o Inner Tracker UpgradeG. Darbo – INFN / Genova Milano, 10 February 2015 Inner Tracker Upgrade X Workshop ATLAS Italia 10 – 12 February 2015 G. Darbo – INFN / Genova Indico:

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February Inner Tracker Project ATLAS ITk project taking off: Project kick-off meeting (4 Nov ‘14) chaired by Leo; 93 Institutes and 21 countries joined ITk; 6 Italian Institutes already in ATLAS (BO, CS,GE, LE, MI, UD) – Trento asked to join ATLAS and then ITk. ITk Institute Board (IB) Under Leo, the search committee to find the first chair of the ITk-IB has been formed: C Buttar, Marina Cobal, Abe Seiden (chair), Nobu Unno, Norbert Wermes and Dave Charlton  hope new chair for first IB meeting. First ITk-IB meeting (26 th Feb) in ITk-week, where we will discuss various items including the effort tables collated by Leo and a discussion of the critical gaps in coverage for certain areas. CountryNumber of institutions Australia3 Canada7 CERN1 China1 (cluster) Czech Republic3 Denmark1 France6 Germany10 Italy6: BO, CS, GE, LE, MI, UD Japan7 Netherland1 Norway2 Poland2 Russia1 Switzerland2 Spain2 Slovenia1 Sweden2 South Africa1 (cluster) Taiwan1 United Kingdom12 United States21 Total93 Trento raised formal request to join ATLAS

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February ITk Descoping Scenario LHCC request a cost document for ATLAS Phase II with possible de- scoping – document ready for discussion on 15 th Sep, draft to LHCC for June. ATLAS mandate a subgroup of the USC to study 3 scenarios: 275, 235 and 200 MCHF (old CHF rate!). For ITk too short time to focus on “preferred” layout (many under study  see Layout TF). Concentrate on LoI layout + extension at  = 4 For ITk should be considered as pure exercise: not what we are going to build, but how performance goes with de-scoping Effort must be coherent with CMS

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February ITk “275” layout LoI + VF extension to  = 4 Not clear if we can simulate rings in time (presumably not…) Should be possible to move to 25x100 pixel size (occupancy/rates) Cost Strips 95.7 M Pixel 24.8 M Common 11.0 M VF extension 12.0 M Savings (wrt LoI) -8.7 M ––––––––––––––––––––––––– Total134.8 M Cost Strips 95.7 M Pixel 24.8 M Common 11.0 M VF extension 12.0 M Savings (wrt LoI) -8.7 M ––––––––––––––––––––––––– Total134.8 M Ref.: P. Morettini – R&D Phase II Italia – 23/1/2015

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February ITk “235” layout WRT “275”: VF extension only to h=3.2 Strip “stub” layer removed Cost “275”134.8 M VF to h= M Stub -2.0 M ––––––––––––––––––––––––– Total126.8 M Cost “275”134.8 M VF to h= M Stub -2.0 M ––––––––––––––––––––––––– Total126.8 M Ref.: P. Morettini – R&D Phase II Italia – 23/1/2015

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February ITk “200” layout WRT “275”: VF extension only to  =3.2 1 strip barrel and 1 disk set removed 2 strip barrel single layer (not stereo) Ref.: P. Morettini – R&D Phase II Italia – 23/1/2015 Cost “275”134.8 M VF to h = M 1 barrel+1disk-24.0 M 2 barrel layers-7.0 M ––––––––––––––––––––––––– Total 97.8 M Cost “275”134.8 M VF to h = M 1 barrel+1disk-24.0 M 2 barrel layers-7.0 M ––––––––––––––––––––––––– Total 97.8 M

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February Layout TF Work Model ITk Layout tasks force New Task Force (Claudia e Andy chairs), with mandate to define the ITk layout  go down in options, by end Need help for simulation (interesting task for young people too). To study:  Local supports for layers 3-4 (inclined planes, like “alpine”  less silicon and material )  Look at extra pixel layer(s) with cheaper technologies to replace strips.  Realistic simulation of services and routings.  R/O sizing based on detector characteristics. Ref.: P. Morettini – R&D Phase II Italia – 23/1/2015

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February SLIM – Stiff Longeron for ITk Staves IP Barrel Cells Tilted Cells Connecting Structure 5 th pixel layer inside the PST – HV-CMOS “optimized” – 2.5 m long at layer 5. one slim stave is equivalent to two adjacent conventional staves Ref.: S. Michal, ITk Pixel Design Group, 29/01/2015

