Dr. Bo Marr Ken Prager Raytheon (SAS) Engineering Mark Trainoff Raytheon Advanced Concepts and Technology Sep. 21, 2011 Super Computing with Embedded Efficiency:

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Dr. Bo Marr Ken Prager Raytheon (SAS) Engineering Mark Trainoff Raytheon Advanced Concepts and Technology Sep. 21, 2011 Super Computing with Embedded Efficiency: Electronic Warfare Copyright © 2011 Raytheon Company. All rights reserved. Page 1

Next Gen Electronic Warfare will employ multiple beams (U) Next Generation Electronic Warfare Sense and Attack Systems Multiple simultaneous targets present in current environments Digital techniques allow efficient scaling to large number of beams (> 2) Digital techniques allow neutralization of large number of simultaneous targets (> 10) Systems must be lighter and more efficient = more functionality moved on-chip Active Electronically Scanned Array (AESA) Enables Near-Simultaneous Multi-Mission Capabilities Air-to-Air and Air-to-Ground with One Search-Track Mode Detect/Track Multiple Targets Connectivity with On-board and Off-board Sensors AESA Transmitters enables simultaneous protection of the Strike Package Next gen military systems will require a 10x-100x leap in processing power efficiency Next gen systems require 30 – 300+ GOPS/W in processing power efficiency

Growing gap in processing power efficiency between on-board DoD needs and current technology ≥130 nm 90 nm65 nm45 nm32 nm Due to overall system and interconnect complexity, systems generally lag state of the art processor power efficiency. Year for system is when introduced, with the caveat that the date becomes updated when components are upgraded. Current Processor Efficiency Wall (7-10 GOPS/W) Advanced Digital Beam Former DoD Grade Smartphone ARGUS Full Frame Gotcha Radar (10 kW) Growing gap in processing power efficiency