Selex ES Detector Developments

Slides:



Advertisements
Similar presentations
A photon-counting detector for exoplanet missions Don Figer 1, Joong Lee 1, Brandon Hanold 1, Brian Aull 2, Jim Gregory 2, Dan Schuette 2 1 Center for.
Advertisements

HgCdTe Avalanche Photodiode Arrays for Wavefront Sensing and Interferometry Applications Ian Baker* and Gert Finger** *SELEX Sensors and Airborne Systems.
Lessons Learned from a Decade of SIDECAR ASIC Applications
16 January 2003STScI TIPS1 JWST's Near-Infrared Detectors: Ultra-Low Background Operation and Testing Bernie Rauscher, Don Figer, Mike Regan, Sito Balleza,
The Second Generation of IR detectors for WFC3 Massimo Robberto European Space Agency and Space Telescope Science Institute.
Observational techniques meeting #7. Detectors CMOS (active pixel arrays) Arrays of pixels, each composed on a photodetector (photodiode), amplifier,
The YL2000 FTIR.
1 PHYSICS Demonstration of a Dualband IR imaging Spectrometer Brian P. Beecken Physics Dept., Bethel University Paul D. LeVan Air Force Research Lab, Kirtland.
CHARGE COUPLING TRUE CDS PIXEL PROCESSING True CDS CMOS pixel noise data 2.8 e- CMOS photon transfer.
IR Cloud Camera D. Burke DES Calibration Telecon May 13, 2009.
Optoelectronic Devices (brief introduction)
Near-Infrared Detector Arrays M. Robberto (with several slides grabbed from J. Beletic, K. Hodapp et al.)
Semiconductor Light Detectors ISAT 300 Foundations of Instrumentation and Measurement D. J. Lawrence Spring 1999.
Detection Methods Coherent ↔ Incoherent Photon Detection ↔ Bolometric Photon Counting ↔ Integrating.
1 PHYSICS Progress on characterization of a dualband IR imaging spectrometer Brian Beecken, Cory Lindh, and Randall Johnson Physics Department, Bethel.
Quantum Well Infrared Detector
CCD-style imaging for the JCMT. SCUBA-2 technology  the ability to construct large format detector arrays  signal readouts that can be multiplexed To.
Power Distribution FPGADDR2 OEM Board Flash MEMSSDINSD3 Cameras Connector Board 1.2V1.8V5V3.3V 3.3V, 5V, 12V 15V3.3V9-36V.
RIT Course Number Lecture CMOS Detectors
Earth Systems Science Jeff Puschell Jan van Aardt Craig McMurtry John Border Stephanie Sublett.
Fiber-Optic Communications
Mid-IR photon counting array using HgCdTe APDs and the Medipix2 ROIC
Medipix2 meeting Dec Medipix Activity at Berkeley John Vallerga, Jason McPhate, Anton Tremsin and Bettina Mikulec.
September 17, 2014 Design and Characterization of a High-Speed Multi-frame Hybrid CMOS Camera J.L. Porter 1, L.D. Claus 1, L. Fang 1, R.R. Kay 1, M.W.
Charge-Coupled Device (CCD)
CMOS Detector Technology
IR (Infrared) Night Vision Weapon Detection Security Monitoring Firefighting.
CUÑADO, Jeaneth T. GEQUINTO, Leah Jane P. MANGARING, Meleria S.
A multi-chip board for X-ray imaging in build-up technology Alessandro Fornaini, NIKHEF, Amsterdam 4 th International Workshop on Radiation Imaging Detectors.
Zero Read Noise Detectors for the TMT Don Figer, Brian Ashe , John Frye, Brandon Hanold, Tom Montagliano, Don Stauffer (RIDL), Brian Aull, Bob Reich, Dan.
ELECTRON- AND HOLE- AVALANCHE HgCdTe PHOTODIODE ARRAYS FOR ASTRONOMY Donald N. B. Hall Institute for Astronomy University of Hawaii.
Introduction on SiPM devices
Progress Towards Active Pixel Sensor Detectors for Solar Orbiter Dr Nick Waltham Head of Imaging Systems Division, Space Science & Technology Department,
Photon detection Visible or near-visible wavelengths
