Instrumentation Surface Mount Technology for Process Analytic Sampling Systems Steve Doe, Parker Hannifin Corporation

Surface Mount Technology for Sample Systems: Update 2002 “Surface Mount” Definition: Component’s control function is detachable from its flowpath function Providing increased servicability and flexibility while reducing overall space requirements

Surface Mount Technology for Sample Systems: Update 2002 Surface Mount System Options 1) Parker Integrated Conditioning System (PICS) w/ SP76 compliant 1½” and 2¼” elastomeric seal interfaces & instrumentation components 2) 1½” compliant interface w/ metallic seals and semiconductor grade & instrumentation components (“old” ultra-high purity “standard”) 3) 1 1 / 8 ” interface w/ metallic seals and semiconductor grade & instrumentation components (emerging ultra- high purity “standard”) 4) R-Max™ stream switching interface (proprietary) SampleSampleSampleSample ConditioningConditioningConditioningConditioning

SP-76 Interface Standard (Elastomeric) n Roots in semiconductor industry n Geometrically defines device features to match substrate n Everything above the interface is device supplier specific n Everything below the interface is substrate supplier specific Surface Mount Technology for Sample Systems: Update ½” Interface 2¼” Interface

Keys to SP-76 Interface Standard n Specifies 1/8” ID flow channels n Liquid service? n System commonly uses diaphragm valves in lieu of ball valves Surface Mount Technology for Sample Systems: Update 2002 n Geometry specifications do not allow for captured o-rings; housed in counterbore only n Ideal world would incorporate centerline spacing to support captured o-ring design

PICS System n Designed w/ 5 flow channels specifically for the majority of sample conditioning systems n Utilizes 1½” SP76 (o-ring) compliant elastomeric interface n Incorporates larger 2¼” footprint to utilize existing instrumentation devices; SP76 (o-ring) compliant n Substrate heating capability available w/ minimal development Surface Mount Technology for Sample Systems: Update 2002

PICS System n Substrate assembled via bolts with tapped holes in head n Bolt interface incorporates dowel pin feature for alignment and added rigidity n O-ring connections between substrate blocks Surface Mount Technology for Sample Systems: Update 2002

1½” Interface 1½” Interface 2¼” Interface Surface Mount Technology for Sample Systems: Update 2002 Std 3 channel access 5 channel access 3 or 5 channel access

Surface Mount Technology for Sample Systems: Update 2002

1½” UHP System n Designed for delivery of ultra high purity gasses used in semiconductor applications n Recommended for detection thresholds in the PPB range n Utilizes metallic “C” or “W” seals at interfaces; can be adapted for o-rings n Field connections are normally welded faceseal type fittings; however, compression can be instead Surface Mount Technology for Sample Systems: Update 2002

1 1 / 8 ” UHP System n Same features as 1½” system, only smaller n Emerging as de-facto standard based on desires of leading semiconductor equipment OEM n Cartridge heaters available n Currently in full production Surface Mount Technology for Sample Systems: Update 2002

Block Assembly & Manifolding Surface Mount Technology for Sample Systems: Update 2002

R-Max Stream Select System n SP-76 geometrically non-compliant n SP-76 intent compliant Surface Mount Technology for Sample Systems: Update 2002

NeSSI & R-Max Marriage n SP-76 geometrically compliant 1½” blocks for sample conditioning n R-Max for stream switching n Compression fitting interface n Lower cost than same functionality with all-SP76 block system Surface Mount Technology for Sample Systems: Update 2002