Structure and dielectric properties of HfO 2 films prepared by sol-gel route Maria Zaharescu Institute of Physical Chemistry "Ilie Murgulescu" - Roumanian.

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HfO2 thin films prepared by sol-gel method
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Structure and dielectric properties of HfO 2 films prepared by sol-gel route Maria Zaharescu Institute of Physical Chemistry "Ilie Murgulescu" - Roumanian Academy 202 Splaiul Independentei, Bucharest, Romania

1. Introduction: - HfO 2 properties and applications 2. Experimental - Film preparation sol-gel - Film characterisation 3. Results and discussion - thermal annealing - laser annealing 4. Conclusions Outline

HfO 2 properties: - High density (9.86 g/cm 2 ) - High melting point ( C) - High thermal and chemical stability - Large heat of formation (271 Kcal/mol ) - Large band gap (5.86 eV) - High refractive index (~ 2.00) - High dielectric constant (k ≈ 15-25) - Stable bulk structures - monoclinic: symmetry, P121/c1, SGP- (14) (a = nm, b= nm, c= nm,  = 99,2) - orthorhombic: symmetry, Pbca, SGP- ( 61) (a = nm, b= nm, c= nm ) - High temperature structures (1700°C) tetragonal ( a = nm, c = nm), symmetry P42/nmc (2600°C) cubic (a = 0.511), symmetry F3m3 Monoclinic [010] HfO 2 Orthorhombic [001] HfO 2 Introduction

Applications: in micro and optoelectronics, - high k material (as replacing SiO 2 ) in electronic and optoelectronic devices - optical coatings when high optical damage thresholds are needed - waveguide fabrication as material for nanofiltration membranes films with high pencil hardness (over 9H) and hydophobicity protection material against oxidation/corrosion Introdution

HfO 2 thin films can be prepared by various methods: - Atomic Layer Deposition, - Pulsed Laser Deposition, - Chemical Vapor Deposition, - Radio Frequency Sputtering - Plasma oxidation of Hf film All mentioned techniques require high temperature treatments that induce a deterioration of the device performance and reliability The sol–gel process offers an alternative method to avoid the deterioration of film properties by high thermal treatment Introdution

The reagents: - Hf-ethoxide Hf(OC 2 H 5 ) 4 (Alfa Aesar), Hf-pentadionate and Hf-chloride, as HfO 2 source, - acetyl acetone AcAc (Fluka) as chelating agent and - absolute alcohol p.a. (Merck) as solvent. - Molar ratio: Hf(OC 2 H 5 ) 4 /Acac = 1 Solution preparation: mixing of the reagents in N 2 atmosphere at C for two hours when staring with Hf-ethoxide, and ambient atmosphere for the other precursors. Experimental

Film deposition: - substrates: [100] silicon wafer - deposition method: dip-coating, 5 cm/min Film drying and thermal crystallization: - drying 10 min at 100  C - precursor species elimination and densification 30 min at 400, 600, 800°C Laser annealing: - XeCl Lambda Physics excimer laser (l = 308 nm, tFWHM = 10 ns) using a homogenised laser beam spot with an area of about 1cm 2, with: - fluences between 30 and 120 mJ/cm 2 and - different number of pulses between 100 and

Experimental Films characterisation High resolution TEM imaging using a Topcon 002 B electron microscope Conventional TEM imaging and SAED pattern using a Jeol 200CX microscope TEM specimen preparation by two methods : Cross section (XTEM) preparation using the conventional methods with mechanical and ion-milling (Gatan 691A- PIPS) AFM images RBS measurements Dielectric constant measuremenst

Plan view conventional TEM image and SAED pattern from a HfO 2 sol-gel film dried at 100 o C and supplementary annealed at 150 o C for 30 minutes, to increase the stability in the microscope (Hf-etoxide precursor) Thermal annealing

- Very low RMS roughness: 0.23 nm ► AFM images of the dip coated films – 1 layer dried at 100°C Thermal annealing

Plan view conventional TEM image and SAED pattern from a HfO 2 double layer annealed at 400 o C The structure is still amorphous with a beginning of crystallization Thermal annealing

RBS spectra of the dried and thermally treated film at C No traces of precursors are revealed by the RBS spectra after the 400 o C annealing of the HfO2 films

XTEM images of an amorphous sol-gel HfO 2 mono-layer film after annealing at 400°C.. Thermal annealing

Plan view HRTEM image of a double layer film annealed at 600 o C Thermal annealing

HRTEM plan view of HfO 2 mono-layer film annealed at 600°C Thermal annealing XTEM observation of a monolayer HfO 2 sol-gel film obtained by thermal annealing at 600 o C

- Very low RMS roughness: 0.32 nm ► AFM images of the dip coated films – 1 layer thermally treated at 600°C Thermal annealing

Thermal annealing Cross section high resolution XTEM images from a monolayer film annealed at 600°C (left) and 800 o C (right)