UMPC meeting STMicroelectronics Oct 21st Image Sensors with 3D Heterogeneous Integration GIP-CNFM November, 26th 2009 Jean-Luc Jaffard : Deputy.
1HSSPG Georgia Tech High Speed Image Acquisition System for Focal-Plane-Arrays Doctoral Dissertation Presentation by Youngjoong Joo School of Electrical.
STATUS REPORT OF FPC SPICA Task Force Meeting March 29, 2010 MATSUMOTO, Toshio (SNU)
Fast Detectors for Medical and Particle Physics Applications Wilfried Vogel Hamamatsu Photonics France March 8, 2007.
AlGaN/InGaN Photocathodes D.J. Leopold and J.H. Buckley Washington University St. Louis, Missouri, U.S.A. Large Area Picosecond Photodetector Development.
Performances of the COROT CCDs for high accuracy photometry Pernelle Bernardi and the CCD team From Meudon : Tristan Buey, Vincent Lapeyrere, Régis Schmidt,
Silicon Photomultipliers
10/26/20151 Observational Astrophysics I Astronomical detectors Kitchin pp
Infrared Sensor Chip Systems for ESA’s Euclid Mission
Fully depleted MAPS: Pegasus and MIMOSA 33 Maciej Kachel, Wojciech Duliński PICSEL group, IPHC Strasbourg 1 For low energy X-ray applications.
WFIRST 10  m Pixel Pitch Detector Considerations March 10, /10/
MIT Lincoln Laboratory NU Status-1 JAB 11/20/2015 Advanced Photodiode Development 7 April, 2000 James A. Burns ll.mit.edu.
1 Development of Multi-Pixel Photon Counters (1) S.Gomi, T.Nakaya, M.Yokoyama, M.Taguchi, (Kyoto University) T.Nakadaira, K.Yoshimura, (KEK) Oct
Observational Astrophysics I
1. 2 Content: ► 1pc Magnus Fusion Aircraft Vantage ► 1pc - Notebook based workstation for camera control and video display and storage ► 1pc - Peripherals.
HEXITEC ASIC – A Pixellated Readout Chip for CZT Detectors Lawrence Jones ASIC Design Group Science and Technology Facilities Council Rutherford Appleton.
The Development of the Fabrication Process of Low Mass circuits Rui de Oliveira TS-DEM.
December Status of MRS photodiodes ND280 Convener’s Meeting, 9 June 2006 Yury Kudenko INR, Moscow.
The InGaAs IR Array of Chunghwa Telecom Laboratory Chueh-Jen Lin and Shiang-Yu Wang, Optics and Infrared Laboratory In 2006, Advanced Technology Laboratory.
MPI Semiconductor Laboratory, The XEUS Instrument Working Group, PNSensor The X-ray Evolving-Universe Spectroscopy (XEUS) mission is under study by the.
M. TWEPP071 MAPS read-out electronics for Vertex Detectors (ILC) A low power and low signal 4 bit 50 MS/s double sampling pipelined ADC M.
RD program on hybrids & Interconnects Background & motivation At sLHC the luminosity will increase by a factor 10 The physics requirement on the tracker.
Low Mass, Radiation Hard Vertex Detectors R. Lipton, Fermilab Future experiments will require pixelated vertex detectors with radiation hardness superior.
Focal Plane Arrays and Focal Plane Electronics for Large Scientific Telescopes The HAWAII-2RG (H2RG) is the leading IR focal plane array (FPA) in ground-
Topic Report Photodetector and CCD
Optical Emitters and Receivers
4x8 Mosaic Camera Development
OPTICAL SOURCE : Light Emitting Diodes (LEDs)
Detectors of JWST Near IR Instruments
Infrared Detectors Grown on Silicon Substrates
SDW, Baltimore Adrien Lamoure
Detector Basics The purpose of any detector is to record the light collected by the telescope. All detectors transform the incident radiation into a some.
Spectral Imager Product
ECE699 – 004 Sensor Device Technology
New detectors are needed! Prototype Characterization
PYTHON25K: CMOS Image Sensor, 26.2 MP, Global Shutter
Presentation transcript:

