Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom
OUTLINE Optical Lithography Main Tools Lithography Support Equipment Future Tools and Projects Acknowledgements October 6, 2010
SUSS CONTACT ALIGNER Model MA6 TSA/BSA Alignment Pieces to Full 6” Wafers 1 um Resolution with Vacuum Contact Wafer Direct Bonding October 6, 2010
SF100 XPRESS Maskless Lithography Uses a Range of Wavelengths Smart Filter Technology Process Wafers and Non-Wafer Substrates Process Non-Flat Subs File in BMP October 6, 2010
SF100 EXPRESS October 6, 2010
SF100 EXPRESS October 6, 2010 Photoresist Patterns on Round Substrates
ASML STEPPER Model PAS 5500 /200 5X I-Line SHORT STORY October 6, 2010
SOME DIFFICULTIES October 6, 2010
SOME DIFFICULTIES October 6, 2010
ASML STEPPER Model PAS 5500 /200 5X I-Line 2 Point Global Alignment Resolution < 350nm Single Machine Overlay < 50nm Field Size X Y Max 22.0mm x 27.4mm Pieces to Full 8” Wafers Variable NA Arial TM Illuminator October 6, 2010
ILLUMINATION PATH October 6, 2010
SIZE MATTERS October 6, 2010
ASML STEPPER RETICLE Reticle Size 6” x 6” Quartz 0.250” for Sub-0.5um Pellicle GDSII File Design can be checked before generating reticle October 6, 2010
ALIGNMENT MARK October 6, 2010
ANATOMY OF THE ASML JOB Cells Die and Exposure Fields Images and Image IDs Layer Numbers and Layer IDs Layer ID, Image ID and Reticle ID Image Location and Masking Window Alignment Marks October 6, 2010
RETICLE ORDER FORM October 6, 2010
ASML JOB ORDER FORM October 6, 2010
INITIAL RESULTS Test Mask Megaposit SPR 660 Developer MF-26A Resist Thickness 750nm Exposure 130mJ at -0.1um Focus October 6, 2010
INITIAL RESULTS October 6, 2010
SVG 8800 WAFER TRACK Two Track System One Active Coat Track Send-HMDS-CP-Coat-SoftBake-Receive Configured for 4” or 6” Wafers Two Active Resist Pumps Capable of 3 Resists October 6, 2010
SVG 8800 WAFER TRACK October 6, 2010
SVG 8800 WAFER TRACK IDI M450 Photoresist Pumps ChemNet TM Software Dispense Volume Range 0.1ml to 50ml Viscosity Range 1.0cP to 100cP October 6, 2010
SVG 8800 WAFER TRACK Program #EventOperationArmTimeSpeedAccelExhaust Material s Used 11SPIN00010PI 2771 Target: 10um 2DISP SPIN SPIN EBR SPIN END 9 October 6, 2010 Coat Program
LITHO SUPPORT EQUIPMENT Headway Spin Coaters Headway Stand Alone Coater Hot Plates Acid and Solvent Fume Hoods Carbolite High Temperature Oven October 6, 2010 Vacuum Oven Nanospec Film Thickness Measurement AST Contact Angle Measurement Leica and Nikon Microscopes
HEADWAY SPIN COATERS October 6, 2010
WAFER SURFACE ANALYSIS AST VAC-3000S Contact Angle Measurement October 6, 2010
CARBOLITE HIGH TEMP OVEN Up to 600°C Programmable Eurotherm Controller October 6, 2010
MICROSCOPES Leica and Nikon Microscopes Leica Application Software October 6, 2010
FUTURE PROJECTS Add Developer Track Add Third Resist Pump Add Spin Coater for Thick Resist Applied Material 7830SI CDSEM Several Fume Hoods October 6, 2010
ACKNOWLEGEMENTS Micron Technology & ASML Janine Rush-Byers Micron University Relation Manager Troy Sych ASML VP Strategic Account Management Michael Brennan ASML Regional Customer Support October 6, 2010
International Rectifier Corporation Oleg Khaykin President and CEO Nick Brand GM & VP, El Segundo & WW Wafer Fab Strategies Larry Jones Site Facilities Manager October 6, 2010 ACKNOWLEGEMENTS