NFC Test in Manufacturing Pi Huang Presentation Title NFC Test in Manufacturing Pi Huang
Agenda NFC Market NFC overview NFC manufacturing tests IQnfc introduction
NFC Overview Near field communication (NFC) is a set of short-range wireless communication technologies NFC offers safe yet simple communication between electronic devices It has gained traction in the market and is poised to build global scale Dramatic increase of NFC enabled devices in the last few years Originally slow to gain traction due to fragmented standards and lack of applications It’s evolving from trial to commercial status around the world
Market Overview Most NFC deployment today are in smartphones Smartphones accounted for 80% of NFC devices shipped in 2013 1in 3 smartphones now comes with NFC (Strategy Analytics, Aug 13) IHS Technology forecast 1.2 bn phones to come with NFC in 2018, with CAGR 40% Standalone NFC chips dominated 9 in 10 NFC enabled smartphones use standalone NFC chips in 2013 Combo chips to gain more market share in 2014
Matching circuit and antenna NFC Operating Modes Card Emulation Mode Transport & Ticketing Access Control Mobile Payment Applications Phone (Passive acting as a Tag), Reader (Active) OS CPU Load Modulation RF 13.56MHz RF 13.56MHz Load Modulation Reader Mode Smart Posters ID Check Mobile Advertising Phone (Active), Tag (Passive) SIM or SE NFC Chip Matching circuit and antenna RF 13.56MHz Peer to Peer Mode Data Exchange P2P Payment Phone (Active), Device (Active)
MFG Challenges for NFC NFC operates differently compared to other wireless technologies Near field induction vs. far field Relies on sharp frequency response to provide efficient power transfer Frequency response is dependent on the resonant circuit and coil Resonant circuits are sensitive to variation High Q Response f S21 ferror Antenna Radio Baseband Matching Antenna is getting smaller Small antenna has much smaller tolerance for the tuning circuit component variation 30x30mm 17x30mm 10x10mm
What Can Happen in MFG? * Production Issues Wrong value components Wrong tolerance components Out of spec components * Nearly 50% reduction in transmitted energy Performance Impact Higher power consumption Reduced operating range Poor User Experience Financial transactions fail Delays/failure on mass transit entry etc. 500 kHz Shift (on a 1 MHz BW Signal) *: 5% tolerance values
LitePoint IQnfc Test Solution Optimized NFC Test System Fast and simple testing for manufacturing — one-click operation to characterize Device Under Test Detailed RF parametric measurements for lab — intuitive GUI for waveform analysis Universal Test Head for both Polling and Listening device emulation Compact and rugged design Good test coverage Covers all key NFC standards Frequency response measurement Flexible Multi-level software APIs for test flow customization IQnfc can be used with LitePoint or customer designed test heads High test speed – 1 resonant sweep and one standard capture recommended. 3 Seconds
IQnfc Test Configuration DUT IQnfc Test Instrument IQnfc Test Head Test fixture High test speed – 1 resonant sweep and one standard capture recommended. 3 Seconds
Smartphone NFC Example Application Processor NFC Die C C L R EEPROM R OR Multi-standard chip Resonant circuit Smaller coil OR Secure Element
Recommended Tests for Manufacturing Purpose of manufacturing tests are to ensure production and component quality Manufacturing defects and process variances Component defects and tolerance problems Assembly errors and defects For NFC manufacturing, we recommend the following tests Resonance sweep: ensure all of the components in the transceiver RF path are correctly installed, within tolerance, and no assembly defects exist A basic functional test: ensure the DUT can both receive and transmit correctly. This checks that the IC has not been damaged during assembly and its pins are correctly soldered
Standard and Operation Mode Coverage Presentation Title Test mode (NFC Forum) ISO Standard Initiator Target NFC A 14443A (EMVco) √ NFC B 14443B (EMVco) NFC F 18092 (FeliCa) NFC P2P 18092 peer to peer EMVco is supported in NFC-A and B
NFC Conformance Test NFC Forum EMVCo Poller Coil Generate Field Sense response from DUT Listener Coil Sense Poll field strength Respond to initiator Operation Volume
IQnfc Software User friendly GUI for detailed RF parametric results Similar look and feel to IQxel/IQxel-M/IQxstream Frequency sweep mode Initiator mode Target mode
IQnfc Software Automated Test Program for manufacturing Integrated Test Plan Editor Single-click operation Chipset agnostic due to signaling operation Programming interfaces: SCPI and IQmeasure (C based)
Golden Unit vs. IQnfc in Production Functional test 1 standard and mode All key standards, both initiator and target modes RF parametric test N/A Frequency response Modulation quality Other RF parametric tests Speed Fast Very fast Cost Very low Low; <0.4 cent (based on 3 yr depreciation) Summary Manual process; Detect gross failure only; Can not screen marginal units; Can not analyze failure; Automated turnkey solution; Detect gross and marginal failure; Provide quantitative failure analysis; High test speed – 1 resonant sweep and one standard capture recommended. 3 Seconds
Summary NFC is to become a common technology in smart phones Golden DUT approach in production not enough to ensure product quality IQnfc focuses on NFC physical layer characterization Fast and simple testing for manufacturing Easy to setup and simple to operate Wide array of physical layer measurements for labs Detailed RF parametric analysis through intuitive GUI Functional verification on all key NFC standards through reduced signaling Verify system level operation while minimizing test time Rugged and compact design