Selex ES Detector Developments Peter Knowles SDW 2013

Established Array Capability ACRT growth for photoconductors, visible to 20µm LPE growth on CZT for homojunctions and APDs, visible to 10µm MOVPE growth on 3” GaAs substrates for heterostructures, 2 to 14µm Dual band arrays Die and wafer scale processing of FPAs, up to 1080x1920 Pixel size down to 12µm

Multilayer MOVPE structure

Design and technology – MOVPE MCT Mesa etched diodes Excellent MTF due to physical isolation of absorber layer, eliminating electrical crosstalk Geometry gives optical concentrator and small p-n junction area relative to pitch Hybridization MCT arrays hybridized using reliable indium bump technology Now I will talk about some of the technology, starting with the MCT photodiode technology. We grow our MCT material on GaAs substrates. Using MOVPE. This provides a high volume production capability which can be used to grow a wide variety of structures of different bandgaps with grown-in P-N junctions. It is possible to grow Long, Mid and Short wave MCT. This paper reports MW results. After the material is grown mesas are etched giving individually isolated mesas with excellent MTF. The conical shape of the mesas

CONDOR II Dual Band Detector 640 x 512 / 24µm DWIR MWIR 3.7 – 4.95µm LWIR 8 – 9.4µm

Complementary Capabilities In-house ROIC design, 0.6µm and 0.35µm CMOS migrating to 0.18µm Vacuum packaging and cryogenics Warm electronics, module sets, and cameras Tri Glycine Sulphate

High Performance Electronics

Fast Frame Camera Module For all high speed imaging applications: Military, Scientific, Industrial Size – 90 x 90 x 115mm Weight – 940g Power <11W @ 23oC Array - 384x384 MCT Pixel - 20µm Frame rate 1000fps @ 384x384 2000fps @ 256x256 4000 fps @ 192x192 6500 fps @ 144x141 CameraLink® video interface Serial control interface BIT Windowing Ruggedised

Water droplet at 1000fps

Thermal Imaging Cameras SLX camera series SLX-Osprey SLX-Hawk SLX-Merlin SLX-Harrier SLX-Condor New Horizon SD and HD

DLATGS Crystal Room temperature operation High detectivity Wide response 0.2 to >100µm High Curie temperature 60oC Alanine doping Deuterated growth solution

DLATGS Applications Lab based DLATGS Detectors Space Hand-held Developing Markets Portable Instruments - reducing size and power consumption and improving product robustness IR Microscopy - competing with single element LN2 cooled CMT detectors Detectors for SpaceHigh power applications New Markets Long wavelength applications THz Hand-held Portable

Recent Developments HOT Horizon SD and HD cameras Large format ROICs, smaller pixels Space Programmes APDs – LPE and MOVPE Ian Baker and Johann Rothman - Physics and Performance of HgCdTe APDs Gert Finger – NIR HgCdTe Avalanche Photodiode Arrays for Wavefront Sensing and Fringe Tracking

Shows benefits of MCT grown by MOVPE and mesa diode design HOT MCT NETD (mK) Pixel Count NETD Histogram HOT HAWK MWIR Array (155K) Array 640 x 512 Pitch 16µm MCT cut-off 5.1µm (@155K) Median NETD 17.8mK SD 2.9mK Defects 217 Operability 99.93% Dark current 8.5x10-6A.cm-2 Shows benefits of MCT grown by MOVPE and mesa diode design

160K Image

Horizon ITAR free Very long life linear cooling engine – 50,000 hour life Common Electronics for SD and HD variants Common F/4.0 zoom lens for SD and HD zoom ratio of 12:1 Narrow FoV IFoV SD = 16.7Radians per pixel (640x512, 16µm) HD = 12.5Radians per pixel (1280x720, 12µm) Video and Control over Ethernet Image processing features including but not limited to: Turbulence mitigation Electronic image stabilisation Mass <22kg, size 305 x 305 x 625 16

