PACS IBDR 27/28 Feb 2002 PACS Cryo Harness1 U.Grözinger, D.Lemke, R.Hofferbert Max-Planck-Institut für Astronomie Heidelberg Based on input data from CSL,

Slides:



Advertisements
Similar presentations
1 Designing for DVI General Applications Considerations.
Advertisements

PACS IIDR, Noordwijk 1-2 Mar 2001 Chopper R. Hofferbert D. Lemke, U. Grözinger, O. Krause, U. Klaas J. Katzer (ZEISS) Max-Planck-Institut für Astronomie,
Amplifying Signals Breadboarding: from a diagram to an actual working amplifier.
TELESCOPE ANALOG CONTROL Martin Frericks, Frans Zwart.
Data Acquisition Risanuri Hidayat.
PACS IIDR 01/02 Mar 2001 FPU Harness and Distribution Board1 D. Kampf KAYSER-THREDE.
PACS IHDR 12/13 Nov 2003 Photoconductor Detector Modules 1 IHDR ASTEQ-GmbH Germany Peter Dinges, Michael Harr, Heribert Krüger, Hilmar Richter, Bernd Zimmermann.
Max-Planck-Institut für Astronomie Heidelberg PACS SVR 22./23. June 2006 MPE Garching J. Stegmaier, U. Grözinger, D. Lemke, O. Krause, H. Dannerbauer,
PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays1 IBDR Hilmar Richter ANTEC-GmbH Germany Günter Bollmann, Peter Dinges, Otto Frenzl, Heidrun Köppen,
Introduction AD620 Instrumentation Amplifier
LV power cables for iTOP
Purpose of the Standards
EMC review for Belle II (Grounding & shielding plans) Sub-systems ( XXXXX)
Performance of the DZero Layer 0 Detector Marvin Johnson For the DZero Silicon Group.
Basic Block Diagram of Op-Amp
Reproduction interdite © ALMA EUROPEAN CONSORTIUM Reproduction forbidden Design, Manufacture, Transport and Integration in Chile of ALMA Antennas Page.
Photon detection Visible or near-visible wavelengths
PACS IBDR 27/28 February 2002 PACS DEC/MEC1 Detectors & Mechanisms Controllers (DEC/MEC) J.-M. Gillis Centre Spatial de Liège (B)
F. Arteche, C. Esteban Instituto Tecnológico de Aragón D. Moya, I. Vila, A. L. Virto, A. Ruiz Instituto de Física de Cantabria Powering requirements and.
PACS IBDR 27/28 Feb 2002 PACS CRE1 PACS CRE development Ybe Creten, Patrick Merken, Jan Putzeys, Vic Fonderie, Chris Van Hoof IMEC.
PACS IBDR 27/ BOLC/BOLA1 BOLC / BOLA SAp/DAPNIA/DSM/CEA C. CARA WE Design Team: A. BOUERE - N. DEVIN - G. DHENAIN - E. DOUMAYROU M. SEYRANIAN -
PACS IIDR 01/02 Mar 2001 Instrument Interfaces1 PACS FPU Opto-mechanical Design Overview and Interfaces J. Schubert MPE.
PHY 2049: Physics II Tutoring Center is open in room NPB 1215, M-F 12:00AM -4:00PM. It is free.
1 of 28 A design study of a Cryogenic High Accurate Derotator.
Seminar ON SMART SENSOR Submitted by : SUBIR KUMAR GHOSH Roll No. IN-14/04 Electrical & Instrumentation Deptt. B.E 7th Semester JORHAT ENGINEERING COLLEGE,
PACS IBDR 27/28 Feb 2002 IIDR Close-out1 Close-out of IIDR Recommendations A. Poglitsch.
PACS IBDR, Garching 27/28 Feb 2002 Chopper R. Hofferbert D. Lemke, U. Grözinger, O. Krause J. Katzer (ZEISS) Max-Planck-Institut für Astronomie, Heidelberg.
PACS SVR-II 18 January 2007 FM ILT overview1 The PACS FM ILT Phase I overview on actual test execution and analysis Eckhard Sturm MPE.
1 LECTURE 3. Contents 3.Measurement methods 3.1.Deflection, difference, and null methods 3.2.Interchange method and substitution method 3.3.Compensation.
Foundry Characteristics
Leo Greiner PIXEL Hardware meeting HFT PIXEL detector LVDS Data Path Testing.
PACS IBDR 27/28 Feb 2002 PACS PI Summary1 Where we are and where to go… A. Poglitsch MPE.
