SLIM - MimoTERA – chip design MimoTera: AMS CUA 0.6 µm CMOS process with 14 µm epitaxial layer – (MIMOSA V), Chip size: 17350×19607µm 2, delivery expected ~15 th of January 2005 Chip prepared for back-thinning Total array of 112× ×153µm 2 square pixels, each pixel – interdigited array of small n-well/p- epi diodes, Respected pad positions from MIMOSA V; but larger size 85×185 µm 2 (bonding), Four sub-arrays of 28×112 pixels read out in parallel t read/integr <100µs, no dead time – alternate integration and readout in halves of pixels, Subarray 0 Subarray 1Subarray 2Subarray × mm 2 digital 28 columns(30 clocks) 112 rows(114 clocks) Combination of detection thinning and microelectronics,
SLIM - MimoTERA – chip design MimoTera: Two 9×9 interdigited arrays of n-well/p-epi diodes (5×5 µm 2 ) with two independent FE electronics, No dead time in pixel operation – alternate reset and integration in both arrays, In-pixel storage capacitors – choice ~0.5pF or ~5pF to cope with signal range, Readout without CDS – kTC noise, Signal swing ~2 V (pixel and chip 40Mpixel/s, 500fF; noise ~1000 e - Å 280 e - kTC 500fF
SLIM - MimoTERA – chip design Pixel schematic diagram Half A Half B Switch to vddato cutconsumptionwhen lineprecharging
1 chip quarter architecture SLIM - MimoTERA – chip design 4×
Column level circuit column input Half A Half B prechargingto low voltage beforeeach readout to speed precharging to vdd voltage before each readout to speed current source OFF horizontal lineto 3:1 MUX current source OFF SLIM - MimoTERA – chip design
Array output circuit horizontal lines (3)4.3 mm SLIM - MimoTERA – chip design reconfigurable gainoutput amplifiergain: ×1 or ×5 3:1 MUX for 3 phasecolumn readout withincreased time for linecharging MUX buffers externalvoltage reference current biasgenerated internallyD/A Convertor