1. Chapter 4: Imperfections in Solids 2 Introduction Metals Alloys Solid solutions New/second phase Solute (guest) Solvent (host)

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Presentation transcript:

1

Chapter 4: Imperfections in Solids 2 Introduction Metals Alloys Solid solutions New/second phase Solute (guest) Solvent (host)

Chapter 4: Imperfections in Solids 3 Cu Ni Substitutional Dia: 1.28 Å Dia 1.25 Å Atomic size factor (difference in atomic radii: ±15%) Electrochemical factor (must be close in periodic table otherwise intermetallic compound) +1+2 Relative valencies factor (higher valence metal dissolves in lower valence metal) FCC Same crystal structure, solid solution Solid solutions Substitutional solid solutions Interstitial solid solutions

Chapter 4: Imperfections in Solids 4 Defect: Irregularity Point defects Vacant lattice site: vacancy Addition atom crowding into an interstitial site Self-interstitial: same type of atom interstitial

Chapter 4: Imperfections in Solids 5 No. of vacancies, N = no. of atomic sites Q V = Activation energy to form vacancy T = Absolute temperature, K k = Boltzmann constant = 1.38 x J/atom-K = 8.62 x ev/atom-K Gas constant, R = 8.31 J/mol-K = calories/mol-K

Chapter 4: Imperfections in Solids 6 Problem: Calculate the number of vacancies per cubic meter of copper at 1000°C. The activation energy for vacancy formation is 0.9 ev/atom; the atomic weight and density (at 1000°C), for copper are 63.5 gm/mol and 8.4 gm/cm 3 respectively.

Chapter 4: Imperfections in Solids 7 Problem: continue …. Solution : N = No. of atomic sites/ cubic meter of copper A Cu = Atomic weight of copper = 63.5 gm/mol ρ Cu = Density of copper = 8.4 gm/cm 3 N A = Avogadro’s no. = x atoms/mol N = N A ρ Cu /A Cu = 8.0 x atoms/m 3

Chapter 4: Imperfections in Solids 8 Problem: continue …. No. of vacancies at 1000 °C (1273 K) Q V = 0.9 ev/atom N = 8.0 x atom/m 3 k = 8.62 x ev/K T = 1273 K N V = 2.2 x vacancies/m 3

Chapter 4: Imperfections in Solids 9 Fill voids/ interstices For high APF, interstitial positions are small. So, atomic diameter of interstitial impurity must be very small (relative to host atoms) Max. allowable concentration: <10% Interstitial solid solutions

Chapter 4: Imperfections in Solids 10 Even very small impurities distort the lattice ---> lattice strains Carbon atom: interstitial in Fe max 2% Atomic radius of carbon, C: 0.71 Å Atomic radius of iron, Fe: 1.24 Å Interstitial solid solutions continue….

Chapter 4: Imperfections in Solids 11 Specification of composition A and B atoms A of weightatomic :A A of mass :m ) A m + A m ( A m =A % Atom mass / weight m,100× ) m+(m m =A Wt% A A B B A A A A B A A

Chapter 4: Imperfections in Solids 12 Dislocations- Line defects Edge dislocation Screw dislocation Edge dislocation: Extra half plane of atoms terminates within the crystal Dislocation line/extra half plane causes lattice to pull apart. Where the extra half plane is not there, the lattice is squeezed together

Chapter 4: Imperfections in Solids 13 Dislocations- Line defects Screw dislocation: Shear stress to distort the lattice Upper region is shifted one atomic distance relative to bottom Associated spiral or helical ramp Mixed dislocation: Neither edge perpendicular (  ) or screw ( )

Chapter 4: Imperfections in Solids 14 Burger’s vector Close-failure of a dislocation, b (extent of distortion). Dislocation and b are perpendicular in edge. They are parallel in screw. Extra half plane of atoms b: Burger’s vector  : Edge Dislocation

Chapter 4: Imperfections in Solids 15 Source: William Callister 7 th edition, chapter 4, page 91 Burger’s vector: Continue… Edge Dislocation Screw Dislocation b points in a closed-packed direction and is equal to atomic spacing(s)

Chapter 4: Imperfections in Solids 16 Grain boundaries Grain boundaries are regions of impurity concentration Light mismatch between grains: small angle grain boundary e.g., tilt boundary Grain within a grain: sub-grain; sub-grain boundary

Chapter 4: Imperfections in Solids 17 Twin Boundary: Across a grain: mirror-lattice symmetry Due to atomic displacement from applied shear forces. e.g., mechanical twins seen in BCC, HCP Due to annealing after deformation. e.g., annealing twins seen mostly in FCC

Chapter 4: Imperfections in Solids 18 Tilt Boundary Edge dislocation Series of edge dislocations Array of edge dislocations. Similar to small angle grain boundary Source: William Callister 7 th edition, chapter 4, page 94

Chapter 4: Imperfections in Solids 19 Both sides are mirror images of each other. Source: William Callister 7 th edition, chapter 4, page 94 Tilt Boundary continue….

Chapter 4: Imperfections in Solids 20 Pores Cracks Inclusions Other phases Volume defects

Chapter 4: Imperfections in Solids 21 Microscopy: Macro/Microstructure photomicrographs Optical/light microcopy: 2000x Transmission electron microscopy: 1,000,000X, very thin foil; fluorescent screen Scanning electron microscopy: 50,000X, good depth of field Scanning Probe: 3D topography 10 9 X possible Microscopy

Chapter 4: Imperfections in Solids 22 Grain size ASTM grain size number N = 2 n-1 n = grain size number N = Average No. of grain/square inch at 100X Larger grain size number  Smaller grains

Chapter 4: Imperfections in Solids 23 Summary Point defects Line defects Dislocation edge Screw Mixed Volume defects High angle Grain boundary Low angle Twin Microscopy Grain Size