FALCON – 3-side buttable megapixel array Large Format ROICs 1920x1080 All circuitry Timing automatic – Do NOT CLICK! FALCON – 3-side buttable megapixel array for large area mosaics

FALCON MCT Array FALCON Array Array 1920 x 1080, pixel 12µm 8x analogue outputs Non uniformity <1% (max), 0.7% (typ) Non linearity +/-0.5% (max) CHC = 3.5Me- (ITR), 2.9Me- (IWR) Power <15mW Readout modes: ITR, IWR, Windowing 2 megapixel MCT array Array buttable on 3-sides Readout circuits Bond pads

Array test results- NETD FALCON array trials High sensitivity, high uniformity, excellent operability Parameter Pixel array experiment 1 2 3 Pedestal (mV) 480 600 666 Pedestal Std Dev (mV)  28 28 46 Mean signal (mV/K) 18 22 21 Signal Std Dev (mK) 0.6  0.6 1.1 Median NETD (mK) 27 25 29 NETD Std Dev (mK) 3.7 5.4 Operability (%) 99.76 99.86 99.63 Row Column NETD (K)

FALCON 1920x1080 / 12µm pitch Image

16 Megapixel MWIR mosaic array Array tiles FALCON HD1920x1080p / 12µm arrays 3-side buttable MWIR Mosaic Array 8x tiles Power <100mW High fill factor >99% Scalable to Other matrix sizes Larger arrays (2kx2k, 4kx4k) Smaller pixels (10µm, 8µm)

Space Programmes Large format Near Infrared Array (ESA) Currently in phase 2: deliverable is 1032 x 1280, 15mm pitch, 2.1µm cut-off, thinned MCT Source follower architecture, enabled for APDs Selex provide consultancy and test facility to Caeleste on parallel ASIC development SWIR development (ESA) 2048 x 2048, 17mm pitch, 2.5mm cut-off, enabled for APDs, thinned MCT VLWIR development (ESA) Low dark current Up to 14.5 mm cut-off wavelength OSIRIS Rex Thermal Emission Spectrometer (Arizona State University) NASA asteroid sample return mission DLATGS uncooled pyroelectric detector 4 – 50mm spectral response

Large format thinning trials for extended VIS/NIR response

Large format thinning trials

Etch time effect on spectral response

Large format array packaging Builds upon e2v experience of close buttable packages Expansion matched header (molybdenum) Wirebond to adjacent pcb with integral flexi Both ROIC and pcb glued to header Initial trials indicate that edge effects dominate and the expected stress is not size sensitive

Avalanche gain stability with respect to operating temperature APDs Avalanche gain stability with respect to operating temperature A 2.5μm (cut-off wavelength) HgCdTe eAPD array was tested at 80K and 90K operating temperature and the avalanche gain was measured as a function of applied diode bias The graph shows excellent consistency between the two operating temperatures This indicates any system with reasonable control over the FPA temperature will have stable performance in low flux conditions where avalanche gain is required

After a further 24hr Bake at +70C APDs Avalanche gain stability after high temperature baking The HgCdTe APD array was subjected to two high temperature bakes and the performance was measured before and after The results show that the avalanche gain process in the HgCdTe array is unaffected by the high temperature bakes, indicating that the APD array is robust Avalanche Gain Diode Bias (V) Initial Measurement After 72hr Bake at +70C After a further 24hr Bake at +70C 4.6 2.7 5.1 3.2 3.1 5.6 3.7

Noise performance after high temperature baking APDs Noise performance after high temperature baking The dark current in eAPDs in HgCdTe is more sensitive to crystal imperfections than conventional detectors (due to the high bias voltage) and an extremely sensitive test of any degradation mechanism is the noise. The graph below shows the measured noise of the array before and after a 3 day bake at high temperature showing no discernable increase. This shows that there are no significant deterioration mechanisms in HgCdTe eAPDs under normal use.

FALCON 1920x1080 / 12µm pitch Image