Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.1
F 1 D' specimen dimension (log D) strength or yield criterion a b nominal strength N LEBM D Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.2
a b c d Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.3
IN TRON MODEL 1362 load cell adapter micro-tensile testing device internal load cell specimen Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.4
standard specimen l = 50 mm 0 25 °C 100 °C 175 °C 225 °C 25 °C 100 °C 175 °C microspecimen l = 10 mm 0 (%) (MPa) Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.5
q l specimen correlated video image data aquisition (%) a b Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.6
EP + filler (SiO ) = 0.27 PP + chalk = 0.20 PVC + filler = l (%) Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.7
standard CT mini CT v (µm) F (N) Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.8
PEI PC PSU PF ceramics PMMA epoxy resin ceramics K (MPamm ) for mini CT Q 1/2 K (MPamm ) for standard CT Q 1/2 Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.9
a load PMMA PS glass interface crack 0 h (nm) A B D C E b F (mN) indenter Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.10
a b Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.11
a b Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.12
F loading module scan device optical device CT specimen a F Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.13
µm µm crack 10 crack height profile 0.28 polishing trace a b nm line of height profile evaluation Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.14
µm µm crack flank left crack flank rigth a b µm displacement perpendicular to the crack µm Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.15
y r x u (x) y u y l y r Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: 12.16
a x coordinate (µm) displacement u (µm) y y = x x coordinate (µm) y coordinate (µm) b Chapter 12: Michel, B.: Testing of Microcomponents. In: Grellmann, W., Seidler, S. (Eds.): Polymer Testing. Carl Hanser Verlag, Munich (2013) 2. Edition Fig.: ((u − u )/2) (µm ) u l y y 2 2