1 AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS Etienne SICARD INSA/DGEI University of Toulouse Toulouse - France Alexandre BOYERINSA/DGEIUniversity of Toulouse31077 Toulouse -

2 1.CONTEXT 2.EDUCATIONAL NEEDS 3.STANDARDS 4. WHAT IS IC-EMC 5. EXAMPLE 6. EVALUATION 7. CONCLUSION SUMMARY

3 Emission of EM waves Susceptibility to EM waves EMC – ONE ACRONYM, TWO CONCEPTS Personnal Safety systems interferences Hardware fault Software failure Function Loss Components Equipements Carbon airplane Boards Radar CONTEXT

Technology Complexity Packaging 180nm 50M Core 1 A Core 1 A nm 100M Core+ DSP 3 A Core+ DSP 3 A nm 500M Multicore, DSPs, FPGA, RF multiband Memories Sensor 30 A Multicore, DSPs, FPGA, RF multiband Memories Sensor 30 A Embedded blocks transient current nm 250M Core DSPs eMem 10 A Core DSPs eMem 10 A TRENDS – INCREASED PARASITIC EMISSION CONTEXT nm 1G Multicore, Multi DSP Reconf FPGA, Multi RF Memories Sensors 100 A Multicore, Multi DSP Reconf FPGA, Multi RF Memories Sensors 100 A Increased complexity, IOs number, operating frequencies, transient current

µ0.35µ0.18µ90nm65nm Technology 0.7 Less voltage margin Supply (V) nm I/O supply Core supply 150 mV margin CONTEXT TRENDS - INCREASED SUSCEPTIBILITY 32nm

6 EMC Issues PACKAGES AS ANTENNAS CONTEXT Package dimensions are close to lambda/4 at GHz range

7 DESIGN Architectural Design Design Entry Design Architect FABRICATION EMC compliant EMC Simulations Compliance ? GO NO GO Design Guidelines Tools Training This work EMC VALIDATED BEFORE FABRICATION CONTEXT What IC designers and EMC experts are dreaming of…

8 EDUCATIONNAL NEEDS A nightmare? EMC TRAINING AT IC LEVEL – HOW TO START?

9 EDUCATIONNAL NEEDS A nightmare? EMC TRAINING AT IC LEVEL – HOW TO START?

10 EDUCATIONNAL NEEDS Illustrate technology scale down – Complexity – Current switching – Impact on EMC Illustrate package role and complexity Simulate simple models with simple simulator (SPICE-like) Post-process in Freq. domain for Spectrum comparison “see” E, H fields from currents and voltage Investigate “what if” with students 3D real-time view in Microwind IBIS 3D viewer in Microwind THINGS WE NEED TO DO

11 EDUCATIONNAL NEEDS Give key facts about technology impact on EMC Introduce standard measurement methods Simulate first order effects using standard model approaches Give the basics of – emission prediction – immunity simulation Give simple design rules for improved design Address both – Undergraduate, graduate students – Engineers in companies Leave plenty of space for exercises and real-case problem solving Fit the course in a one or two days format (cost, duration) OUR PROPOSAL – KEY FACTS

12 EDUCATIONNAL NEEDS Overview (EMC-IC for managers) Basic concepts Measurement methods Guidelines for improved EMC Case study EMC models Chip-chip coupling OUR PROPOSAL – COURSE OUTLINES

13 STANDARDS International Standards IEC EMISSION MEASUREMENT METHODS IEC (TEM : 1GHz) IEC /6 (Near field scan, 5GHz) IEC (1/150 ohm, 1 GHz) IEC (WBFC, 1 GHz) IEC (Mode Stirred Chamber: 18 GHz) IEC (GTEM 18 GHz) Most usual radiated method Most usual conducted method

14 STANDARDS IMMUNITY MEASUREMENT METHODS International Standards IEC IEC (Bulk Current Injection : 1 GHz) IEC (Direct Power Inj 1GHz) IEC (TEM/GTEM) IEC (WBFC 1 GHz) New proposal: (LIHA : 10 GHz) Still research: (NFS 10 GHz) Most usual conducted method Most usual radiated method

