OCT.2007 P. 1 Formosa Microsemi Co., LTD Company Profile

OCT.2007 P. 2 Company Profile * Company Overview * Company Policy * Company Organization * Quality Certificate * Product Construct * Patent Certificate * Revenue Growth * Factory Equipment * Product Capacity * Package List & New Package Development Plan * Major Customers

OCT.2007 P. 3 1Established JUL President Mr.Ben W.P.Huang 3Capital USD 8.5M 4Employees 450 5Address 5F,NO.208,Sec.3,Chung Yang Road,Tucheng,Taipei Hsien,Taiwan Company Overview

OCT.2007 P. 4 Main Products Schottky Barrier Diode Switching Diode Zener Diode General Purpose Rectifier Fast Recovery Rectifier Super Fast Rectifier

OCT.2007 P. 5 Taiwan Factory Located : Taipei, Taiwan

OCT.2007 P. 6 MainLand China Factory Located : HangZhou

OCT.2007 P. 7 Located : HangZhou MainLand China Factory

OCT.2007 P. 8 Located : SuZhou MainLand China Factory

OCT.2007 P. 9 Innovation Quality Service Company Policy

OCT.2007 P. 10 Company Organization Taiwan FMS Board Director General Manager Mr. Ben Huang Taiwan Factory Mr. Ben Huang Rectifiers Diode Small Signal Bridge Others SuZhou Factory Mr. David Xu Switching Diode Diac Diode Others China Local Sales Company HangZhou Formosa Mr. Stephen Huang ShenZhen office Mr.Jet Chang Taiwan Local Sales Company Formosa Technology HangZhou Factory Mr. Yang QiJI Wafer FAB Rectifiers

OCT.2007 P. 11 ISO 9001:2000 ISO 9001 ISO14001 Quality Certificate

OCT.2007 P. 12 Formosa MS - SMA Traditional - SMA 1. The contact pin picks trimming, the curved formation, in the process the material easy indirect damage, the quality not to be easier to control. 2. The copper lead frame only has 0.2mm thickness. 3. The outlook big, thickness is high, the user must consider gives the bigger spatial design, is more uneconomical. 4. Traditional outlook. 5. The soldering contact face picks the machinery formation, smoothness is worse. 6. Process on the traditional control, the quantity produces slowly. Product Construct 1. Light 2. Thin 3. Short 4. Small 5. The quality is good (High quality) 6. The patent system process, has competitiveness

OCT.2007 P. 13 Taiwan Patent No Taiwan Patent No Taiwan Patent No Patent Certificate 表面黏著型整流二極 體之製造方法 表面黏著型排列二極 體之製造方法 無引線型片狀橋式整 流器之構造

OCT.2007 P. 14 Taiwan Patent No Taiwan Patent No Taiwan Patent No 表面黏著型整流二極體之結構改良 雙金屬與陶瓷組成之功率半導體構造及其製造方法 功率半導體之散熱構造 Patent Certificate

OCT.2007 P. 15 Japan Patent No U.S.A. Patent No.6,085,396 U.S.A. Patent No.6,334,971 B1 功率半導體之冷卻裝置 整流二極體之製造方法 表面黏著型排列二極體之製造方法 Patent Certificate

OCT.2007 P. 16 China Patent No.ZL China Patent No. ZL China Patent No. ZL 表面黏著型整流二極體之製造方法表面黏著型排列二極體之製造方法 功率半導體之散熱構造 Patent Certificate

OCT.2007 P. 17 Forecast Revenue Growth Unit : Million NTD

OCT.2007 P. 18 Lightning Strike TesterThermal Resistance Tester Equipment for Hi-Reliability

OCT.2007 P. 19 H.T.R.B. TesterOP.LIFE Tester Equipment for Hi-Reliability

OCT.2007 P. 20 VF / PIV / IR / Trr Test EquipmentTemperature Cycle Equipment Equipment for Hi-Reliability

OCT.2007 P. 21 Delta VF & Forward Surge TesterSolder Ability Equipment Equipment for Hi-Reliability

OCT.2007 P. 22 Axial SMD Diffusion Wafer Product Capacity

OCT.2007 P. 23 SMD Package List & New Package Development Plan

OCT.2007 P. 24 Major Customers

OCT.2007 P. 25 Major Customers

OCT.2007 P. 26 Forever innovation create a Famous diode in the world to build First class enterprise Thank You Company Vision 永續經營 持續創新 建立二極體知名品牌 創造卓越的企業