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February SLIM – Material Budget Lower surface and consequently lower cost  22 % less for a 1.5 m stave at layer 5  39 % less for a 2.5 m stave at layer 5 Note: only structural cells studied Ref.: S. Michal, ITk Pixel Design Group, 29/01/2015

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February RD_FASE2 Tracker R&D in CSN1

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February D Sensors with FBK: TN + FBK IBL like 3D sensor on 6” – FBK and Trento 1 st 3D test batch on 6” wafers finished, all wafers tested. Test structures show good breakdown behaviour. Defect rate higher than IBL (DRIE process, partially understood), no totally good FE-I4! One wafer will be bump-bonded at IZM/Selex with special bump-mask: leave unconnected pixel column with low V BD Planning irradiation & test-beam with FE-I4/PSI46dig ATLAS FE-I4 (13x) CMS Single chip (24x) (1E, 2E, 3E, 4E) CMS Quads (6x) (2E, 3E) MEDIPIX2 (4x) NA62 test chip (20x) 275 µm Partially etched junction columns Column (10÷13 µm) partially filled with doped poly-silicon Passing-through ohmic columns 250µm Good IV Pixel columns: BB to FE-I4 pixel Bad IV Pixel columns: disconnect from Pixel inputs One FE-I4 tile: IV for 80 cols of 336 pixels Ref.: G. Giacomini – R&D Phase II Italia Process x-section

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February D / Active Edge – RD_FASE2 New generation of 3D sensors Single-sided process on SiSi DWB and SOI substrates – Substrates from IceMOS; 100÷130 µm thick active layer; Technology suitable for new RD53 Pixel chips (small 50x50 or 25x100 µm 2 pixels) and low threshold (~1000 e-) operation; Design for 2x10 16 n eq /cm 2 ; Strategy: 3 technical batches funded by CSN1 (ATLAS/CMS) + [1 batch of Active edge planar sensors] Batch 1 – mechanical test DRIE test of 100 ÷ 150 µm narrow (5 µm) columns; Test filling with poly. P - Epi layer / P - High Ωcm wafer P ++ Low Ωcm wafer -V b Charge Amp. Bump-bond metal Thin-down Single side 3D process p ++ col n ++ col SOI – SiSi DWB 158 um 5.6 um 3.8 um Ref.: M. Boscardin and S. Ronchin, FBK 100÷130µm Opt.: 200 nm oxide (SOI) DRIE for ohmic columns

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February D / Active Edge – RD_FASE2 Batch 2 – substrates test p-type SiSi DWB wafers from IceMOS 100 ÷ 130 µm high-R active sensor thickness p-spray & p-stop isolation Started in Sept. 2014, completed in Nov Good electrical characteristics – from CV measurements depletion is in accordance with nominal thickness of active (device) substrate. Module assembly: 5 wafers will be processed by IZM:  Substrate thinning  Metallisation with mask of back  BCB processing for HV isolation 1 wafer bump-bonded by Selex Table: good tiles per wafers: ATLAS (1) – Current limit 0.2 µA, V BD ≥ 100V CMS (2) – Current limit 50 nA, V BD ≥ 100V CMSATLAS wafer #materialthicknessp-spray ATLAS (1) CMS (2) 30Si-Si E+129 / 1020 / 30 33Si-Si E+128 / 1017 / 30 49Si-Si E+128 / 1020 / 30 63Si-Si E+127 / 1025 / 30 69Si-Si E+1210 / 1026 / 30 74Si-Si E+128 / 1019 / 30 75Si-Si E+127 / 1014 / 30 80Si-Si E+1210 / 1026 / 30 81Si-Si E+128 / 1026 / 30 1FZ E+12 FE-I4

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February D / Active Edge – RD_FASE2 Batch 3 – 3D with new substrates Test small pixels cells with FE-I4 – tricky layout mixing small pixels and grounded/larger pixels (see example) Wafer layout and cell simulation in advanced stage – parameters extracted from batch 1 and 2 will be used for the new design About 2 month delay accumulated since start of the project: some concern with the DRIE machine at FBK (14 weeks asked for repair) – becoming difficult to have process finished before summer. Substrates IceMOS SiSi substrates (baseline option): already in house Shinetsu epitaxial substrates: given-up (not fulfilling specifications) SOI substrates: we are going to order some wafers (could be used given delay of DRIE). 2x50 + 2x4504x50 + grid 50 µm 450 µm 450 fF 50 fF