PACS IIDR ESTEC 01/02 March 2001 System Engineering 1 PACS Instrument Intermediate Design Review (IIDR) Reinhard Katterloher System Engineering DDVP, Model.
CEA DSM Dapnia SAp Readout mode of the Photometer Koryo Okumura, Marc Sauvage, Nicolas Billot, Bertrand Morin DSM/DAPNIA/SAp.
PACS SVR 2 18 Jan 2007 FM ILT: Spectrometer1 Spectrometer Performance H. Feuchtgruber, T. Müller, A. Poglitsch.
PVPhotFlux PACS Photometer photometric calibration MPIA PACS Commissioning and PV Phase Plan Review 21 st – 22 nd January 2009, MPE Garching Markus Nielbock.
PACS IIDR 01/02 Mar 2001 PACS Cryo Harness1 U.Grözinger, D.Lemke, R. Hofferbert Max-Planck-Institut für Astronomie Heidelberg Based on input data from.
HF-Protection of Electronic Circuits Thomas Losert.
PACS IIDR ESTEC 01/02 March 2001 Integration and Testing1 PACS Instrument Intermediate Design Review (IIDR) Reinhard Katterloher Integration and Testing.
Compilation of Dis-/Advantages of DC-DC Conversion Schemes Power Task Force Meeting December 16 th, 2008 Katja Klein 1. Physikalisches Institut B RWTH.
1DSM/DAPNIA/SAp – J. MartignacPACS - IHDR - MPE – Nov. 12 – 13, 2003 PACS – IHDR PhFPU Design J. Martignac CEA/DSM/DAPNIA Service d’Astrophysique.
Pixel power R&D in Spain F. Arteche Phase II days Phase 2 pixel electronics meeting CERN - May 2015.
SP & DC-DC Considering the benefits of combining serial powering and DC-DC conversion technologies in powering ATLAS SCT upgrade modules & staves Richard.
TC Straw man for ATLAS ID for SLHC This layout is a result of the discussions in the GENOA ID upgrade workshop. Aim is to evolve this to include list of.
Zener Diode Circuits for Power Supply Designs Section 4.4.
PACS IBDR 27/28 Feb 2002 PACS ICC1 ICC (EGSE, IA/QLA, HCSS) Otto H. Bauer MPE Garching.
PACS IBDR MPE 27/28 Feb 2002 AIV 1 PACS IBDR Test Cryostat and OGSE Gerd Jakob MPE.
1 (Gerard Visser – STAR Integration Meeting 5/16/2008) STAR Forward GEM Tracker Readout/DAQ Integration G. Visser Indiana University Cyclotron Facility.
PACS IIDR 01/02 Mar 2001 PACS Grounding Scheme and EMC1 Grounding Scheme and EMC Matthias Rumitz, MPE.
1 E n v i r o n m e n t 1 5. SOURCES OF ERRORS the environment, Measuring errors can occur due to the undesirable interaction between the measurement system.
PACS IHDR12/13 Nov 2003 Cryo Harness1 Cryo Harness, Test Cryo Harness Martin von Berg PACS IHDR.
Straw man layout for ATLAS ID for SLHC
De Remigis The test has been accomplished with an SLVS signal, since that was chosen for the serial communication between the readout and the optical converter.
Product Overview Analogue Input, 2fold, SM  Box  Sensor connections
Author: Nurul Azyyati Sabri
BIOMECHANICS & BIOMEDICAL ENGINEERING LOW COST FORCE SENSOR
Basic Block Diagram of Op-Amp
ABB i-bus® KNX Light Controller LR/S x.16.1 with LF/U 2.1.
S-D analog to digital conversion
Electric Current.
5.3. Noise characteristics
Σ-D Analog to Digital Converter for CMOS Image Sensors Nonu Singh (RIT, MicroE Co-Op) Background After fabricating an imaging sensor it needs to be characterized.
The simple system solution
Background Developed by Teledyne Scientific & Imaging, LLC
Digital Sub-System Bob Goeke.
Design Of Low-Power Wireless Communication System Based On MSP430
Grounding, Power Distribution
5.3. Noise characteristics
Assessed practical: Resistance of a wire
Presentation transcript:

