Lynnfield: Desktop Processor Lynnfield Processor 1 45nm, Hi-K Process Key Features: Based on New Nehalem Microarchitecture Intel® Turbo Boost Technology Intel® Hyper-Threading technology (4 Cores, 8 threads) -> “i7 only” 8MB of Intel® Smart Cache Integrated Memory Controller (IMC) – 2ch DDR3 Discrete graphics support – 1x16 or 2x8 Lynnfield Processor Discrete Graphics DMI Socket: LGA1156 Socket (compatible with Clarkdale) Power: 95W 2009A & 2009B FMB’s Intel® 5 series Chipset Platform Compatibility: Intel® 5 series Chipset TECHNICAL SPECIFICATIONS Processor Series Clock Speed (GHz) Cores/Threads Cache Memory Speed Support TDP i7-870 2.93 4/8 8 MB DDR3-1333 95 W i7-860 2.80 i5-750 2.66 4/4 1: Not all features are available on every processor line items Intel® FDI: Intel Flexible Display Interfacec 1

2009년 3분기 인텔® 코어™ i7&i5로의 전환 (린필드) PCIe* Graphics GFX Intel® 5 series Chipset3 Processor ME DDR3 IMC DISPLAY Display DMI Intel® Flexible Display Interface (Intel® FDI) I/O 2009년 3분기 인텔® 코어™ i7&i5로의 전환 (린필드) What’s New: 향상된 터보 부스트기술 하이퍼스래딩기술(only i7) 스마트캐시 향상된 Intel®Smart Cache 저비용 플렛폼 저전력 CPUs (95W) 소켓 1156 2 채널 DDR3 메모리 Intel® Turbo Boost Technology1 gives maximum performance to applications that need it most Intel® Hyper-Threading Technology2 optimizes performance on highly threaded applications Intel® P55 Express Chipset 2 2

Revolutionary, Intelligent, Incredible Performance 3-minute pitch Intel® Core™i7 & i5 ( Lynnfield ) Key Message & Features Key Message: Revolutionary, Intelligent, Incredible Performance Key Features NEHALEM ARCHITECTURE Integrated Memory Controller DDR3 1333/1066 Support Up to 8M Shared Smart Cache INTELLIGENT PERFORMANCE WITH INTEL TURBO BOOST TECHNOLOGY IMPROVED MULTITHREADING WITH INTEL® HYPER-THREADING TECHNOLOGY(i7 only) Dynamically Increases Frequency Potential instruction threads per processor 2 1 3 Processor speed can increase when running below temperature/power limits Processor delivers more performance in every day usage applications Revolutionary Architecture and Performance leadership with 45nm Nehalem Processor 3

Nehalem Desktop Processor Comparison Feature Bloomfield(45n) i7 Lynnfield(45n) i7 Lynnfield(45n) i5 Processing Threads [via Simultaneous Multi-Threading capability (SMT)] 8 4 CPU Cores Shared Cache 8MB Integrated Memory Controller Channels 3 ch. DDR3 2 ch. DDR3 Discrete Graphics Support (PCIe Gen2) 2x16 or 4x8, 1x4 (via Tylersburg IOH) 1x16 or 2x8 Integrated GPU No Processor Package TDP 130W 95W Socket LGA 1366 LGA 1156 First Samples / Production Q4 ’07 / Q4 ‘08 2H ’08 / 1H ‘09 Platform Support Tylersburg & ICH10 Ibexpeak Common Features Turbo Mode, 7 additional SSE4 instructions, VRD11.1, 45nm process Nehalem Processor Leadership with Integration 4

향상된 싱글 코어 주파수로 강력한 터보 부스트 기술 인텔®코어™ i5(린필드) 프로세서의 특징 향상된 싱글 코어 주파수로 강력한 터보 부스트 기술 기본 코어 주파수 2.93 GHz (turbo up to 3.6 GHz) 8M, 4 Cores 8 threads 하이퍼 스래딩 인텔® 스마트 캐시

메인 스트림의 인텔® 터보 부스트 기술 최적화된 성능향상과 에너지 효율 Previous Generation without Turbo Lynnfield1 with Turbo Single-Threaded Workload < TDP Near zero power for inactive cores Lightly-Threaded Workload < TDP Highly Threaded Workload < TDP Not for End-User Messaging 1 Example based on 2.93GHz Lynnfield 6

Nehalem Architecture (Intel®Core™ i7) Intel® Smart Cache

Nehalem Architecture (Intel®Core™ i7) Simultaneous Multi-Threading (SMT)

Comparison of Desktop Sockets LGA 775 Kentsfield/Conroe LGA 1156 (Lynnfield/Havendale Processors) LGA 1366 (Bloomfield Processors) Contacts: 775 Package Size: 37.5 mm square Contacts: 1156 Package Size 37.5 mm square Independent Load Mechanism (ILM) Contacts: 1366 Package Size 42.5 x 45mm Independent Load Mechanism (ILM) LGA 775 LGA 1156 LGA 1366 Pin A1 Pin A1