NC STATE UNIVERSITY FreePDK15 An Open-Source Predictive Process Design Kit for 15nm FinFET Technology Kirti Bhanushali, W. Rhett Davis (NCSU) International.

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Presentation transcript:

NC STATE UNIVERSITY FreePDK15 An Open-Source Predictive Process Design Kit for 15nm FinFET Technology Kirti Bhanushali, W. Rhett Davis (NCSU) International Symposium on Physical Design April 1, 2015

Motivation Problem Solution Restrictions on PDKs prevent sharing of design data, impede research & teaching Solution Free Predictive PDK, establishes a baseline for research & teaching in design, architecture, manufacturing, and automation FreePDK45 accomplished this for 45nm, FreePDK15 seeks to do the same for 15nm

Process Cross Section What everyone should know: FinFETs & MOL layers Si Fins Gate AIL1 Active Interconnect Level-1 (AIL1) AIL2 Active Interconnect Level-2 (AIL2) GIL Gate Interconnect Layer (GIL) Layer Interconnect Overlap Level Metal-1 Level-2 Contact to Metal-1 (Applies to AIL-2 and GIL) FEOL BEOL What everyone should know: FinFETs & MOL layers Thanks to Alex Toniolo (NanGate) for suggesting layers Schuddinck, et al (IEDM 2012) suggested dimensions

Width Quantization Of Active Active width grows in increments of 40nm Weff = 2*Hfin + Wfin FinFETs have integer number of fins 48nm 88nm 128nm 40nm

Planar Device vs. FinFET Traditional planar MOS FinFET in Layout View FinFET on Physical Mask FINS Fin Interconnect

MOL Layers in Layout View Metal1 Interconnect to Power rails Interconnect PMOS & NMOS Vias for connecting higher metal layers to Gate and Active interconnects MOL Layers reduce resistance, improve density

Multiple-Patterning Rules Two colors for Gate, MOL, and 1X Metal Layers Metal pitch for different colors is small Metal pitch for the same color is larger Optional uncolored layer post layout coloring (GATE only) Also: Gate Cut Layer Metal1A Metal1B 36nm 54nm

Other Restrictive Rules Width and spacing is orientation-dependent, to account for off-axis illumination AIL1, AIL2, GIL and GATE should not bend, to reduce pinching Metal1A 28nm 56nm

Inverter Layout Layout – Inverter AIL1 GIL Dummy Gate AIL2 1:1 PMOS to NMOS

NAND4 Layout NAND4 GATEA MINT1 GATEB M1B

Complex Layouts Complex Layouts Inverter cell NAND4 cell

Layout Density Comparison Density Evaluation Layout Density Comparison FinFET inverter @14nm : MOS Inverter @45nm Ideal shrink factor- 1:9 Achieved shrink factor- 1:6 FinFET layout density is 1.3x MOSFET (Alioto, ICM 2009) Cause Width Quantization Higher Hfin for same Weff

Comparison to NanGate Library NanGate evaluation: Rules not dense enough DRC errors for SDFFRNQ_X1 cell given below Working with NanGate to revise rules

Future Releases LVS, PEX rules in development Planned for release summer 2015 Semi Global M1x2 (130 nm thick) Intermediate M1x1 (60 nm thick) M1 (60 nm thick) Global M1x4 (260 nm thick) Metal 1 Pitch

Licensing Licensed for Academic Use under 3-clause BSD License Caveat: Cannot distribute a Cell Library until Summer 2016 Please contact us for commercial license Click through license may be possible with your help

Conclusion First-pass FreePDK15 with DRC is now available, including new 15nm features FinFETs MOL Layers Multiple Patterning LVS & PEX rules available in summer How you can help Feedback on design rules Request a commercial use license

Acknowledgements Alex Toniolo Joseph Davis, Tarek Ramadan, Ahmed Hammed Fathy, Omar El-Sewefy , Ahmed El-Kordy, Hend Wagieh (Mentor Graphics)