ATLAS Module building at Glasgow Andy Blue: on behalf of the Glasgow ATLAS upgrade group

ATLAS Upgrade Replacing all the Silicon in the SCT Presentation will focus on the Si Strip detectors (also work at Glasgow on the upgrade to the pixel detectors) Major changes previous modules More Asics (now 20) Will be reduced to 10 @130nmCMOS More Strips 20*128*2=5120/module However, no fan in/link between Si Hybrids now glued directly ON to the Si

Atlas Upgrade Taken from “Parameters of the phase2 ITK Draft 27.5.2012” Layer 1: 28 staves (at r = 412) [Short @ 2.4cm] Layer 2: 40 staves (at r= 555) [Short @ 2.4cm] Layer 3: 48 staves (at r=698) [Long @ 4.8cm] Layer 4: 60 staves (at r=866) [Long @ 4.8cm] Layer 5: 72 staves (at r=996) [Long @ 4.8cm] =248 Staves in total The number of modules in stave = 26 6448 modules in 3 years (150 weeks) 42.986modules per week 8.597 modules per day for all module building groups Assumes 100% yield!

Assembly of a Module 1) Glue ASICS on to a FR4 strip (‘Hybrid’) Wire bonds for ASIC-ASIC 2) Glue 2 Hybrids onto a Si sensor (‘Module’) Wire bond from ASIC to Si Strips

Hybrid Construction Goal is to accurately glue 20 Si CMOS chips on to a FR-4 based panel to make a Hybrid

Present Technique Place ASICs in holder (Machined acetal with metal top)

Picking up ASICS Attach a vacuum jig to the holder

Hybrid Gluing Apply a stencil and spread glue evenly on back to leave 5 spots per asic

ASICs in position on Hybrid Place vacuum jig on to FR4 board and apply a brass weight to cure the glue

Module gluing Goal is to glue to Hybrids (shown before) to a Silicon sensor

Module Alignment Frame is placed on a jig, then Silicon sensor placed in frame (held by small lip round edge of frame)

Module Gluing A cardboard stencil is placed on top of the Si sensor and glue is spread Glue used is an epolite epoxy

Module Assembly 2 hybrid pick up tools are then attached to the module jig

Work so far Hybrid Building Wire Bonding Readout

Hybrid Assembly

Wire Bonding Bonding Purchased and installed Bondjet 820 Fully wire bonded our first hybrid panel Wire bonded 1st half of module Successfully bonded trial of new pitch for modified module design

Testing HSIO FPGA development board Can test Runs SCTDAQ software Hybrids Modules Stavelets (multiple modules)

Testing Testing both hybrids and modules now at Glasgow

Hybrid Testing - (Pre trim)

Hybrid Testing - (Post trim)

Next Test hybrids bonded at Glasgow Begin construction of Modules Test Begin QA and full assembly structure Get ready for pre production