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February Thinking Towards ITk Modules Assume ITk layer 1 & 2 with 3D Need 3000 RD53 chips/single tile sensors to cover the ~1 m 2 area. Considering 25 tiles/wafer (6”), 50 % yield in sensors and 50 % in good tiles to used modules: 600 wafers are needed FBK + CNM (maybe SINTEF) are in the business – pre-production + production from 2018 to Requested exercise: evaluate feasibility and cost! Considerations on bump-bonding Complete qualification at Selex with 6” sensor wafers, FE-I4 like modules; Discuss with Selex plans for R&D and involvement in ITk production:  R&D/Upgrade needs at Selex: qualify process for 120k bumps/chip, upgrade to 12” wafers (RD53 wafers).  Consider 8.2 m 2 of hybrid pixels  is Selex interested in part of it? Direct playing with FBK and Selex make easier optimization of BB for 3D sensor and “sell” the full package to the collaboration.

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February Steering R/O R&D Activities Table-top ROD/BOC version (BO) Use expertise on IBL ROD, no VME needs Full SW/FW compatibility with PIT cards Half ROD, up to 16 FE Funded by CSN1 Possible activities on read-out Expand existing FE-I4 R/O systems to HV/HR-CMOS (see bottom fig.) Common HW/FW/SW interface definition Integrate mini-DCS in the read-out GBT concentrator FE Generic R/O system USBPix RCE ROD/BOC PCIExpress FPGA LV CTRL TX RX Mod TX/RX Ref.: P. Morettini – R&D Phase II Italia – 23/1/2015

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February Evaporative CO 2 cooling Milano 2014 Activities Completed design of TRACI v.3  100 W transportable CO2 recirculating system  Collaboration: CERN, NIKHEF, MILANO, SHEFFIELD, OXFORD, LIVERPOOL  Test on M PUMPS, Corbola (RO) Purchased all components:  Being part of collaboration allows purchase sharing  In Milano co-funded by LHCb and Dotazioni 2015 Plans Assemble and Commissioning TRACI Needed for LHCb and for ATLAS Finite Element Analysis of stave designs based on mini-piping – well known expertise of the MI group from IBL  Ti pipe, 2 mm Test of prototypes with TRACI  Need to build a setup based on TRACI, similar to what done for IBL 17 TRACI Thermal simulation (IBL) Test setup (IBL)

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February RD_FASE2 – “Richieste 2015” Legend: ATLAS Common ATLAS / CMS AttivitàDescrizioneBOCSGEMITNUD 3D 6" Wafer procurement (SOI, wafer bonding, epi) PicoScope 6407 Digitizer with 1.5 GHz probes and accessories BB 6" dummy wafers - test deposition on 6" and high-density bumps (150 k-bumps/chip) BB for 3D sensor test MOD Upgarde R/O Systems Module assembly and irradiation, RD on flex MM-R/O Multi module R/O CO2/µCH Develop µ-channel cooling Total requested by ATLAS Trento: Request of 4 k€ of Travel Money for test-beam participation and support.

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February HVR_CCPD Activities on HV/HR-CMOS in CSN5 – BO, GE, MI

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February HVR_CCPD: The project

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February STM Chip

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February Hybridization

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February AIDA-2020 : Funded ! AIDA-2020 Funded ! AIDA-2020 has been officially selected by the EC with a funding of 10 M€. The project has a ranking of 14.5/15 with 5/5 excellence 5/5 impact 4.5 implementation The grant agreement procedure is quite fast Groups in ATLAS who have been funded: Genova Milano Trento

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February Conclusions ITk project moving ahead: Kick-off meeting, Institute Board, … De-scoping scenarios under study Layout TF RD_FASE2 Activities on sensors/modules progressing… constructive activity with CMS HVR_CCPD Test chip submitted with STM Hybridization work progressing, few devices assembled at Genova tested in TB AIDA2020 Project approved, new resources and R&D framework for HL-LHC developments

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February SPARE SLIDES

Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February Activities in ITk ITk management looking at interest of Countries in ITk R&D’s Table from discussion with Paolo. Comments? For discussion