Research in Cyber Infrastructure for Engineering Design: Technical Challenges Ram D. Sriram Leader, Design and Process Group Manager, Manufacturing Metrology and Standards for the Health Care Enterprise Manufacturing Systems Integration Division National Institute of Standards & Technology URL:

Production Planning Process Planning Client/User Collaborative Design Engineering Specifications Conceptual Design (Knowledge-based CAD) Traditional CAD AnalysisVirtual Prototype Environment Immersive CAD Design Evolution Database Version Revision Geometry Rationale …. Design Repository Case Studies Component Data Other Resource Data ….

Globally Networked Engineering Engineering organizations are globally distributed networks Large scale engineering organizations are moving towards system integrators and suppliers Collaboration across the network varies from over the wall transfer of information to joint development Role of information technology is still limited in-spite of success stories such as Boeing 777. Recent efforts in PLM/KM is encouraging as the PLM initiative is focusing on strategic business approach for the effective creation, management and use of corporate intellectual capital.

Factors in Achieving Seamless Networks of Design and Manufacturing 1.Connectivity: Bandwidth for large scale data and information transfer 2.Reach: The ability to access and provide right information that is distributed across the networked enterprise 3.Interactivity: The ability to interact with people, computational tools and physical tools across time and space Any Cyber Infrastructure has to support along all these three dimensions

Technical Challenges 1.Knowledge Management: Representation, Mining and Molding Function Behavior Heuristics Design Process ……….

Kinds of Ontologies Terms General Logic Thesauri formal Taxonomies Frames (OKBC) Data Models (UML, STEP) Description Logics (DAML+OIL) Principled, informal hierarchies ad hoc Hierarchies (Yahoo!) structured Glossaries XML DTDs Data Dictionaries (EDI) ‘ordinary’ Glossaries XML Schema DB Schema Glossaries & Data Dictionaries MetaData, XML Schemas, & Data Models Formal Ontologies & Inference Thesauri, Taxonomies

Technical Challenges 1. Knowledge Management: Shared Information and Knowledge Intangible Transient Tangible (Product/Process) Smith model

Technical Challenges 1. Knowledge Management 2. Repositories: Capture and Reuse

Initial startup screen

Motor added

Gearbox added

Chuck added

Complete drill model

Simulation

Technical Challenges 1. Knowledge Management 2. Repositories: Capture and Reuse 3. Immersive Environments

Technical Challenges 1. Knowledge Management 2. Repositories: Capture and Reuse 3. Immersive Environments 4. Standards

Design-Manufacturing Integration a Traditional CAD AP 203+ Design for X (Knowledge-based) TCAD-KBCAD Immersive CAD (Virtual Assembly) Virtual Assembly AP Process Constraints Assembly Constraints Assembly Planning New AP Process Planning (NC) New AP (AP 203, 214, 224) Manufacturing Simulation New AP SIF-LM Solid Free Form Fabrication AP 209, AP... Analysis

Communication Levels

PLM/KM and Standards Discovery Conceptual Detailed Manufacture Testing Consumer Disposal Design Design Quality Market STEP/ PDM CPM/OAM {Function, Form, Behavior, Requirements, Technology} PLM SUPPORT {Creation, Reuse, Management of IP}

DESIGN ORGANIZATION DETAILED DESIGN Semantic Layer (OWL/RDF/XML) Interface Layer (XML/RDF/Java) DAML JDBC/ODBC/XSQL Process Engineering CAPP/ MES eCommerce Internet Auctions Enterprise operation ERP/SCM RosattaNet, SCOR PSL BizTalk,ebXML,BPML, cXML... Product Engineering CAD/CAE/CAM Agents Content Management Security Digital Rights Management Archival Database server STEPml, PDML, PDX Visualization Users XrML, ORDL, DRM, IPR… JX3D, U3D, JTOpen Web Services Current Future Content Layer DISPOSAL IDEATION CONCEPTUAL DESIGN PRODUCT USE MANUFACTURING DESIGN EVALUATION DETAILED DESIGN IDEATION CONCEPTUAL DESIGN DISPOSAL PRODUCT USE DESIGN EVALUATION PLM/KM and Interoperability

Self-integrating systems Explicit, formal semantics Common models of data Self-describing systems Roadmap for Systems Integration

Technical Challenges 1. Knowledge Management 3. Repositories: Capture and Reuse 3. Immersive Environments 4. Standards 5. Constraint Management

Technical Challenges 1. Knowledge Management 2. Repositories: Capture and Reuse 3. Immersive Environments 4. Standards 5. Constraint Management 6. Negotiation Tools and Techniques

Technical Challenges 1. Knowledge Management 2. Repositories: Capture and Reuse 3. Immersive Environments 4. Standards 5. Constraint Management 6. Negotiation Tools and Techniques 7. Database Organization and Access

Database Organization and Access Traditional (Short Duration) Collaborative DesignFramework Design Analysis Visualization Work Flow Design Repository Design Evolution(PDM) Case Studies Component Data Other Resource Data …. Collaborative (Long Duration)

Technical Challenges 1. Knowledge Management 2. Repositories: Capture and Reuse 3. Immersive Environments 4. Standards 5. Constraint Management 6. Negotiation Tools and Techniques 7. Database Organization and Access 8. Design supply chains

The Supply Chain

Automobile Supply Chain: Example

Types of Supply Chain Collaborations Design Manufacture

Design Supply Chain Issues Design management Outsource vs In-house Sensor based and RFID based management of maintenance and monitoring of production, supply chain, inventory and product performance

Technical Challenges 1. Knowledge Management 2. Repositories: Capture and Reuse 3. Immersive Environments 4. Standards 5. Constraint Management 6. Negotiation Tools and Techniques 7. Database Organization and Access 8. Design Supply Chains 9. Remote Monitoring and Sharing

Technical Challenges 1. Knowledge Management 2. Repositories: Capture and Reuse 3. Immersive Environments 4. Standards 5. Constraint Management 6. Negotiation Tools and Techniques 7. Database Organization and Access 8. Design Supply Chains 9. Remote Monitoring and Sharing 10. Security

Acknowledgments Rachuri Sudarsan, Eswaran Subrahmanian, Steven Fenves, Kevin Lyons, Simon Szykman,(with help from Chris Paredis) contributed to this presentation. Other members of the Manufacturing Integration Program working on various product engineering aspects are Shaw Feng, Xuan Zha, Sebti Foufou, Junhwan Kim, and Conrad Bock.