Quality Improvement Activity of Capacitor

QI team Chairman Adviser Leader Secretary Sub-Leader Member

Assembly process (soldering) Issuing process Coating process Electrical testing process Out going process Processing Steel Type 151K DC Volt TV Test (Measuring process ) Customer

Appearance Dimension Electrical Customer complaint THEME SELECTION

Theme selection Q: which problem you are going to solve first? Why?

Cause-and-effect analysis Material Connector (metal) Coating (resin, polymer) contact Body (ceramic) Crack, chip resistivity Heat resistance Environment Heat Applied voltage complaint defect analysis using dispersion C&E diagram Electrical damage (burn& short circuit)

Back side Chipping Resin swelled Small ceramics L Short circuit complaint defect analysis

Analyze position of chip on TV defect Position on unit

Relationship between short-circuit voltage and chip size large small Q: what is the meaning of this relationship?

Cause-and-effect analysis Issuing Assembly (soldering) Electrical testing Coating (chipping) defect analysis using process C&E diagram Chipping

Chip Unit Q: which process you are going to solve first? Why?

Unit issue method Cause: Chip unit occurred when pouring unit to the box for confirm unit weight by this method make more chip unit. Action : Cancel pouring unit by pick up unit with vinyl sheet and take it in to prepared box for confirm unit weight after that send the unit with prepared box to DLS process. Confirm unit weight on vinyl sheet. Confirm unit weight by pouring unit to the box. ISSUING (1)

Action: 1.Hopper :Use for supply unit to part feeder. 2. Change unit supply method by pick up all unit with vinyl sheet 3. Modify circuit to auto unit supply at hopper Cause: Unit supply by use small plastic box pour unit direct to part feeder so it make unit broken and chip. No Hopper Part feeder Hopper Part feeder ISSUING (2)

Unit feeding track Cause: Chip unit occurred when unit running attack to final track of part feeder Action : Addition absorber rubber for protect unit attack with steel material directly. Assembling (1)

Steel Type UPE Type Cause: Unit head pusher attach to unit edge that made from Steel material. Effect to edge of unit chip. Action: We change material type to UPE type for soft contact with unit edge DLS process Assembling (2)

Cause: Unit easy impact to guide of products container.That effect to edge of unit chip. Action: We took action by change and fix container type to be no slot type. And attach coating tape for prevent edge of unit attack with guide. Container slot type Container no slot type Assembling (3)

Cause: Unit impact take out rail guide at the corner position Countermeasure: Changed takeout type to slope type Chipping positionSlop type Assembling (4)

TV Defect ( Test Voltage ) 151K DC Volt TV Defective Means defect that occur after test voltage that effect to product’s short circuit Electrical testing

Old criteria New criteria

Data from experiment: 50 Kpcs

Cause-and-effect analysis Issuing Assembly (soldering) Electrical testing Coating Chipping Weibull distribution Raw material Mechanical properties Electrical properties resistivity Chemical properties