Defense MicroElectronics Activity Defense MicroElectronics Activity VE00.06.01 The Impact of System Level Design on the DMS World Keith Bergevin Senior.

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Presentation transcript:

Defense MicroElectronics Activity Defense MicroElectronics Activity VE The Impact of System Level Design on the DMS World Keith Bergevin Senior Design Engineer th St., Bldg. 620 Sacramento, CA Phone: (916) , Fax: (916) Keith Bergevin Senior Design Engineer th St., Bldg. 620 Sacramento, CA Phone: (916) , Fax: (916)

2 Background: Design Methodologies – What’s Next?  Pencil, Paper, Drafting Table  Quest for Computer Entry of Schematics  Schematic Capture  Quest for Faster, More Efficient Hardware Design Methods  Hardware Description Languages  Quest for Faster, More Efficient Design of Entire Systems  Pencil, Paper, Drafting Table  Quest for Computer Entry of Schematics  Schematic Capture  Quest for Faster, More Efficient Hardware Design Methods  Hardware Description Languages  Quest for Faster, More Efficient Design of Entire Systems

3 Briefing Roadmap  What is System Level Design?  Benefits of System Level Design  Overview of Evolving System Level Design Languages  Impact of SLD on the DMS Community  DMEA’s Role in SLD  What is System Level Design?  Benefits of System Level Design  Overview of Evolving System Level Design Languages  Impact of SLD on the DMS Community  DMEA’s Role in SLD

4 What is System Level Design?  Today’s Systems Comprised of Multiple High-Density Components  Processors, RAM, ROM, I/O, ASICs, etc.  Each Component Separately Modeled, Simulated, & Designed  Various Methods used to Integrate Components into a System  System Level Design  One Specification to Model, Simulate, Synthesize all Functions  All Functions Integrated onto a Single Device called System-on-a- Chip (SoC)  Today’s Systems Comprised of Multiple High-Density Components  Processors, RAM, ROM, I/O, ASICs, etc.  Each Component Separately Modeled, Simulated, & Designed  Various Methods used to Integrate Components into a System  System Level Design  One Specification to Model, Simulate, Synthesize all Functions  All Functions Integrated onto a Single Device called System-on-a- Chip (SoC)

5 The Benefits of System Level Design (SLD)  Modeling of Entire System on a Chip (SoC) with a Single, Executable Specification  Hardware/Software Verification at an Earlier Stage  Concurrent H/W & S/W Design & Verification  Eliminate Intercommunication Translation Process  Traditionally, H/W Designed with VHDL or Verilog  S/W Designed with C/C++, Java, etc.  Large Overhead Incurred in Passing Data  Modeling of Entire System on a Chip (SoC) with a Single, Executable Specification  Hardware/Software Verification at an Earlier Stage  Concurrent H/W & S/W Design & Verification  Eliminate Intercommunication Translation Process  Traditionally, H/W Designed with VHDL or Verilog  S/W Designed with C/C++, Java, etc.  Large Overhead Incurred in Passing Data

6 Leading System Level Design Languages  SystemC  Started with Technical Agreement and Development by Synopsys Inc., CoWare Inc., and Frontier Design Inc.  Extends C/C++ Language to Hardware and System Design  Freely Available through Open Source Licensing  Administered by Open SystemC Initiative (OSCI) Steering Group  SystemC  Started with Technical Agreement and Development by Synopsys Inc., CoWare Inc., and Frontier Design Inc.  Extends C/C++ Language to Hardware and System Design  Freely Available through Open Source Licensing  Administered by Open SystemC Initiative (OSCI) Steering Group

7 Leading System Level Design Languages  SystemC Primary Advantages:  Large Base of C/C++ Programmers  C/C++ Widely used to Model & Simulate Hardware  SystemC Primary Disadvantages:  Minimal Tools for Synthesis at this Time  C Language does not Support Notion of Time, Concurrency, Hardware Data Types, etc.  SystemC Primary Advantages:  Large Base of C/C++ Programmers  C/C++ Widely used to Model & Simulate Hardware  SystemC Primary Disadvantages:  Minimal Tools for Synthesis at this Time  C Language does not Support Notion of Time, Concurrency, Hardware Data Types, etc.

