaboration TEST OF MINI-PAD SILICON SENSOR FOR PHENIX MPC-EX.

Christina Hägemann,UNM Sensor Testing at University of New Mexico C. Hägemann, M. Hoeferkamp, D. Fields, A. Zimmerman, M. Malik VTX Meeting 03 June 2005.

January, 2007Vaclav Vrba, Prague FVTX Strip Sensor Design General features:  Strip pitch = 75 µm  # chip channels = 128;  chip width = 128 x 75 µm =

David M. Lee Forward Vertex Detector Cost, Schedule, and Management Plan Participating Institutions Organizational plan Cost Basis R&D Costs.

ALBA Synchrotron – 17 June 2010 Centro Nacional de MicroelectrónicaInstituto de Microelectrónica de Barcelona First Measurements on 3D Strips Detectors.

Munich, 18 Oct 2006J. Cvach, annual JRA31 JRA3 Institute of Physics ASCR Prague 1.ECAL, VFCAL (V. Vrba) 2.HCAL (J. Cvach) 3.Exchange in NA2 (travels 8.5.

— Test board for CBM01B2 baby detectors — Anton Lymanets & Johann Heuser CBM collaboration meeting GSI, 27 February 2008 Microstrip detector testing at.

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 1 Vaclav Vrba Institute of Physics, AS CR, Prague CALICE ECal Status Report.

MIT Lincoln Laboratory NU Status-1 JAB 11/20/2015 Advanced Photodiode Development 7 April, 2000 James A. Burns ll.mit.edu.

Status of Hamamatsu Silicon Sensors K. Hara (Univ of Tsukuba) Delivery leakage current at 150V & 350V number of defect channels wafer thickness & full.

February, 2007Vaclav Vrba, Prague FVTX Strip Sensor Design General features:  Strip pitch = 75 µm  # chip channels = 128;  chip width = 128 x 75 µm.

Ping Hsu Buff Furman John Luk 21SEP2010

Духовні символи Голосіївського району

N. Zorzi Trento, Feb 28 – Mar 1, 2005 Workshop on p-type detectors Characterization of n-on-p devices fabricated at ITC-irst Nicola Zorzi ITC-irst - Trento.

IFR Praha 2004, 16 th April 2004Václav Vrba, Institute of Physics, AS CR 1 Václav Vrba Institute of Physics, AS CR, Prague Silicon sensors status.

D. M. Lee, LANL 1 07/10/07 Forward Vertex Detector Overview Technical Design Overview Design status.

Magnification showing pads and “bias ring” First Look at SiD Charge Division Sensors at SCIPP.

GLAST LAT ProjectMarch 24, B Tracker Peer Review, WBS GLAST Large Area Telescope: Tracker Subsystem WBS B: Silicon Strip Detector.

10 October 2003, FCM, Krakow Michal Tomášek, Institute of Physics AS CR 1 Michal Tomášek, Václav Vrba Institute of Physics, AS CR, Prague Measurements.

PHENIX Muon Meetig, Santa Fe, June 23 rd The PHENIX Forward Upgrade Matthias Grosse Perdekamp, RBRC and UIUC International Collaboration Organization o.

RD50 RD50 Workhop: CERN Katharina Kaska Epitaxial silicon detectors irradiated with protons and neutrons Katharina Kaska, Michael Moll RD50 Workshop.

Diodes Ping Hsu Buff Furman John Luk. Mechatronics Concept Map System to Control Sensor Signal Conditioning Controller (Hardware & Software) Power Interface.

IH2655 Seminar January 26, 2016 Electrical Characterization,B. Gunnar Malm

Performance of the PHENIX NCC Prototype Michael Merkin Skobeltyn Institute of Nuclear Physics Moscow State University.

JRA3 Institute of Physics ASCR Prague

Czech Technical University in Prague (CTU Prague)

Thinning and Plans for SuperBelle

CALICE Silicon ECal Sensors Status and prospects

Status of pre-production at TESLA

Status of Medipix Quads in Institute of Physics Prague

Highlights of Atlas Upgrade Week, March 2011

SuperB SVT Silicon Sensor Requirements

Basics Semiconductors

بسم الله الرحمن الرحيم الموضوع:الوضوء صفته وفرائضه وسننه

Проф. д-р Васил Цанов, Институт за икономически изследвания при БАН

О Б Щ И Н А С И Л И С Т Р А П р о е к т Б ю д ж е т г.

Електронни услуги на НАП

РАЙОНЕН СЪД - БУРГАС РАБОТНА СРЕЩА СЪС СЪДЕБНИТЕ ЗАСЕДАТЕЛИ ПРИ РАЙОНЕН СЪД – БУРГАС 21 ОКТОМВРИ 2016 г.

Сътрудничество между полицията и другите специалисти в България

НАЦИОНАЛНА АГЕНЦИЯ ЗА ПРИХОДИТЕ

ДОБРОВОЛЕН РЕЗЕРВ НА ВЪОРЪЖЕНИТЕ СИЛИ НА РЕПУБЛИКА БЪЛГАРИЯ

Съвременни софтуерни решения

ПО ПЧЕЛАРСТВО ЗА ТРИГОДИШНИЯ

от проучване на общественото мнение,

Васил Големански Ноември, 2006

Програма за развитие на селските райони

ОПЕРАТИВНА ПРОГРАМА “АДМИНИСТРАТИВЕН КАПАЦИТЕТ”

БАЛИСТИКА НА ТЯЛО ПРИ СВОБОДНО ПАДАНЕ В ЗЕМНАТА АТМОСФЕРА

МЕДИЦИНСКИ УНИВЕРСИТЕТ – ПЛЕВЕН

Моето наследствено призвание

Presentation transcript:

, April 9, 2006Václav Vrba, Institute of Physics, Prague 1. Phenix NCC Silicon Pad Sensors produced in ON Semiconductor Lukas Tomasek, Michal Tomasek, Vaclav Vrba Institute of Physics, Prague Michael Finger, Miroslav Finger Charles University, Prague Michael Merkin at al. Moscow State University Edward Kistenev, Edward O’Brien Brookhaven National Laboratory Richard Seto University of California at Riverside Matthias Grosse Perdekamp University of Illinois at Urbana-Champaign

, April 9, 2006Václav Vrba, Institute of Physics, Prague 2 Layout of components on the wafer

, April 9, 2006Václav Vrba, Institute of Physics, Prague 3 I-V and C-V on single diodes

, April 9, 2006Václav Vrba, Institute of Physics, Prague 4 I-V curves for 4x4 pad array

, April 9, 2006Václav Vrba, Institute of Physics, Prague 5 I-V curves for 4x4 pad array

, April 9, 2006Václav Vrba, Institute of Physics, Prague 6 Reverse current long term stability

, April 9, 2006Václav Vrba, Institute of Physics, Prague 7 I-V curves for 4x4 pad array

, April 9, 2006Václav Vrba, Institute of Physics, Prague 8 Summary 8 wafers with pad sensors of Phenix design with integrated bias resistors have been fabricated in ON Semiconductor; First measurements indicate very good quality of sensors and also of integrated resistors; For future production QA criteria and measurement procedure shall be elaborated. It will help also better define and accent our needs; At the moment ONS is finishing processing of the second part of wafers (out of 24 raw wafers provided by Misha Merkin); It is highly desirable to send to ONS a.s.a.p. new wafers 525 µm thick purchased from Wacker Siltronic for further production.