TEM image of a mono-layer film annealed at 450 o C, obtained from Hf-ethoxide precursor. TEM image of a monolayer film annealed at C, obtained from Hf-chloride precursor TEM image of a mono-layer film annealed at 600 o C, obtained from Hf-ethoxide precursor. TEM image of a mono-layer film annealed at 600 o C, obtained from Hf-pentadionate precursor _____________________________________________________________________________________ M.Zaharescu, V.S. Teodorescu, M.Gartner, M.G.Blanchin, A.Barau, M.Anastasescu, J. Non-Cryst. Solids, 354, (2008) Thermal annealing

Low resolution XTEM image of a 5 ayers HfO 2 film, taken in a thick area of the XTEM specimen

Thermal annealing Typical C-V curve for a MOS structure including a four layer HfO 2 film annealed at 600 o C k = 25 M.G.Blanchin, B.Canut, Y.Lambert, V.S.Teodorescu, A.Barău, M.Zaharescu, J.Sol-Gel Sci.Technol., 47, , (2008)

Low operation voltage Almost no hysteresis Very limited gate leakage Good mobility __________________________________________________________________________________ J.Tardy, M.Erouel, A.L.Deman, A.Gagnaire, V.S.Teodorescu, M.G.Blanchin, B.Canut, A.Barau, M.Zaharescu, Micoelectronics and Reliability, 47, 372 (2007) Electric characteristics of Organic Field Effect Transistor based on pentacene prepared with HfO 2 high k gate dielectric Thermal annealing

The as-deposited HfO 2 film is amorphous and start to crystallize at C, leading to a very homogeneous morphology and very low roughness. Thermal annealing at 600°C leads to crystallization of the HfO 2 sol-gel film in monoclinic phase An intermediate SiO 2 layer of about 5 nm was formed assigned to Si wafer oxidation, that increases by subsequent thermal treatment Dens films could be obtained by multi-layer deposition. Such films present a dielectric constant close to that of the bulk material.  Pulse laser annealing can provide a method to limit the growth of the SiO 2 layer due to the limited time of oxygen diffusion from the film surface to the substrate interface Conclusion – thermal annealing

XeCl Lambda Physics excimer laser (l = 308 nm, tFWHM = 10 ns) using a homogenised laser beam spot with an area of about 1cm 2, with: - fluences between 30 and 120 mJ/cm2 and - different number of pulses between 100 and laser 150°C annealed sol-gel HfO 2 film Si[100] substrate Laser beam homogenizer Laser irradiation set-up Laser annealing

Schematic mechanism of the laser heating and densification of the HfO 2 sol-gel films Laser absorption length, about 30 nm (in Si) Dry gel (amorphous with non- homogeneous density) Si substrate Heated Si substrate Laser beam densified oxide film (porous!) 40 nm Laser annealing

XTEM images of a HfO 2 sol-gel double layer film (a) and detail of the interface with the silicon substrate (b). The film was laser irradiated with 100 laser pulses at the fluence of 30 mJ/cm 2. The thickness of the SiO 2 interface layer is about 4 nm

Laser annealing XTEM image of a HfO 2 film after laser irradiation with 100 pulses at the fluence of 65 mJ/cm 2. The HfO 2 thickness is about 24 nm and the SiO 2 interface layer is about 4 nm

Laser annealing XTEM structure of the HfO 2 film irradiated with pulses at 80 mJ/cm 2 fluence. The structure remains amorphous and the SiO 2 interface layer is about 6 nm (left) Details showing the Si(Hf)O 2 amorphous structure formation (right)

Laser annealing Blister nucleation at the fluence of 100 mJ/cm 2, after 5000 pulses. The SiO 2 layer arrives at the thickness of about 8 nm.

Laser annealing C-V curves recorded for dielectric measurements in the case of HfO 2 film sample irradiated with 80nJ/cm 2 and laser pulses.

Laser annealing C-V curves records for dielectric measurements realized at 100Hz and table with calculated dielectric constant values

- Crystallization of amorphous sol-gel HfO 2 thin films has been studied both by thermal annealing and by pulsed laser annealing (at fluences between 30 and 120 mJ/ cm 2 and different number of pulses between 100and fluence) - By thermal annealing monoclinic phase is obtained at C - By laser annealing at low fluences (under 80 mJ/cm 2 ) the films did not crystallize and at high fluences (120 mJ/ cm 2 ) the film crystallize but blistering of the film occur - In both cases the formation of the intermediate SiO 2 film could not be avoided - High dielectric constant values could be obtained in both cases (~ 25). The value is strongly influenced by the structure and morphology of the film. - Thermal treated films present a better structure and morphology for further applications Conclusions

Dr.Mariuca Gartner Dr.V.S.Teodorescu – IFTM Dr.Mihai Anastasescu Dr.Alexandra Barau Dr.M-G Blanchin – Univ,Lyon 1 Dr.J.Tardy – Ecole Central de Lyon Partially the work was supported by the France-Romanian inter-guvernamental collaboration with Département de Physique des Matériaux/CNRS, Université Claude Bernard LYON I, France. Acknowledgements

Thank you for your attention !