8 Leading System Level Design Languages  Superlog  Superset of Verilog, with Addition of C Programming, System, & Verification Capabilities  Superlog Advantages  Large Base of Verilog Hardware Designers  Mature Synthesis Tools Available  Superlog Disadvantages  Requires Extensions to Achieve System Level Capabilities  Superlog  Superset of Verilog, with Addition of C Programming, System, & Verification Capabilities  Superlog Advantages  Large Base of Verilog Hardware Designers  Mature Synthesis Tools Available  Superlog Disadvantages  Requires Extensions to Achieve System Level Capabilities

9 Leading System Level Design Languages  CynApps  Developed by CynApps Inc. Founded 1998  C++ with Addition of Hardware Concurrency and Bit Accurate Data Types  CynApps Advantages  C++ Based  Models Hardware at All Levels of Abstraction  CynApps Disadvantages  Requires Translation to Verilog For Synthesis  CynApps  Developed by CynApps Inc. Founded 1998  C++ with Addition of Hardware Concurrency and Bit Accurate Data Types  CynApps Advantages  C++ Based  Models Hardware at All Levels of Abstraction  CynApps Disadvantages  Requires Translation to Verilog For Synthesis

10 Impact of SLD from a DMS Standpoint  System-on-a-Chip (SoC) Design Magnifies Many DMS-Type Problems Currently Associated with ASIC Devices:  Replace with Alternate Source?  No. Custom Designs Virtually Ensure No Second Source Available  Re-Target?  Difficult. The First Generation of SoCs May Contain Combination of VHDL, Verilog, and one or more of the SLD Languages.  Reverse Engineer?  Extremely Difficult.  System-on-a-Chip (SoC) Design Magnifies Many DMS-Type Problems Currently Associated with ASIC Devices:  Replace with Alternate Source?  No. Custom Designs Virtually Ensure No Second Source Available  Re-Target?  Difficult. The First Generation of SoCs May Contain Combination of VHDL, Verilog, and one or more of the SLD Languages.  Reverse Engineer?  Extremely Difficult.

11 DMEA’s Role in System Level Design and SoC Technology  Retain Step-for-Step Expertise in SoC with Industry  Imperative to Understand the Technology in Order to Develop DMS Solutions  Necessary to Understand SoC Technology in Order to Develop Guidelines for SoC Contractual Specifications  Continue to Strengthen Expertise in IP Core Design  Virtually all SoCs are Built via Integration of IP Cores  IP Core Re-Targeting is one of the few Cost-Effective Techniques Available  DMEA Flexible Foundry Provides Long-Term Support  Ensures Future Component Availability  Retain Step-for-Step Expertise in SoC with Industry  Imperative to Understand the Technology in Order to Develop DMS Solutions  Necessary to Understand SoC Technology in Order to Develop Guidelines for SoC Contractual Specifications  Continue to Strengthen Expertise in IP Core Design  Virtually all SoCs are Built via Integration of IP Cores  IP Core Re-Targeting is one of the few Cost-Effective Techniques Available  DMEA Flexible Foundry Provides Long-Term Support  Ensures Future Component Availability

12 Summary  Technology Trends  Higher Density Custom Designs (SoCs)  New Generation of Hardware Description Languages  From a DMS Standpoint: No Easy Solutions  Sole Source Components  Difficult to Reverse Engineer  May be Difficult to Re-Target (Multiple Data Formats)  DMEA’s Approach to Mitigate Next Generation DMS Problems  Maintain State-of-the-Art Technical Skills  Continue Development of Cost-Effective Core Retargeting  Target Flexible Foundry Devices  Technology Trends  Higher Density Custom Designs (SoCs)  New Generation of Hardware Description Languages  From a DMS Standpoint: No Easy Solutions  Sole Source Components  Difficult to Reverse Engineer  May be Difficult to Re-Target (Multiple Data Formats)  DMEA’s Approach to Mitigate Next Generation DMS Problems  Maintain State-of-the-Art Technical Skills  Continue Development of Cost-Effective Core Retargeting  Target Flexible Foundry Devices