PACS IBDR 27/28 Feb 2002 PACS Cryo Harness1 U.Grözinger, D.Lemke, R.Hofferbert Max-Planck-Institut für Astronomie Heidelberg Based on input data from CSL, CEA, IMEC, KT, MPE

PACS IBDR 27/28 Feb 2002 PACS Cryo Harness2 Cryo Harness Design Criteria according to IID-A   Minimize number of wires  Minimize heat conduction  Minimize dissipation on harness

PACS IBDR 27/28 Feb 2002 PACS Cryo Harness3 Cryo Harness Design Criteria Instrument requirements Provide signal integrity for  14 useful bits of science data for 800 Ge:Ga-detectors and 2560 Bolometer pixels Provide stable and low noise supplies for detector bias, readout circuits, high resolution position sensors to obtain expected performance Independent supply groups for detectors to minimize risk Low resistance actuator drive lines for accurate controlling

PACS IBDR 27/28 Feb 2002 PACS Cryo Harness4 Cryo Harness block diagram

PACS IBDR 27/28 Feb 2002 PACS Cryo Harness5 Cryo Harness Uncertainties  Nonconformity IID-A vs outcome of harness study and actual knowledge e.g. Harness length => harness resistance, cable capacity… Shield coverage => EMC aspects, power dissipation  Definition of cable types by harness manufacturer (based on instrument requirements)  Till now no reliable information about availability and characteristics of requested cable types (Triax, tw. pairs…)  Use of different cable types along cryo harness (different numbers of wires/shields in Cu-cables) may cause Grounding/EMC-Problems

PACS IBDR 27/28 Feb 2002 PACS Cryo Harness6 Cryo Harness cable types I, acc. Cryo Harness Spec. Number of wires Cable type times used 1 Triax-cable, SST, AWG SST, AWG 38, shielded20 3 SST, AWG 38, shielded 12 4 SST, AWG 38, shielded 17 6 SST, AWG 38, shielded 8 8 SST, AWG 38, shielded SST, AWG 38, shielded17 18 SST, AWG 38, shielded13 22 SST, AWG 38, shielded 4

PACS IBDR 27/28 Feb 2002 PACS Cryo Harness7 Cryo Harness cable types II, acc. Cryo Harness Spec. Number of wires Cable type times used 4 2 x 2 tw pairs, SST, AWG 38, shielded x 2 tw pairs, SST, AWG 38, shielded x 2 tw pairs, SST, AWG 38, shielded x 2 tw pair, Brass, AWG 30, shielded x 2 tw pairs, Brass, AWG 30, shielded x 2 tw pairs, Brass, AWG 30, shielded x 2 tw pairs, Brass, AWG 30, shielded 2

PACS IBDR 27/28 Feb 2002 PACS Cryo Harness8 Cryo Harness open items / problem areas  Due to the anticipated increase of harness length, instruments are forced to allow higher resistances and capacities => contradiction to instrument requirements  Power dissipation on Harness (e.g. actuator drive lines)  Detailed consideration of EMC aspects  Shielding efficiency (e.g. optical coverage, resistance)  Large number of different cable types

PACS IBDR 27/28 Feb 2002 PACS Cryo Harness9 Cryo Harness Conclusion  Issue 1 of Cryo Harness Specification completed  Harness matters are crucial for instrument performance  Confirmation about availability of requested cable types needed  Harness routing should consider EMI/EMC aspects  Harness working group established