15 STANDARDS International Standard IEC MODEL APPROACHES 1. ICEM-CE - Conducted RF emission 2. ICEM-RE - Radiated RF emission 4. ICIM-CI - Conducted RF immunity4. ICIM-RI - Radiated RF immunity

16  A schematic editor to enter macro-models  An interface to WinSpice analog simulator  A post-processor to compare simulated with measured spectrum  An Electromagnetic solver to simulate radiated field  Freeware, online, 250 pp documentation, 15 case studies WHAT IS IC-EMC IC-EMC - A TOOL FOR EMC PREDICTION

17 IC, package and PCB model Basic symbols SCHEMATIC EDITOR WHAT IS IC-EMC Main analysis Spectrum analysis Impedance simulation Near-field simulation Immunity simulation IBIS interface Key tools Smith Chart SPICE compatible

18 Core Model Package Model Probe Model Test board Model Analog Time Domain Simulation Fourier Transform Compare dBµV vs. Frequency Fourier Transform Time-domain measure Frequency measurements Emission prediction approach Simulation Measurements EXAMPLE CONDUCTED EMISSION IEC IEC

19 Emission spectrum analysis EXAMPLE CONDUCTED EMISSION Core Model Probe Model Analog Time-Domain Simulation Fourier Transform Conversion to Win-SPICE dB vs Freq (log) conversion Package Model Test board Model

20 EXAMPLE Emission spectrum analysis CONDUCTED EMISSION Compare dBµV vs. Frequency Frequency measurements What if? Effect of decoupling Effect of package supply pairs Effect of current reduction …

21 Since 2002, more than 20 sessions involving 300 students and engineers have been organized – ISEN France – ENSME France – On-Semiconductors – NOKIA – APEMC Beijing One-day or two-days format. The majority of students said – They understood the mechanisms of parasitic emission and susceptibility – They felt confident in their ability to handle EMC at IC level EVALUATION AUDIENCE

22 EVALUATION #Question 1I appreciated the contents of the training. 2The level of the training is in accordance with my expectations. 3The balance between theory and practice was acceptable 4The contents was adapted to life-long learning. 5I appreciated the documents given in the training. 6I appreciated the way the training was taught 7The contents is clearly related to my work/studies. 8I may use the contents directly in my activities 9The lecturer followed the initial planning 10Overall I was satisfied with the quality of this course. QUESTIONS

23 EVALUATION Answers to questionnaire RESULTS 7. The contents is clearly related to my work/studies. 8. I may use the contents directly in my activities

24  An environment for EMC prediction at IC level and trainings has been developed  The tool is free and is based on measurement and model standards  Trainings help students and engineers to understand the mechanisms of parasitic emission and susceptibility  As little theory as possible  As much practice and examples as possible  Positive feedback from trainees concerning the tool usage for the illustration of EMC concepts (80 – 90 % satisfaction rate) CONCLUSION

25 E. Sicard, A. Boyer, “IC-EMC v.2 User's Manual” ISBN , July 2009, 320 pages, INSA Editor C. Dupoux, S. Akue Boulingui, E. Sicard, S. Baffreau, N. Bouvier, "Measurement and Simulation of Electromagnetic Interference in 3G Mobile Components“, EMC Compo 2009, November 2009, Toulouse, France. S. Akue Boulingui, C. Dupoux, S. Baffreau, E. Sicard, N. Bouvier, B. Vrignon, "An Innovative Methodology for Evaluating Multi-Chip EMC in Advanced 3G Mobile Platforms", IEEE Symposium on EMC, 2009, Austin, USA. S. Bendhia, M. Ramdani, E. Sicard, Electromagnetic Compatibility of Integrated Circuits, book published by Springer, USA, 2006, REFERENCES The tool, manual and course slides are online at

26 THANK YOU FOR YOUR ATTENTION